JP2002313765A - Brush cleaning device and control method therefor - Google Patents
Brush cleaning device and control method thereforInfo
- Publication number
- JP2002313765A JP2002313765A JP2001117716A JP2001117716A JP2002313765A JP 2002313765 A JP2002313765 A JP 2002313765A JP 2001117716 A JP2001117716 A JP 2001117716A JP 2001117716 A JP2001117716 A JP 2001117716A JP 2002313765 A JP2002313765 A JP 2002313765A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- cleaning
- polished
- pressing force
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、洗浄ブラシを用い
て半導体ウェーハ等の被研磨部材の研磨面を洗浄するブ
ラシ洗浄装置及びその制御方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brush cleaning apparatus for cleaning a polished surface of a member to be polished such as a semiconductor wafer using a cleaning brush, and a control method therefor.
【０００２】[0002]
【従来の技術】従来より、例えば半導体ウェーハのＣＭ
Ｐ（化学機械研磨）工程において、ＣＭＰ研磨後の被研
磨面に残存したスラリ等をＣＭＰ洗浄によって除去する
場合、図３に示すような洗浄装置を用いて行なう。この
洗浄装置は、いわゆるペンブラシと呼ばれる洗浄ブラシ
を半導体ウェーハの被研磨面に押圧させて半導体ウェー
ハを回転し、洗浄ブラシによってスラリ等のダストを除
去するものである。2. Description of the Related Art Conventionally, for example, CM of a semiconductor wafer
In the P (chemical mechanical polishing) process, when the slurry or the like remaining on the surface to be polished after the CMP polishing is removed by the CMP cleaning, it is performed using a cleaning apparatus as shown in FIG. In this cleaning apparatus, a cleaning brush called a pen brush is pressed against a surface to be polished of a semiconductor wafer to rotate the semiconductor wafer, and dust such as slurry is removed by the cleaning brush.
【０００３】図３において、半導体ウェーハ１０は、洗
浄部２０内のターンテーブル２２にセットされ、洗浄作
業中はターンテーブル２２によって回転駆動される。一
方、洗浄ブラシ３０は洗浄装置４０のブラシ駆動部（ア
ームユニット）４２に保持されており、半導体ウェーハ
１０の上方からウェーハ面に垂下する状態で配置されて
いる。ブラシ駆動部４２の内部には、揺動機構（図示せ
ず）が配置されており、洗浄作業中は洗浄ブラシ３０を
上下方向に揺動し、洗浄効果を上げるような仕組みとな
っている。なお、この揺動制御における周期等は、パル
ス設定によって実行される。In FIG. 3, a semiconductor wafer 10 is set on a turntable 22 in a cleaning section 20, and is rotated by the turntable 22 during a cleaning operation. On the other hand, the cleaning brush 30 is held by a brush driving unit (arm unit) 42 of the cleaning device 40 and is arranged so as to hang down from above the semiconductor wafer 10 to the wafer surface. An oscillating mechanism (not shown) is arranged inside the brush driving unit 42, and is configured to oscillate the cleaning brush 30 in a vertical direction during the cleaning operation to enhance the cleaning effect. The cycle and the like in the swing control are executed by pulse setting.
【０００４】また、洗浄ブラシ３０の半導体ウェーハ１
０に対する接触圧は、主に洗浄ブラシ３０の交換時に、
ブラシ駆動部４２に設けられた押し込み距離調整部４４
によって設定される。この押し込み距離調整部４４は、
洗浄ブラシ３０の高さ位置を作業員の人為的な作業によ
って予め初期設定することにより、洗浄作業中の洗浄ブ
ラシ３０の半導体ウェーハ１０に対する接触圧を調整す
るものである。Further, the semiconductor wafer 1 of the cleaning brush 30
The contact pressure against 0 is mainly determined when the cleaning brush 30 is replaced.
Push distance adjusting unit 44 provided in brush driving unit 42
Is set by This pushing distance adjusting unit 44
The contact pressure of the cleaning brush 30 with respect to the semiconductor wafer 10 during the cleaning operation is adjusted by initially setting the height position of the cleaning brush 30 by an operator's manual operation.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述の
ような従来の洗浄装置では、洗浄ブラシ３０の位置を予
め初期設定によって調整することにより、洗浄ブラシ３
０の半導体ウェーハ１０に対する押圧力を設定し、洗浄
作業中は洗浄ブラシ３０の自重によって洗浄を行なうも
のであったため、洗浄作業中に押圧力が微妙に変動した
場合には、その変動に何ら対応することができない。こ
のため洗浄作業中における洗浄ブラシ３０の押圧力の変
動によって適正な洗浄が行なえず、洗浄度が悪化してし
まうという問題があった。また、上述のように押し込み
距離調整部４４によって人為的に調整を行なう構成で
は、作業者の熟練度等によって調整状態にばらつきが生
じるという問題があった。この結果、適正な洗浄を行な
うことができず、例えばＣＭＰにおけるスクラッチ・ダ
ストレベルが変化するといった不具合が生じる。However, in the above-described conventional cleaning apparatus, the position of the cleaning brush 30 is adjusted in advance by initial setting, so that the cleaning brush 3 can be used.
Since the pressing force on the semiconductor wafer 10 is set to 0 and the cleaning is performed by the weight of the cleaning brush 30 during the cleaning operation, if the pressing force fluctuates slightly during the cleaning operation, no action is taken against the fluctuation. Can not do it. For this reason, there has been a problem that proper cleaning cannot be performed due to fluctuations in the pressing force of the cleaning brush 30 during the cleaning operation, and the degree of cleaning deteriorates. Further, in the configuration in which the adjustment is performed artificially by the push-in distance adjustment unit 44 as described above, there is a problem that the adjustment state varies depending on the skill of the operator or the like. As a result, proper cleaning cannot be performed, and a problem such as a change in the scratch / dust level in CMP occurs.
【０００６】そこで本発明の目的は、ブラシ圧を適正に
保持して良好な洗浄状態を得ることが可能なブラシ洗浄
装置及びその制御方法を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a brush cleaning apparatus and a control method thereof that can obtain a good cleaning state while appropriately maintaining the brush pressure.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、洗浄ブラシを用いて被研磨部材の研磨面
を洗浄するブラシ洗浄装置において、前記洗浄ブラシを
駆動して前記被研磨部材の被研磨面に押圧接触させるブ
ラシ駆動手段と、前記洗浄ブラシによる洗浄中に前記洗
浄ブラシの被研磨部材に対する押圧力を検出する押圧力
検出手段と、前記押圧力検出手段により検出された押圧
力に基づいて、前記洗浄ブラシの押圧力が最適になるよ
うに前記ブラシ駆動手段を制御する制御手段とを具備し
たことを特徴とする。また本発明は、洗浄ブラシを用い
て被研磨部材の研磨面を洗浄するブラシ洗浄装置の制御
方法において、前記洗浄ブラシによる洗浄中に前記洗浄
ブラシの被研磨部材に対する押圧力を検出し、その検出
された押圧力に基づいて、前記洗浄ブラシの押圧力が最
適になるように前記洗浄ブラシの押圧力を制御するよう
にしたことを特徴とする。According to the present invention, there is provided a brush cleaning apparatus for cleaning a polished surface of a member to be polished by using a cleaning brush, wherein the cleaning brush is driven to drive the member to be polished. A brush driving means for pressing and contacting the surface to be polished, a pressing force detecting means for detecting a pressing force of the cleaning brush against the member to be polished during cleaning by the cleaning brush, and a pressing force detected by the pressing force detecting means And control means for controlling the brush driving means such that the pressing force of the cleaning brush is optimized on the basis of the above. The present invention also relates to a control method of a brush cleaning apparatus for cleaning a polished surface of a member to be polished by using a cleaning brush, wherein a pressing force of the cleaning brush on the member to be polished is detected during cleaning by the cleaning brush, and the detection is performed. The pressing force of the cleaning brush is controlled such that the pressing force of the cleaning brush is optimized on the basis of the pressed pressure.
【０００８】本発明のブラシ洗浄装置では、洗浄ブラシ
による洗浄中に押圧力検出手段によって洗浄ブラシの被
研磨部材に対する押圧力を検出し、その検出された押圧
力に基づいて、洗浄ブラシの押圧力が最適になるように
洗浄ブラシの押圧力を制御することから、自動制御によ
る安定したブラシ圧によって適正な洗浄を行なうことが
できる。したがって、人為的な作業による洗浄結果のば
らつきも解消でき、適正なブラシ圧による良好な洗浄結
果を得ることができる。In the brush cleaning apparatus of the present invention, the pressing force of the cleaning brush is detected by the pressing force detecting means during the cleaning by the cleaning brush, and the pressing force of the cleaning brush is determined based on the detected pressing force. Since the pressing force of the cleaning brush is controlled so as to be optimal, appropriate cleaning can be performed with a stable brush pressure by automatic control. Therefore, the variation of the cleaning result due to the manual operation can be eliminated, and a good cleaning result with an appropriate brush pressure can be obtained.
【０００９】また本発明のブラシ洗浄装置の制御方法で
も同様に、洗浄ブラシによる洗浄中に洗浄ブラシの被研
磨部材に対する押圧力を検出し、その検出された押圧力
に基づいて、洗浄ブラシの押圧力が最適になるように洗
浄ブラシの押圧力を制御することから、自動制御による
安定したブラシ圧によって適正な洗浄を行なうことがで
きる。したがって、人為的な作業による洗浄結果のばら
つきも解消でき、適正なブラシ圧による良好な洗浄結果
を得ることができる。Similarly, in the control method of the brush cleaning apparatus of the present invention, the pressing force of the cleaning brush on the member to be polished is detected during cleaning by the cleaning brush, and the pressing force of the cleaning brush is determined based on the detected pressing force. Since the pressing force of the cleaning brush is controlled so that the pressure is optimized, appropriate cleaning can be performed with a stable brush pressure by automatic control. Therefore, the variation of the cleaning result due to the manual operation can be eliminated, and a good cleaning result with an appropriate brush pressure can be obtained.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して詳細に説明する。なお、以下に説明す
る実施の形態は、本発明の好適な具体例であり、技術的
に好ましい種々の限定が付されているが、本発明の範囲
は、以下の説明において、特に本発明を限定する旨の記
載がない限り、これらの態様に限定されないものとす
る。図１は、本発明の実施の形態によるブラシ洗浄装置
の構成例を示す説明図である。このブラシ洗浄装置は、
例えば半導体ウェーハのＣＭＰ（化学機械研磨）工程に
おいて、ＣＭＰ研磨後の被研磨面に残存したスラリ等の
ダストをＣＭＰ洗浄によって除去するための洗浄装置と
して構成されるものである。Embodiments of the present invention will be described below in detail with reference to the drawings. The embodiments described below are preferred specific examples of the present invention, and various technically preferable limitations are added. However, the scope of the present invention is not limited to the embodiments described below. The embodiments are not limited to these embodiments unless otherwise specified. FIG. 1 is an explanatory diagram illustrating a configuration example of a brush cleaning device according to an embodiment of the present invention. This brush cleaning device
For example, in a CMP (chemical mechanical polishing) process of a semiconductor wafer, the cleaning device is configured as a cleaning device for removing dust such as slurry remaining on the surface to be polished after the CMP by CMP cleaning.
【００１１】図１において、半導体ウェーハ１１０は、
洗浄部１２０内のターンテーブル１２２にセットされ、
洗浄作業中にはターンテーブル１２２によって回転駆動
される。一方、洗浄ブラシ１３０は洗浄装置１４０のブ
ラシ駆動部（アームユニット）１４２に保持されてお
り、半導体ウェーハ１１０の上方からウェーハ面に垂下
する状態で配置されている。そして、この洗浄ブラシ１
３０には、圧力センサ１３２が組み込まれており、洗浄
ブラシ１３０の半導体ウェーハ１１０に対する押圧力を
検出するようになっている。In FIG. 1, a semiconductor wafer 110 is
It is set on the turntable 122 in the cleaning unit 120,
During the cleaning operation, the rotary table 122 is driven to rotate. On the other hand, the cleaning brush 130 is held by a brush driving unit (arm unit) 142 of the cleaning device 140 and is arranged so as to hang down from above the semiconductor wafer 110 to the wafer surface. And this cleaning brush 1
A pressure sensor 132 is incorporated in 30 so as to detect a pressing force of the cleaning brush 130 against the semiconductor wafer 110.
【００１２】また、ブラシ駆動部１４２には、洗浄ブラ
シ１３０のブラシ圧を自動制御するための機構が設けら
れている。これは、例えば空圧制御シリンダ等の機構に
よって洗浄ブラシ１３０の上下方向の位置を制御するも
のであり、空圧制御シリンダ等に供給する圧縮空気の量
を切り換え制御することで、洗浄ブラシ１３０のブラシ
圧を自動制御するものである。なお、ブラシ圧を自動制
御する機構としては、空圧制御に限らず、例えば送りネ
ジ機構やリンク機構を用いたものであってもよい。The brush driving section 142 is provided with a mechanism for automatically controlling the brush pressure of the cleaning brush 130. This is to control the vertical position of the cleaning brush 130 by a mechanism such as a pneumatic control cylinder or the like, and by switching the amount of compressed air supplied to the pneumatic control cylinder or the like, the cleaning brush 130 is controlled. This is for automatically controlling the brush pressure. The mechanism for automatically controlling the brush pressure is not limited to the pneumatic control, but may be, for example, a mechanism using a feed screw mechanism or a link mechanism.
【００１３】また、パソコン１５０は、以上のような構
成のブラシ洗浄装置における洗浄作業全体を制御するも
のであるが、特に本実施の形態では、圧力センサ１３２
から検出信号に基づいて、洗浄ブラシ１３０のブラシ圧
をフィードバック制御するための処理を行なう。すなわ
ち、パソコン１５０には、ブラシ圧制御ソフトが搭載さ
れるとともに、予めブラシ圧の目標値が予め設定されて
おり、ブラシ圧制御ソフトに基づいて、洗浄作業中に圧
力センサ１３２から検出されるブラシ圧を監視し、この
ブラシ圧を目標値に一致させるように、ブラシ駆動部１
４２のブラシ圧制御機構を制御する。これにより、安定
的にブラシ圧を一定値に制御し、良好な洗浄状態を得る
ものである。The personal computer 150 controls the entire cleaning operation in the brush cleaning apparatus having the above-described configuration. In the present embodiment, the pressure sensor 132 is particularly used.
To perform feedback control of the brush pressure of the cleaning brush 130 based on the detection signal. That is, a brush pressure control software is installed in the personal computer 150, a target value of the brush pressure is set in advance, and a brush detected by the pressure sensor 132 during the cleaning operation based on the brush pressure control software. The brush driving unit 1 monitors the pressure and adjusts the brush pressure to a target value.
The brush pressure control mechanism 42 is controlled. Thereby, the brush pressure is stably controlled to a constant value, and a good cleaning state is obtained.
【００１４】なお、ブラシ駆動部１４２の内部に揺動機
構（図示せず）を配置し、洗浄作業中に洗浄ブラシ１３
０を上下方向に揺動し、洗浄効果を上げるような仕組み
としてもよい。この場合、揺動制御に対応したブラシ圧
をパソコン１５０で解析し、一定のブラシ圧変動となる
ように、ブラシ駆動部１４２を制御し、洗浄ブラシ１３
０の押圧力を制御する。An oscillating mechanism (not shown) is arranged inside the brush driving section 142 so that the cleaning brush 13 can be used during the cleaning operation.
A mechanism may be adopted in which 0 is swung up and down to increase the cleaning effect. In this case, the brush pressure corresponding to the swing control is analyzed by the personal computer 150, and the brush driving unit 142 is controlled so that the brush pressure fluctuates at a constant value.
0 pressing force is controlled.
【００１５】次に図２は、上述のような本例のブラシ洗
浄装置を利用した設備の構成例を示す説明図である。こ
の設備は、２つのブラシ洗浄装置２０１、２０２を用い
て半導体ウェーハの洗浄を行なうものである。なお、図
２では、一方のブラシ洗浄装置２０１を第１チャネル
（ＣＨ−１）とし、他方のブラシ洗浄装置２０２を第２
チャネル（ＣＨ−２）として示している。コントローラ
３００は、各ブラシ洗浄装置２０１、２０２における洗
浄動作を制御するものであり、特に本例においては各ブ
ラシ洗浄装置２０１、２０２におけるブラシ圧制御を行
なうためのレギュレータ３１１、３１２及び電空レギュ
レータ３２１、３２２が設けられている。Next, FIG. 2 is an explanatory diagram showing an example of the configuration of equipment utilizing the above-described brush cleaning apparatus of this embodiment. This equipment cleans a semiconductor wafer by using two brush cleaning devices 201 and 202. In FIG. 2, one brush cleaning device 201 is a first channel (CH-1), and the other brush cleaning device 202 is a second channel (CH-1).
This is shown as a channel (CH-2). The controller 300 controls the cleaning operation in each of the brush cleaning devices 201 and 202. In particular, in this example, the regulators 311 and 312 and the electropneumatic regulator 321 for controlling the brush pressure in each of the brush cleaning devices 201 and 202. , 322 are provided.
【００１６】レギュレータ３１１、３１２は、パソコン
１５０からの制御に基づいて、各ブラシ洗浄装置２０
１、２０２におけるブラシ圧の増大／減少を切り換え制
御するものである。電空レギュレータ３２１、３２２
は、レギュレータ３１１、３１２の制御に基づいて、ブ
ラシ洗浄装置２０１、２０２のブラシ圧制御機構に対す
る圧縮空気の供給量を切り換え制御するものである。ま
た、コントローラ３００には、各ブラシ洗浄装置２０
１、２０２におけるブラシ圧を表示するインジケータ３
３１、３３２、電源を得るためのプラグ３４０、警報用
のブザー付パトライト３５０、各ブラシ洗浄装置２０
１、２０２における動作タイミング検出用のセンサ３６
１、３６２等が設けられている。The regulators 311 and 312 control the brush cleaning devices 20 based on the control from the personal computer 150.
The control for switching between the increase and decrease of the brush pressure in 1, 202 is performed. Electropneumatic regulators 321 and 322
Controls switching of the supply amount of compressed air to the brush pressure control mechanisms of the brush cleaning devices 201 and 202 based on the control of the regulators 311 and 312. Further, the controller 300 includes each brush cleaning device 20.
Indicator 3 for displaying brush pressure in 1, 202
31, 332, plug 340 for obtaining power, patrol light 350 with buzzer for alarm, brush cleaning device 20
Sensors 36 for detecting operation timing at 1, 202
1, 362 and the like are provided.
【００１７】また、本設備では、ブラシ洗浄装置２０
１、２０２のブラシ圧を実測するための計測用治具
（秤）４００とその表示用インジケータ４１０が備えら
れており、この計測用治具（秤）４００とインジケータ
４１０を用いてブラシ圧を実測し、パソコン１５０にお
ける目標値の初期設定等に用いるようになっている。以
上のような洗浄設備では、パソコン１５０のブラシ圧制
御ソフトに基づいて、各ブラシ洗浄装置２０１、２０２
のブラシ圧を一定値に制御し、適正な洗浄作業を行なう
ことができる。In this facility, the brush cleaning device 20
A measuring jig (scale) 400 for actually measuring the brush pressure of 1, 202 and an indicator 410 for displaying the same are provided. The brush pressure is actually measured using the measuring jig (scale) 400 and the indicator 410. Then, it is used for initial setting of a target value in the personal computer 150 and the like. In the above-described cleaning equipment, each of the brush cleaning devices 201 and 202 is controlled based on the brush pressure control software of the personal computer 150.
By controlling the brush pressure to a constant value, it is possible to perform an appropriate cleaning operation.
【００１８】なお、本発明にかかるブラシ洗浄装置は、
上記図１に示す構成のものに限定されず、本発明の要旨
を逸脱しない範囲で種々の変形が可能である。例えば、
本発明にかかるブラシ洗浄装置はＣＭＰ洗浄に限定され
ず、他の洗浄作業にも適用可能であり、さらに、半導体
ウェーハ以外の洗浄にも適用し得るものである。Note that the brush cleaning device according to the present invention comprises:
The present invention is not limited to the configuration shown in FIG. 1, and various modifications can be made without departing from the gist of the present invention. For example,
The brush cleaning apparatus according to the present invention is not limited to the CMP cleaning, but can be applied to other cleaning operations, and can also be applied to cleaning other than semiconductor wafers.
【００１９】[0019]
【発明の効果】以上のように、本発明のブラシ洗浄装置
によれば、洗浄ブラシによる洗浄中に押圧力検出手段に
よって洗浄ブラシの被研磨部材に対する押圧力を検出
し、その検出された押圧力に基づいて、洗浄ブラシの押
圧力が最適になるように洗浄ブラシの押圧力を制御する
ことから、自動制御による安定したブラシ圧によって適
正な洗浄を行なうことができる。したがって、人為的な
作業による洗浄結果のばらつきも解消でき、適正なブラ
シ圧による良好な洗浄結果を得ることができる。As described above, according to the brush cleaning apparatus of the present invention, the pressure of the cleaning brush against the member to be polished is detected by the pressure detecting means during the cleaning by the cleaning brush, and the detected pressure is detected. Based on the above, the pressing force of the cleaning brush is controlled so that the pressing force of the cleaning brush is optimized, so that appropriate cleaning can be performed with a stable brush pressure by automatic control. Therefore, the variation of the cleaning result due to the manual operation can be eliminated, and a good cleaning result with an appropriate brush pressure can be obtained.
【００２０】また本発明のブラシ洗浄装置の制御方法に
よれば、洗浄ブラシによる洗浄中に洗浄ブラシの被研磨
部材に対する押圧力を検出し、その検出された押圧力に
基づいて、洗浄ブラシの押圧力が最適になるように洗浄
ブラシの押圧力を制御することから、自動制御による安
定したブラシ圧によって適正な洗浄を行なうことができ
る。したがって、人為的な作業による洗浄結果のばらつ
きも解消でき、適正なブラシ圧による良好な洗浄結果を
得ることができる。Further, according to the control method of the brush cleaning apparatus of the present invention, the pressing force of the cleaning brush on the member to be polished is detected during the cleaning by the cleaning brush, and the pressing force of the cleaning brush is determined based on the detected pressing force. Since the pressing force of the cleaning brush is controlled so that the pressure is optimized, appropriate cleaning can be performed with a stable brush pressure by automatic control. Therefore, the variation of the cleaning result due to the manual operation can be eliminated, and a good cleaning result with an appropriate brush pressure can be obtained.
【図１】本発明の実施の形態によるブラシ洗浄装置の構
成例を示す説明図である。FIG. 1 is an explanatory diagram showing a configuration example of a brush cleaning device according to an embodiment of the present invention.
【図２】図１に示すブラシ洗浄装置を利用した設備の構
成例を示す説明図である。FIG. 2 is an explanatory diagram showing a configuration example of equipment using the brush cleaning device shown in FIG.
【図３】従来のブラシ洗浄装置の構成例を示す説明図で
ある。FIG. 3 is an explanatory diagram showing a configuration example of a conventional brush cleaning device.
１１０……半導体ウェーハ、１２０……洗浄部、１２２
……ターンテーブル、１３０……洗浄ブラシ、１３２…
…圧力センサ、１４０……洗浄装置、１４２……ブラシ
駆動部、１５０……パソコン。110: semiconductor wafer, 120: cleaning unit, 122
... Turntable, 130 ... Cleaning brush, 132 ...
... pressure sensor, 140 ... cleaning device, 142 ... brush drive unit, 150 ... personal computer.
Claims (8)
を洗浄するブラシ洗浄装置において、 前記洗浄ブラシを駆動して前記被研磨部材の被研磨面に
押圧接触させるブラシ駆動手段と、 前記洗浄ブラシによる洗浄中に前記洗浄ブラシの被研磨
部材に対する押圧力を検出する押圧力検出手段と、 前記押圧力検出手段により検出された押圧力に基づい
て、前記洗浄ブラシの押圧力が最適になるように前記ブ
ラシ駆動手段を制御する制御手段と、 を具備したことを特徴とするブラシ洗浄装置。1. A brush cleaning apparatus for cleaning a polished surface of a member to be polished using a cleaning brush, a brush driving means for driving the cleaning brush to press and contact the polished surface of the member to be polished; A pressing force detecting means for detecting a pressing force of the cleaning brush on the member to be polished during cleaning by the brush; and a pressing force of the cleaning brush being optimized based on the pressing force detected by the pressing force detecting means. And a control means for controlling the brush driving means.
り、前記ウェーハを高速回転させながら前記洗浄ブラシ
による洗浄を行なうことを特徴とする請求項１記載のブ
ラシ洗浄装置。2. The brush cleaning apparatus according to claim 1, wherein the member to be polished is a semiconductor wafer, and the cleaning is performed by the cleaning brush while rotating the wafer at a high speed.
研磨面に残存したスラリを除去するためのＣＭＰ洗浄を
行なうことを特徴とする請求項１記載のブラシ洗浄装
置。3. The brush cleaning apparatus according to claim 1, wherein CMP cleaning for removing slurry remaining on the surface to be polished of the member to be polished is performed by CMP polishing.
に基づいて前記洗浄ブラシの押圧力を制御することを特
徴とする請求項１記載のブラシ洗浄装置。4. The brush cleaning apparatus according to claim 1, wherein said control means controls the pressing force of said cleaning brush based on a preset target value.
を洗浄するブラシ洗浄装置の制御方法において、 前記洗浄ブラシによる洗浄中に前記洗浄ブラシの被研磨
部材に対する押圧力を検出し、その検出された押圧力に
基づいて、前記洗浄ブラシの押圧力が最適になるように
前記洗浄ブラシの押圧力を制御するようにした、 ことを特徴とするブラシ洗浄装置の制御方法。5. A method for controlling a brush cleaning apparatus for cleaning a polished surface of a member to be polished using a cleaning brush, wherein a pressing force of the cleaning brush against the member to be polished is detected during cleaning by the cleaning brush, and the detection is performed. The control method of the brush cleaning device, wherein the pressing force of the cleaning brush is controlled so that the pressing force of the cleaning brush is optimized based on the performed pressing force.
り、前記ウェーハを高速回転させながら前記洗浄ブラシ
による洗浄を行なうことを特徴とする請求項５記載のブ
ラシ洗浄装置の制御方法。6. The method according to claim 5, wherein the member to be polished is a semiconductor wafer, and the cleaning is performed by the cleaning brush while rotating the wafer at a high speed.
研磨面に残存したスラリを除去するためのＣＭＰ洗浄を
行なうことを特徴とする請求項５記載のブラシ洗浄装置
の制御方法。7. The control method for a brush cleaning apparatus according to claim 5, wherein CMP cleaning for removing slurry remaining on the surface to be polished of said member to be polished is performed by CMP polishing.
浄ブラシの押圧力を制御することを特徴とする請求項５
記載のブラシ洗浄装置の制御方法。8. The cleaning brush according to claim 5, wherein the pressing force of the cleaning brush is controlled based on a preset target value.
A control method of the brush cleaning device according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001117716A JP2002313765A (en) | 2001-04-17 | 2001-04-17 | Brush cleaning device and control method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001117716A JP2002313765A (en) | 2001-04-17 | 2001-04-17 | Brush cleaning device and control method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002313765A true JP2002313765A (en) | 2002-10-25 |
Family
ID=18968210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001117716A Pending JP2002313765A (en) | 2001-04-17 | 2001-04-17 | Brush cleaning device and control method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002313765A (en) |
Cited By (9)
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| JP2008277577A (en) * | 2007-04-27 | 2008-11-13 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| JP2013526054A (en) * | 2010-04-30 | 2013-06-20 | アプライド マテリアルズ インコーポレイテッド | Disc brush cleaning device module with fluid jet |
| JP2014038983A (en) * | 2012-08-20 | 2014-02-27 | Ebara Corp | Substrate cleaning device and substrate processing device |
| CN108565228A (en) * | 2018-01-02 | 2018-09-21 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of wafer pressure control device, method and system |
| JP2019062055A (en) * | 2017-09-26 | 2019-04-18 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| US20190237427A1 (en) * | 2018-01-30 | 2019-08-01 | Kulicke And Soffa Industries, Inc. | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
| CN113352236A (en) * | 2021-06-28 | 2021-09-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Pressure control device and pressure control method |
| CN114815917A (en) * | 2022-04-20 | 2022-07-29 | 北京烁科精微电子装备有限公司 | Method, device and equipment for controlling wafer brushing pressure and storage medium |
| CN115371876A (en) * | 2022-08-12 | 2022-11-22 | 上海芯物科技有限公司 | Wafer cleaning brushing pressure on-line detection method, carrier and storage medium |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8051522B2 (en) | 2007-04-27 | 2011-11-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus |
| JP2008277577A (en) * | 2007-04-27 | 2008-11-13 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| US9646859B2 (en) | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
| JP2013526054A (en) * | 2010-04-30 | 2013-06-20 | アプライド マテリアルズ インコーポレイテッド | Disc brush cleaning device module with fluid jet |
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| US10707103B2 (en) | 2012-08-20 | 2020-07-07 | Ebara Corporation | Substrate cleaning apparatus and substrate processing apparatus |
| WO2014030640A1 (en) * | 2012-08-20 | 2014-02-27 | 株式会社 荏原製作所 | Substrate cleaning device and substrate processing device |
| US9978617B2 (en) | 2012-08-20 | 2018-05-22 | Ebara Corporation | Substrate cleaning apparatus and substrate processing apparatus |
| KR20180126082A (en) | 2012-08-20 | 2018-11-26 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate cleaning apparatus and substrate processing apparatus |
| JP2014038983A (en) * | 2012-08-20 | 2014-02-27 | Ebara Corp | Substrate cleaning device and substrate processing device |
| JP2019062055A (en) * | 2017-09-26 | 2019-04-18 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| CN108565228A (en) * | 2018-01-02 | 2018-09-21 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of wafer pressure control device, method and system |
| US20190237427A1 (en) * | 2018-01-30 | 2019-08-01 | Kulicke And Soffa Industries, Inc. | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
| CN113352236A (en) * | 2021-06-28 | 2021-09-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Pressure control device and pressure control method |
| CN114815917A (en) * | 2022-04-20 | 2022-07-29 | 北京烁科精微电子装备有限公司 | Method, device and equipment for controlling wafer brushing pressure and storage medium |
| CN115371876A (en) * | 2022-08-12 | 2022-11-22 | 上海芯物科技有限公司 | Wafer cleaning brushing pressure on-line detection method, carrier and storage medium |
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