CN108565228A - A kind of wafer pressure control device, method and system - Google Patents
A kind of wafer pressure control device, method and system Download PDFInfo
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- CN108565228A CN108565228A CN201810002177.3A CN201810002177A CN108565228A CN 108565228 A CN108565228 A CN 108565228A CN 201810002177 A CN201810002177 A CN 201810002177A CN 108565228 A CN108565228 A CN 108565228A
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000033001 locomotion Effects 0.000 claims description 15
- 230000007246 mechanism Effects 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 22
- 238000005201 scrubbing Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000004990 Smectic liquid crystal Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a kind of wafer pressure control device, method and system, wherein the device includes：Pressure sensor, controller and mobile device；Pressure sensor and mobile device are electrically connected with the controller；The pressure data for when round brush cleans wafer, detecting pressure data of the round brush to wafer, and is transmitted to controller by pressure sensor；Controller judges whether pressure data meets predetermined threshold value, generates corresponding control signal according to judging result, and send control signals to mobile device for receiving pressure data；Mobile device is moved according to control signal control round brush relative to wafer for receiving control signal.The wafer pressure control device that there is provided through the invention, method and system, realize the automation control to wafer pressure, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is promoted, to further increase the working efficiency cleaned after CMP.
Description
Technical field
The present invention relates to semiconductor processing technology field, in particular to a kind of wafer pressure control device, method and
System.
Background technology
With the continuous development of integrated circuit (Integrated circuit, IC) technology, wafer planarization have become with
Photoetching, etching great technology of equal importance, and chemically-mechanicapolish polish (Chemical Mechanical
Planarization, CMP) it is current most effective wafer planarization technology.Wherein, CMP is mainly by polishing and rear cleaning structure
At cleaning major function after CMP is cleaned to the wafer after the completion of polishing process, to remove the flaw brought in polishing process
Dirt (such as abrasive grain, polishing material particle and the stained object of chemistry).
Cleaning device includes mainly million sound units, brush scrubbing unit and drying unit after above-mentioned CMP.Wherein, brush scrubbing unit
It is two-sided to wafer progress by two round brush, deionized water and chemical liquids spray as one ring of key in being cleaned after CMP
Physics is scrubbed.In view of above-mentioned stained object is the surface for being compressed in wafer by pressure, due to the required throwing of different product
Light path degree is different, and pressure is also just corresponding different, also different to cause to stain the pressure that object is subjected to, therefore, in cleaning,
Different product needs different degree of cleanings, that is to say, that needs round brush different to the pressure of wafer.
Usually all it is the pressure that round brush is adjusted to wafer using manual type in the related technology.However, manual type is not
Pressure can be made very accurate, it is uncontrollable or cause wafer cleaning not clean also to will result in degree of cleaning, still has stained object to deposit
；It causes wafer by over cleaning, certain damage is caused to wafer.
Invention content
In view of this, the purpose of the present invention is to provide a kind of wafer pressure control device, method and system, with realization pair
The automation control of wafer pressure, the accuracy of control and accuracy are higher.
In a first aspect, the present invention provides a kind of wafer pressure control device, described device includes：Pressure sensor, control
Device processed and mobile device；The pressure sensor and the mobile device are electrically connected with the controller；
The pressure sensor, for when round brush cleans wafer, detecting pressure of the round brush to the wafer
Force data, and the pressure data is transmitted to the controller；
The controller judges whether the pressure data meets predetermined threshold value for receiving the pressure data, according to
Judging result generates corresponding control signal, and the control signal is sent to the mobile device；
The mobile device controls the round brush with respect to institute for receiving the control signal according to the control signal
Wafer is stated to be moved.
With reference to first aspect, the present invention provides the first possible embodiments of first aspect, wherein the movement
Device includes motor driver and motor；The controller is electrically connected with the motor driver, the motor driver and institute
State motor electrical connection；
The motor driver, the control signal sent for receiving the controller, generates according to the control signal
For the driving instruction of driving motor rotation, and the driving instruction is sent to the motor；
The motor is rotated for receiving the driving instruction according to the driving instruction, and by the rotation
Transhipment turn is changed to linear motion, to realize that the round brush is moved relative to the wafer.
The possible embodiment of with reference to first aspect the first, second the present invention provides first aspect are possible
Embodiment, wherein the mobile device further includes deceleration mechanism；The deceleration mechanism is electrically connected with the motor；
The deceleration mechanism for reducing the rotating speed of the motor, and controls the round brush phase according to the rotating speed after reduction
The wafer is moved.
With reference to first aspect, the present invention provides the third possible embodiments of first aspect, wherein
The controller is specifically used for receiving the pressure data, judges whether the pressure data is more than predetermined threshold value,
Mobile control signal is carried out far from the wafer for controlling the round brush if so, generating, if it is not, then generating for controlling
The round brush carries out mobile control signal close to the wafer.
The possible embodiment of with reference to first aspect the first, the 4th kind the present invention provides first aspect are possible
Embodiment, wherein the motor is stepper motor.
The possible embodiment of with reference to first aspect the first, the 5th kind the present invention provides first aspect are possible
Embodiment, wherein the motor includes reverse thread screw mechanism and motor output shaft；
The reverse thread screw mechanism, for the rotary motion of the motor output shaft to be converted to linear motion.
Second aspect, the present invention also provides a kind of wafer pressure control method, the method includes：
Receive pressure data of the round brush to wafer；
Judge whether the pressure data meets predetermined threshold value, corresponding control signal is generated according to judging result, with root
The round brush is controlled according to the control signal to be moved relative to the wafer.
In conjunction with second aspect, the present invention provides the first possible embodiments of second aspect, wherein the judgement
Whether the pressure data meets predetermined threshold value, and corresponding control signal is generated according to judging result, including：
Judge whether the pressure data is more than predetermined threshold value；
Mobile control signal is carried out far from the wafer for controlling the round brush if so, generating, if it is not, then generating
Mobile control signal is carried out close to the wafer for controlling the round brush.
The third aspect, the present invention also provides the of a kind of wafer pressure control system, including first aspect, first aspect
In a kind of possible embodiment to the 5th kind of possible embodiment of first aspect described in any possible embodiment
Wafer pressure control device, further include wafer and round brush；
The pressure sensor, for when round brush cleans wafer, detecting pressure of the round brush to the wafer
Force data, and the pressure data is transmitted to the controller；
The controller judges whether the pressure data meets predetermined threshold value for receiving the pressure data, according to
Judging result generates corresponding control signal, and the control signal is sent to the mobile device；
The mobile device controls the round brush with respect to institute for receiving the control signal according to the control signal
Wafer is stated to be moved；
The round brush, for being moved relative to the wafer under the drive of the mobile device.
In conjunction with the third aspect, the present invention provides the first possible embodiments of the third aspect, wherein
The controller is specifically used for receiving the pressure data, judges whether the pressure data is more than predetermined threshold value,
Mobile control signal is carried out far from the wafer for controlling the round brush if so, generating, if it is not, then generating for controlling
The round brush carries out mobile control signal close to the wafer.
Wafer pressure control device provided by the invention, including pressure sensor, controller and mobile device；Pressure sensing
Device and mobile device are electrically connected with the controller；For pressure sensor when round brush cleans wafer, detection round brush is to wafer
Pressure data, and the pressure data is transmitted to controller；Controller receives pressure data, judges whether pressure data meets
Predetermined threshold value generates corresponding control signal according to judging result, and sends control signals to mobile device；Mobile device connects
Control signal is received, is moved relative to wafer according to control signal control round brush.The wafer pressure control provided through the invention
Device, method and system move the pressure data control round brush of wafer relative to wafer according to the round brush of feedback, realize
To the automation control of wafer pressure, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit
It is promoted, to further increase the working efficiency cleaned after CMP.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate
Appended attached drawing, is described in detail below.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows a kind of structural schematic diagram for wafer pressure control system that the embodiment of the present invention is provided；
Fig. 2 shows a kind of structural schematic diagrams for wafer pressure control device that the embodiment of the present invention is provided；
Fig. 3 shows the structural representation of mobile device in a kind of wafer pressure control device that the embodiment of the present invention is provided
Figure；
Fig. 4 shows a kind of flow chart for wafer pressure control method that the embodiment of the present invention is provided；
Fig. 5 shows the flow chart for another wafer pressure control method that the embodiment of the present invention is provided.
Main element symbol description：
1, wafer pressure control device；2, wafer；3, round brush；11, pressure sensor；12, controller；13, mobile device；
131, motor driver；132, motor；133, deceleration mechanism.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Middle attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is real
Applying the component of example can be arranged and designed with a variety of different configurations.Therefore, below to provide in the accompanying drawings the present invention
The detailed description of embodiment is not intended to limit the range of claimed invention, but is merely representative of the selected reality of the present invention
Apply example.Based on the embodiment of the present invention, the institute that those skilled in the art are obtained without making creative work
There is other embodiment, shall fall within the protection scope of the present invention.
In view of being usually all the pressure for adjusting round brush to wafer using manual type in the related technology.However, artificial side
Formula can not make pressure very accurate, and it is uncontrollable or cause wafer cleaning not clean also to will result in degree of cleaning, still there is flaw
Dirt exists；It causes wafer by over cleaning, certain damage is caused to wafer.In view of this, the embodiment of the present invention provides
A kind of wafer pressure control device, method and system, to realize the automation control to wafer pressure, the accuracy of control and
Accuracy is higher.
For the ease of being better understood from wafer pressure control device provided in an embodiment of the present invention, method, now first to this
The wafer pressure control system that inventive embodiments provide carries out simple illustration.The embodiment of the present invention provides combined with Figure 1 and Figure 2,
A kind of wafer pressure control system, the wafer pressure control system include by pressure sensor 11, controller 12 and mobile dress
The wafer pressure control device 1 for setting 13 compositions further includes wafer 2 and round brush 3；Pressure sensor 11 is used in round brush 3 to wafer
2 when being cleaned, which is transmitted to controller 12 by detection round brush 3 to the pressure data of wafer 2；Controller 12,
For receiving pressure data, judge whether pressure data meets predetermined threshold value, corresponding control signal generated according to judging result,
And send control signals to mobile device 13；Mobile device 13 controls round brush for receiving control signal according to control signal
3 are moved relative to wafer 2；Round brush 3, for being moved relative to wafer 2 under the drive of mobile device 13, it is seen then that its root
The pressure data control round brush 3 of wafer 2 is moved relative to wafer 2 according to the round brush 3 of feedback, is realized to the automatic of wafer pressure
Change control, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is promoted, thus into one
Step improves the working efficiency cleaned after CMP.
Next wafer pressure control device 1 provided in an embodiment of the present invention is specifically illustrated.Referring to Fig. 2, on
It includes pressure sensor 11, controller 12 and mobile device 13 to state wafer pressure control device 1；Pressure sensor 11 and mobile dress
13 are set to be electrically connected with controller 12；
Pressure sensor 11, for when round brush 3 cleans wafer 2, detecting pressure data of the round brush 3 to wafer 2,
And the pressure data is transmitted to controller 12；
Controller 12 judges whether pressure data meets predetermined threshold value, is given birth to according to judging result for receiving pressure data
At corresponding control signal, and send control signals to mobile device 13；
Mobile device 13 is moved according to control signal control round brush 3 relative to wafer 2 for receiving control signal.
Wafer pressure control device 1 provided in an embodiment of the present invention, including pressure sensor 11, controller 12 and mobile dress
Set 13；Pressure sensor 11 and mobile device 13 are electrically connected with controller 12；Pressure sensor 11 round brush 3 to wafer 2 into
When row cleaning, pressure data of the round brush 3 to wafer 2 is detected, and the pressure data is transmitted to controller 12；Controller 12 receives
Pressure data, judges whether pressure data meets predetermined threshold value, generates corresponding control signal according to judging result, and will control
Signal is sent to mobile device 13；Mobile device 13 receives control signal, according to control signal control round brush 3 with respect to wafer 2 into
Row movement is moved the pressure data control round brush 3 of wafer 2 relative to wafer 2 according to the round brush 3 of feedback, is realized to crystalline substance
The automation control of circle pressure, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is able to
It is promoted, to further increase the working efficiency cleaned after CMP.
Specifically, wafer pressure control device 1 provided in an embodiment of the present invention is right by the detection round brush 3 of pressure sensor 11
The pressure data is then compared by the pressure data of wafer 2, controller 12 with predetermined threshold value, judges that above-mentioned pressure data is big
It is default in presetting, it is also less than or equal to the predetermined threshold value, and corresponding control signal is generated according to different judging results, moved
Dynamic device 13 then controls round brush 3 according to the control signal and is moved relative to wafer 2, wherein above-mentioned round brush 3 is moved with respect to wafer 2
It is dynamic refer to round brush 3 close to wafer 2 or round brush 3 far from wafer 2, that is, the embodiment of the present invention is controlled by mobile device 13
The distance between round brush 3 and wafer 2 adjust chucking power of the round brush 3 to wafer 2.As shown in Figure 1, the embodiment of the present invention is preferably adopted
The control mode that wafer 2 is clamped with two round brush 3 carries out the cleaning of wafer 2.In addition, can built-in electric rotating machine on each round brush 3
132, to drive the rotation of round brush 3, so that round brush 3 is while ensuring that all positions to wafer 2 are cleaned, moreover it is possible to
Enough control signals received by above-mentioned mobile device 13 during scrub accurately control two round brush 3 to wafer 2
Chucking power, practicability is more preferably.
In order to preferably realize that the distance between two round brush 3 are adjusted, wafer pressure control provided in an embodiment of the present invention
Controller 12 in device 1 is true based on the comparison result between the obtained pressure data of detection of pressure sensor 11 and predetermined threshold value
Fixed corresponding control signal generates that is, when judging that pressure data is more than predetermined threshold value for controlling round brush 3 far from wafer 2
Mobile control signal is carried out, when judging that pressure data is less than or equal to predetermined threshold value, generates and leans on smectic for controlling round brush 3
Circle 2 carries out mobile control signal, and above-mentioned control signal is related to the difference between pressure data and predetermined threshold value.As it can be seen that
The embodiment of the present invention can control round brush 3 and carried out close to wafer 2 when detecting that round brush 3 is smaller to the pressure data of wafer 2
Movement is to increase pressure data, additionally it is possible to which, when detecting that round brush 3 is bigger to the pressure data of wafer 2, control round brush 3 is separate
Wafer 2 is moved to reduce pressure data, and to realize the accurately controlling to wafer 2 of round brush 3, practicability is more preferably.
Referring to Fig. 3, the mobile device 13 in wafer pressure control device 1 provided in an embodiment of the present invention drives including motor
Device 131 and motor 132, above-mentioned motor driver 131 can receive controller 12 transmission control signal, to the control signal into
Row dissection process, obtains the driving instruction rotated for driving motor 132, and motor 132 can then be carried out according to the driving instruction
Rotary motion, and linear motion is converted rotational motion into, to realize that round brush 3 is moved relative to wafer 2.
Wherein, above-mentioned motor 132 includes reverse thread screw mechanism and motor output shaft, the reverse thread screw mechanism energy
It is enough that the rotary motion of motor output shaft is converted into linear motion.
In addition, above-mentioned motor 132 is preferably stepper motor.
In order to carry out rotating speed further between motor 132 and round brush 3 and transmit the matching of torque, the embodiment of the present invention
In mobile device 13 further include deceleration mechanism 133, referring to Fig. 3, which passes through the connection between motor 132
Relationship reduces the rotating speed of the motor 132, and can control round brush 3 according to the rotating speed after reduction and be moved relative to wafer 2.
Wafer pressure control device 1 provided in an embodiment of the present invention, including pressure sensor 11, controller 12 and mobile dress
Set 13；Pressure sensor 11 and mobile device 13 are electrically connected with controller 12；Pressure sensor 11 round brush 3 to wafer 2 into
When row cleaning, pressure data of the round brush 3 to wafer 2 is detected, and the pressure data is transmitted to controller 12；Controller 12 receives
Pressure data, judges whether pressure data meets predetermined threshold value, generates corresponding control signal according to judging result, and will control
Signal is sent to mobile device 13；Mobile device 13 receives control signal, according to control signal control round brush 3 with respect to wafer 2 into
Row movement is moved the pressure data control round brush 3 of wafer 2 relative to wafer 2 according to the round brush 3 of feedback, is realized to crystalline substance
The automation control of circle pressure, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is able to
It is promoted, to further increase the working efficiency cleaned after CMP.
The embodiment of the present invention additionally provides a kind of wafer pressure control method, referring to Fig. 4, the wafer pressure control method
Executive agent is above controller 12, and the above method specifically comprises the following steps：
S101, pressure data of the round brush 3 to wafer 2 is received；
S102, judge whether pressure data meets predetermined threshold value, corresponding control signal is generated according to judging result, with root
It is moved relative to wafer 2 according to control signal control round brush 3.
Wherein, referring to Fig. 5, above-mentioned steps 102 are realized especially by following steps：
S201, judge whether pressure data is more than predetermined threshold value；
S202, mobile control signal is carried out far from wafer 2 for controlling round brush 3 if so, generating, if it is not, then generating
Mobile control signal is carried out close to wafer 2 for controlling round brush 3.
Wafer pressure control method provided in an embodiment of the present invention receives pressure data of the round brush 3 to wafer 2 first；So
Judge whether pressure data meets predetermined threshold value afterwards, corresponding control signal is generated according to judging result, with according to control signal
Control round brush 3 is moved relative to wafer 2, relatively brilliant to the pressure data control round brush 3 of wafer 2 according to the round brush 3 of feedback
Circle 2 is moved, and realizes that the accuracy of control and accuracy are higher to the automation control of wafer pressure so that scrub is single
The cleaning control ability of member is promoted, to further increase the working efficiency cleaned after CMP.
Wafer pressure control device 1 based on the embodiment of the present invention, the embodiment of the present invention additionally provide a kind of wafer
Control pressurer system, referring to Fig. 1, which includes by pressure sensor 11, controller 12 and mobile device
The wafer pressure control device 1 of 13 compositions, further includes wafer 2 and round brush 3；Pressure sensor 11 is used in round brush 3 to wafer 2
When being cleaned, pressure data of the round brush 3 to wafer 2 is detected, and the pressure data is transmitted to controller 12；Controller 12,
For receiving pressure data, judge whether pressure data meets predetermined threshold value, corresponding control signal generated according to judging result,
And send control signals to mobile device 13；Mobile device 13 controls round brush for receiving control signal according to control signal
3 are moved relative to wafer 2；Round brush 3, for being moved relative to wafer 2 under the drive of mobile device 13, it is seen then that its root
The pressure data control round brush 3 of wafer 2 is moved relative to wafer 2 according to the round brush 3 of feedback, is realized to the automatic of wafer pressure
Change control, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is promoted, thus into one
Step improves the working efficiency cleaned after CMP.
Above controller 12 judges whether pressure data is more than predetermined threshold value also particularly useful for pressure data is received, if
It is then to generate and carry out mobile control signal far from wafer 2 for controlling round brush 3, leaned on if it is not, then generating for controlling round brush 3
Smectic circle 2 carries out mobile control signal.
As it can be seen that the wafer pressure control system provided through the embodiment of the present invention realizes the automation control to wafer pressure
System, the accuracy of control and accuracy are higher so that the cleaning control ability of brush scrubbing unit is promoted, to further carry
The working efficiency cleaned after high CMP.
In embodiment provided by the present invention, it should be understood that disclosed device, it can be real by another way
It is existing.The apparatus embodiments described above are merely exemplary, for example, the division of the unit, only a kind of logic work(
It can divide, formula that in actual implementation, there may be another division manner, in another example, multiple units or component can combine or can collect
At to another system, or some features can be ignored or not executed.Another point, shown or discussed mutual coupling
Close or direct-coupling or communication connection can be by some communication interfaces, the INDIRECT COUPLING or communication connection of device or unit,
Can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in embodiment provided by the invention can be integrated in a processing unit, also may be used
It, can also be during two or more units be integrated in one unit to be that each unit physically exists alone.
It, can be with if the function is realized in the form of SFU software functional unit and when sold or used as an independent product
It is stored in a computer read/write memory medium.Based on this understanding, technical scheme of the present invention is substantially in other words
The part of the part that contributes to existing technology or the technical solution can be expressed in the form of software products, the meter
Calculation machine software product is stored in a storage medium, including some instructions are used so that a computer equipment (can be
People's computer, server or network equipment etc.) it performs all or part of the steps of the method described in the various embodiments of the present invention.
And storage medium above-mentioned includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), arbitrary access are deposited
The various media that can store program code such as reservoir (RAM, Random Access Memory), magnetic disc or CD.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing, in addition, term " the
One ", " second ", " third " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
Finally it should be noted that：Embodiment described above, only specific implementation mode of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, it will be understood by those of ordinary skill in the art that：Any one skilled in the art
In the technical scope disclosed by the present invention, it can still modify to the technical solution recorded in previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention.The protection in the present invention should all be covered
Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of wafer pressure control device, which is characterized in that including：Pressure sensor, controller and mobile device；The pressure
Force snesor and the mobile device are electrically connected with the controller；
The pressure sensor, for when round brush cleans wafer, detecting number pressure of the round brush to the wafer
According to, and the pressure data is transmitted to the controller；
The controller judges whether the pressure data meets predetermined threshold value, according to judgement for receiving the pressure data
As a result corresponding control signal is generated, and the control signal is sent to the mobile device；
The mobile device controls the relatively described crystalline substance of round brush for receiving the control signal according to the control signal
Circle is moved.
2. wafer pressure control device according to claim 1, which is characterized in that the mobile device includes motor driving
Device and motor；The controller is electrically connected with the motor driver, and the motor driver is electrically connected with the motor；
The motor driver, the control signal sent for receiving the controller are used for according to control signal generation
The driving instruction of driving motor rotation, and the driving instruction is sent to the motor；
The motor is rotated for receiving the driving instruction according to the driving instruction, and the rotation is transported
Turn is changed to linear motion, to realize that the round brush is moved relative to the wafer.
3. wafer pressure control device according to claim 2, which is characterized in that the mobile device further includes speed reducer
Structure；The deceleration mechanism is electrically connected with the motor；
The deceleration mechanism for reducing the rotating speed of the motor, and controls the round brush with respect to institute according to the rotating speed after reduction
Wafer is stated to be moved.
4. wafer pressure control device according to claim 1, which is characterized in that
The controller is specifically used for receiving the pressure data, judges whether the pressure data is more than predetermined threshold value, if
It is then to generate and carry out mobile control signal far from the wafer for controlling the round brush, if it is not, then generating for controlling
It states round brush and carries out mobile control signal close to the wafer.
5. wafer pressure control device according to claim 2, which is characterized in that the motor is stepper motor.
6. wafer pressure control device according to claim 2, which is characterized in that the motor includes reverse thread leading screw
Mechanism and motor output shaft；
The reverse thread screw mechanism, for the rotary motion of the motor output shaft to be converted to linear motion.
7. a kind of wafer pressure control method, which is characterized in that including：
Receive pressure data of the round brush to wafer；
Judge whether the pressure data meets predetermined threshold value, corresponding control signal is generated according to judging result, with according to institute
The control signal control round brush is stated to be moved relative to the wafer.
8. wafer pressure control method according to claim 7, which is characterized in that described whether to judge the pressure data
Meet predetermined threshold value, corresponding control signal is generated according to judging result, including：
Judge whether the pressure data is more than predetermined threshold value；
Mobile control signal is carried out far from the wafer for controlling the round brush if so, generating, and is used for if it is not, then generating
It controls the round brush and carries out mobile control signal close to the wafer.
9. a kind of wafer pressure control system, which is characterized in that including wafer pressure according to any one of claims 1 to 6
Control device further includes wafer and round brush；
The pressure sensor, for when round brush cleans wafer, detecting number pressure of the round brush to the wafer
According to, and the pressure data is transmitted to the controller；
The controller judges whether the pressure data meets predetermined threshold value, according to judgement for receiving the pressure data
As a result corresponding control signal is generated, and the control signal is sent to the mobile device；
The mobile device controls the relatively described crystalline substance of round brush for receiving the control signal according to the control signal
Circle is moved；
The round brush, for being moved relative to the wafer under the drive of the mobile device.
10. wafer pressure control system according to claim 9, which is characterized in that
The controller is specifically used for receiving the pressure data, judges whether the pressure data is more than predetermined threshold value, if
It is then to generate and carry out mobile control signal far from the wafer for controlling the round brush, if it is not, then generating for controlling
It states round brush and carries out mobile control signal close to the wafer.
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| CN201810002177.3A CN108565228A (en) | 2018-01-02 | 2018-01-02 | A kind of wafer pressure control device, method and system |
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| CN110116365A (en) * | 2019-06-25 | 2019-08-13 | 吉姆西半导体科技（无锡）有限公司 | Chemical-mechanical grinding device bench monitoring system |
| CN110620065A (en) * | 2019-08-26 | 2019-12-27 | 石狮市纳傲贸易有限公司 | Wafer processing equipment |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
| CN113352236A (en) * | 2021-06-28 | 2021-09-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Pressure control device and pressure control method |
| CN114815917A (en) * | 2022-04-20 | 2022-07-29 | 北京烁科精微电子装备有限公司 | Method, device and equipment for controlling wafer brushing pressure and storage medium |
| CN116092985A (en) * | 2023-03-21 | 2023-05-09 | 华海清科股份有限公司 | Wafer cleaning device and method for detecting clamping force of rolling brush |
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| CN110116365A (en) * | 2019-06-25 | 2019-08-13 | 吉姆西半导体科技（无锡）有限公司 | Chemical-mechanical grinding device bench monitoring system |
| CN110620065A (en) * | 2019-08-26 | 2019-12-27 | 石狮市纳傲贸易有限公司 | Wafer processing equipment |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
| CN113352236A (en) * | 2021-06-28 | 2021-09-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Pressure control device and pressure control method |
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| CN116092985A (en) * | 2023-03-21 | 2023-05-09 | 华海清科股份有限公司 | Wafer cleaning device and method for detecting clamping force of rolling brush |
| CN116092985B (en) * | 2023-03-21 | 2023-06-23 | 华海清科股份有限公司 | Wafer cleaning device and method for detecting clamping force of rolling brush |
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Application publication date: 20180921 |