JPH10229063A - Substrate cleaning method, and substrate cleaner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately perform the adjustment of pressing load and the detection of the pressing load for every device. SOLUTION: The relation of correspondence between the actual pressing load from the cleaning tool incorporated into a board cleaner on a level with the surface of the substrate which is retained by the substrate retaining mechanism incorporated into the substrate cleaner and the detected value from the pressure sensor 31 incorporated into the substrate cleaner is investigated about the actual pressing load on differing two points or more, and it is stored in a detected information storage memory 40. In the substrate cleaning, when the detected value is obtained from the pressure sensor 31, the pressing load corresponding to the obtained detected value is found for, using the related expression being decided, based on the relation of correspondence between the actual pressing load on the two points or more stored in the detected information storage memory 40 and the detected value from the pressure sensor 31, and a controller 34 controls a relief valve 25, based on the detected information, and makes the cleaning tool work on the substrate with designated pressing load so as to clean the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a substrate for an optical disk, and the like. The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning.

[0002]

2. Description of the Related Art Conventional substrate cleaning apparatuses of this type include:
For example, there is one as disclosed in Japanese Patent Application Laid-Open No. 3-52228. This apparatus is configured such that the height position of the cleaning tool with respect to the held substrate can be arbitrarily adjusted, and by adjusting the height position, the pressing load of the cleaning tool against the substrate at the time of cleaning the substrate is set as a desired one. It is configured to be washable.

Further, Japanese Patent Application Laid-Open Nos. 8-141518, 8-141519, 8-243518
The apparatus disclosed in Japanese Patent Application Laid-Open Publication No. H10-15064 includes a sensor such as a load cell that detects a pressing load of the cleaning tool on the substrate, and detects a pressing load of the cleaning tool on the substrate at the time of cleaning the substrate based on detection information from the sensor. The substrate can be cleaned with higher accuracy by adjusting to a specified pressing load, or by performing feedback control using detection information from the sensor.

[0004]

However, the prior art having such a structure has the following problems. In the above-mentioned conventional apparatus, the pressing means for applying the cleaning tool to the substrate with a desired pressing load is configured to be driven by a control signal such as an electric signal. That is, when a desired pressing load is designated, the pressing means is controlled by a control signal having a value corresponding to the pressing load, and the cleaning tool is applied to the substrate. The correspondence between the pressing load and the control value of the pressing means is uniquely determined by the same type of substrate cleaning apparatus (having the same configuration). However, even with the same type of substrate cleaning apparatus, individual substrate cleaning apparatuses have machine differences (differences in assembling accuracy of a mechanical portion, accuracy of a control system, and the like). As a result, there is a problem that the pressing load of the cleaning tool on the substrate varies, and the pressing load of the cleaning tool on the substrate during substrate cleaning does not meet the specified pressing load.

[0005] Further, even when the pressing means is replaced due to failure or breakage, a problem that the pressing load of the cleaning tool on the substrate during the cleaning of the substrate does not conform to the specified pressing load easily occurs.

[0006] Japanese Patent Application Laid-Open No. Hei 8-267023 discloses that a pressing load measuring device which receives a cleaning tool at the same level as a cleaning surface of a substrate and measures a pressing load from the cleaning tool is used to clean the substrate prior to substrate cleaning. A device that measures the pressing load from the cleaning tool at the same level as the cleaning surface, adjusts the control value of the pressing means so as to obtain a desired pressing load, and performs actual substrate cleaning using the control value of the adjustment result. Is disclosed. According to this apparatus, prior to the actual substrate cleaning, the control value of the pressing unit that achieves a desired pressing load is adjusted with reference to the measurement result using the pressing load measuring tool. The substrate can be cleaned by accurately applying the cleaning tool to the substrate against the pressing load of the substrate. However, in this apparatus, when cleaning the substrate by changing the pressing load, it is necessary to always use a pressing load measuring tool to adjust the control value of the pressing means, which is troublesome and reduces productivity. Was also invited.

[0007] Further, the conventional apparatus provided with a sensor for detecting the pressing load of the cleaning tool against the substrate has the following problems.

Since a detection signal such as an electric signal is output from this sensor, it is necessary to calibrate the correspondence between the detection value from this sensor and the pressing load. Conventionally, this calibration work has been performed with the sensor removed from the apparatus, and after the calibration work, the sensor has been incorporated into the apparatus, and the calibration result has been stored in the apparatus. Therefore, the correspondence between the detected value from the sensor after being incorporated into the device and the pressing load may be deviated from the calibration result, the pressing load cannot be detected accurately, and the substrate cleaning may not be performed accurately. . Such inconvenience has also occurred when the sensor or the like is replaced due to failure or damage.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has a high working efficiency and can accurately adjust a pressing load and detect a pressing load for each device without lowering productivity. It is an object of the present invention to provide a substrate cleaning method and a substrate cleaning apparatus that can be performed at a time.

[0010]

The present invention has the following configuration in order to achieve the above object. That is, according to the first aspect of the present invention, the pressing load of the cleaning tool on the substrate is arbitrarily specified, the pressing means is controlled, and the cleaning tool is applied to the substrate with the specified pressing load to clean the substrate. In the substrate cleaning method, an actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus, at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus, A preparatory step of examining the corresponding relationship with the control value of the pressing means for two or more different actual pressing loads, and two points of checking the control value of the pressing means with respect to a specified pressing load in the preparatory step. Using the relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means described above, controlling the pressing means with the control value, the pressing load according to the control value It is characterized in that and a substrate cleaning step of cleaning the substrate by applying to a substrate the cleaning tool.

According to a second aspect of the present invention, in the substrate cleaning method according to the first aspect, the substrate cleaning apparatus includes a pressing load detecting means for detecting a pressing load of the cleaning tool on the substrate, and In the preparing step, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus, The correspondence with the detected value from the pressing load detecting means is further examined for two or more different actual pressing loads, and in the substrate cleaning step, when the detected value is obtained from the pressing load detecting means, Using the relational expression determined based on the correspondence relationship between the actual pressing load and the detection value from the pressing load detecting means at two or more points examined in the preparation process, the obtained detection is performed. The pressing load corresponding to the asking,
The substrate is cleaned using the detection information.

According to a third aspect of the present invention, the pressing load of the cleaning tool on the substrate is arbitrarily specified, and the pressing means is controlled based on the detection information from the pressing load detecting means, and the specified pressing load is used. In a substrate cleaning method for cleaning a substrate by applying a cleaning tool to a substrate, the cleaning tool incorporated in the substrate cleaning apparatus at the same level as a cleaning surface of the substrate held by substrate holding means incorporated in the substrate cleaning apparatus. A preparatory step of examining the correspondence between the actual pressing load from the substrate and the detected value from the pressing load detecting means incorporated in the substrate cleaning apparatus for two or more different actual pressing loads, and detecting from the pressing load detecting means When a value is obtained, the obtained value is obtained by using a relational expression determined based on the correspondence between the actual pressing load and the detected value from the pressing load detecting means at two or more points examined in the preparation step. Determining a pressing load corresponding to the detected value, controlling the pressing means based on the detection information, and applying a cleaning pressure to the substrate with the specified pressing load to clean the substrate. It is characterized by having.

According to a fourth aspect of the present invention, there is provided a substrate holding means for holding a substrate rotatably about a vertical axis, a cleaning tool for cleaning a cleaning surface of the substrate, and a pressing load of the cleaning tool on the substrate. Pressing load specifying means, pressing means for applying the cleaning tool to the substrate with a pressing load specified by the pressing load specifying means, and a cleaning tool with a specified pressing load on the substrate held by the substrate holding means. Cleaning control means for controlling the cleaning of the substrate by causing the substrate cleaning apparatus to have the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. A pressing load measuring unit that receives the built-in cleaning tool and measures an actual pressing load from the cleaning tool; the actual pressing load measured by using the pressing load measuring unit; and the actual pressing load. Control information associating means for associating the control value of the pressing means incorporated in the substrate cleaning apparatus at the time of measurement, using the pressing load measuring means and the control information associating means, the actual pressing load and the Control information storage means for storing a result obtained by examining the correspondence between the control value of the pressing means and the actual pressing load at two or more different points, and wherein the cleaning control means The control value of the pressing means for the load, using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points stored in the control information storage means. Then, the pressing means is controlled by the control value, and the cleaning tool is applied to the substrate with a pressing load corresponding to the control value to clean the substrate.

According to a fifth aspect of the present invention, there is provided the substrate cleaning apparatus according to the fourth aspect, wherein the pressing load detecting means for detecting a pressing load of the cleaning tool against the substrate and the pressing load measuring means are used. The actual pressing load, and detection information associating means for associating a detection value from the pressing load detecting means incorporated in the substrate cleaning device when measuring the actual pressing load, the pressing load measuring means, A detection information storage unit that stores a result of examining a correspondence relationship between the actual pressing load and a detection value from the pressing unit with respect to two or more different actual pressing loads using a detection information association unit; And the cleaning control unit, when a detection value is obtained from the pressing load detecting unit, the actual pressing load for two or more points stored in the detection information storage unit. Using a relational expression determined based on the correspondence with the detection value from the pressing load detection means, a pressing load corresponding to the obtained detection value is obtained, and the substrate is cleaned using the detection information. It is characterized by having such a configuration.

According to a sixth aspect of the present invention, there is provided a substrate holding means for holding a substrate rotatably about a vertical axis, a cleaning tool for cleaning a cleaning surface of the substrate, and a pressing load of the cleaning tool on the substrate. Pressing load designating means, pressing means for applying the cleaning tool to the substrate with an arbitrary pressing load, pressing load detecting means for detecting the pressing load of the cleaning tool on the substrate,
Cleaning that controls the pressing means based on the detection information from the pressing load detecting means and controls the cleaning tool to act on the substrate held by the substrate holding means with a specified pressing load to clean the substrate. Control means for receiving the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. Pressing load measuring means for measuring an actual pressing load from the apparatus, the actual pressing load measured using the pressing load measuring means, and the pressing load incorporated in the substrate cleaning apparatus when measuring the actual pressing load. Using the detection information associating means for associating the detection value from the detecting means with the pressing load measuring means and the detection information associating means, the actual pressing load and the pressing load detecting means are used. Detection information storage means for storing a result obtained by examining the correspondence relationship with the intellectual value for two or more different actual pressing loads, and wherein the cleaning control means detects the pressing load detection means from the pressing load detecting means. Once the value is obtained,
Using a relational expression determined based on the correspondence between the actual pressing load and the detection value from the pressing load detecting means for two or more points stored in the detection information storing means, the detected value obtained A pressure load corresponding to the pressure is obtained, the pressure means is controlled based on the detection information, and the cleaning tool is applied to the substrate with the specified pressure load to clean the substrate. It is.

[0016]

The operation of the method according to the first aspect is as follows. First, the following preparation process is performed in a state where at least the cleaning tool and the pressing unit are incorporated in the substrate cleaning apparatus.

That is, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus, The corresponding relationship with the control value of the pressing means is examined for two or more different actual pressing loads.

For example, the result of the check indicates that the actual pressing load Wi (i
= 1, 2,...), The control value of the pressing means is Ci. The actual pressing loads (W1, W2,
..) And the control values (C1, C2,...) Of the pressing means, the relational expression (C) used in the following substrate cleaning step.
x = f (Wx)).

After the above preparation step, the following substrate cleaning step is performed. That is, the control value (Cx) of the pressing means with respect to the specified pressing load (Wx) is determined based on the correspondence between the actual pressing load and the control value of the pressing means at two or more points examined in the preparation step. The relational expression (Cx = f (W
x)), the pressing means is controlled by the control value (Cx), and the pressing load (W) corresponding to the control value (Cx) is determined.
In x), the cleaning tool is applied to the substrate to clean the substrate. As described above, since the control value of the pressing means for the specified pressing load is obtained only by substituting the specified pressing load into the above-mentioned relational expression, it is possible to cope with a change in the specified pressing load. Therefore, the above preparatory steps are performed first.
If it is performed repeatedly, the substrate can be washed continuously by various pressing loads. Further, since the above relational expression is based on the accuracy of assembling the mechanical part of the device, the accuracy of the control system, and the like, the pressing control can be performed accurately.

When the pressing means is replaced, the correspondence between the actual pressing load and the control value of the pressing means may change. Therefore, after the replacement of the pressing means, the above-mentioned preparation step is performed. The substrate cleaning step can be performed continuously using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means checked in the step.

According to a second aspect of the present invention, the calibration of the pressing load detecting means is performed according to the first aspect of the present invention for a substrate cleaning apparatus provided with a pressing load detecting means for detecting a pressing load of the cleaning tool against the substrate. Using the same principle as the pressing control of the invention described above, the pressing load detecting means is performed in a state of being incorporated in the apparatus.

That is, in the preparatory step, the correspondence between the actual pressing load and the control value of the pressing means is checked for two or more actual pressing loads, and in addition, the correspondence is held by the substrate holding means incorporated in the substrate cleaning apparatus. The correspondence between the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the detected value from the pressing load detecting means incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate to be cleaned is different. Further investigation is made on the actual pressing load above the point.

For example, the result of the check indicates that the actual pressing load Wj (j
= 1, 2,...), The detection value from the pressing load detecting means is Sj. The actual pressing load (W
1, W2,...) And the detection value (S
1, S2,...), A relational expression (Wx = g (Sx)) used in the following substrate cleaning step can be determined.

After the above preparation step, the following substrate cleaning step is performed. That is, in the substrate cleaning step, the pressing control according to the first aspect of the present invention is performed, and when the detection value (Sx) is obtained from the pressing load detecting means, the actual pressing load for two or more points examined in the preparing step is measured. Using the relational expression (Wx = g (Sx)) determined based on the correspondence between the pressure and the detection value from the pressing load detection means, the detection value (S
x) is substituted into the above relational expression to determine a pressing load (Wx) corresponding to the detection value (Sx), and the detection information (Sx =
The substrate is cleaned using Wx). As described above, the calibration of the pressing load detecting means is performed in a state in which the pressing load detecting means is incorporated in the device, so that the correspondence between the actual pressing load and the detection value from the pressing load detecting means is accurate.

Also, when the pressing load detecting means is replaced, if the above-mentioned preparation step is performed after the replacement of the pressing load detecting means, the newly incorporated pressing load detecting means can be calibrated.

According to a third aspect of the present invention, there is provided a substrate cleaning apparatus having a pressing load detecting means for controlling the pressing means based on detection information from the pressing load detecting means.

In the preparatory step according to the third aspect of the present invention, the correspondence between the actual pressing load and the detection value from the pressing load detecting means is determined in the same procedure as the preparatory step according to the second aspect of the present invention. Is checked for two or more actual pressing loads.

In the substrate cleaning step, as in the second aspect of the present invention, when a detection value is obtained from the pressing load detecting means, the actual pressing load and the pressing load detection at two or more points examined in the preparation step are detected. The pressing load corresponding to the obtained detection value is obtained using a relational expression determined based on the correspondence with the detection value from the means. According to the third aspect of the present invention, the pressing means is controlled based on the detection information, and the cleaning tool is applied to the substrate with a specified pressing load to clean the substrate.

The apparatus invention according to a fourth aspect preferably implements the substrate cleaning method according to the first aspect of the present invention, and its operation is as follows.

First, in the preparatory step, the substrate cleaning device is set at the same level as the cleaning surface of the substrate held by the substrate holding device incorporated in the substrate cleaning device using the pressing load measuring means and the control information associating means. The correspondence between the actual pressing load from the cleaning tool incorporated in the apparatus and the control value of the pressing means incorporated in the substrate cleaning apparatus is checked for a predetermined actual pressing load and stored in the control information storage means. Next, for the different actual pressing loads, the correspondence between the actual pressing loads and the control values of the pressing means is checked and stored in the control information storage means in the same manner as described above. This operation is performed twice or more, and the correspondence between the actual pressing load and the control value of the pressing unit is checked for two or more different actual pressing loads and stored in the control information storage unit.
Based on the data stored in the control information storage means, a relational expression used in the following substrate cleaning step can be determined.

The substrate cleaning step is performed by the cleaning control means controlling each component as follows. That is, the control value of the pressing means for the pressing load specified by the pressing load specifying means is determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points stored in the control information storage means. The pressing means is controlled with the control value obtained by using the relational expression obtained, and the cleaning tool is applied to the substrate held by the substrate holding means with a pressing load corresponding to the control value to clean the substrate.

An apparatus invention according to a fifth aspect suitably implements the substrate cleaning method according to the second aspect of the present invention, and its operation is as follows.

That is, in the preparatory step, using the pressing load measuring means and the detection information associating means, the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. The correspondence between the actual pressing load from the cleaning tool incorporated in the substrate and the detection value from the pressing load detecting means incorporated in the substrate cleaning device is further examined for two or more different actual pressing loads, and the detection information is stored. It is stored in the means.

In the substrate cleaning step, when the detection value is obtained from the pressing load detecting means, the cleaning control means detects the actual pressing load and the detection from the pressing load detecting means at two or more points stored in the detection information storing means. A pressing load corresponding to the obtained detection value is obtained using a relational expression determined based on the correspondence with the value, and the substrate is cleaned using the detection information.

The apparatus invention according to claim 6 suitably implements the substrate cleaning method according to the invention described in claim 3, and its operation is as follows.

That is, in the preparatory step, the correspondence between the actual pressing load and the detection value from the pressing load detecting means is examined for two or more different actual pressing loads in the same manner as in the fifth aspect of the present invention. Are stored in the detection information storage means.

In the substrate cleaning step, when the detection value is obtained from the pressing load detecting means, the cleaning control means detects the actual pressing load and the detection from the pressing load detecting means at two or more points stored in the detection information storing means. Using a relational expression determined based on the correspondence relationship with the value, a pressing load corresponding to the obtained detection value is obtained, and the pressing means is controlled based on the detection information, and the cleaning is performed with the specified pressing load. The tool is applied to the substrate to clean the substrate.

[0038]

Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a longitudinal sectional view showing a schematic structure of an entire substrate cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof.

A rotary table 3 for holding a substrate W by vacuum suction is attached to the upper end of a rotary shaft 2 that rotates around a vertical axis by driving an electric motor 1 so as to be integrally rotatable. A substrate holding mechanism 4 for rotatably holding around the core is configured.

The substrate holding mechanism 4 is not limited to the vacuum suction type. For example, a plurality of substrate support members for supporting a plurality of locations on the outer peripheral portion of the substrate W are provided on the turntable 3.
Positioning pins for regulating the horizontal position of the substrate W supported by the substrate supporting member are provided to constitute a substrate holding mechanism, and the substrate W is rotatably held in a state separated from the upper surface of the turntable 3. You may.

The periphery of the substrate holding mechanism 4 and the substrate W held by it are covered with a cup 5 which can be raised and lowered by a lifting drive mechanism (not shown). A nozzle 6 that supplies a cleaning liquid such as pure water to the rotation center side of the substrate W is provided laterally outside the cup 5.

An angle-shaped support arm 7 is provided on the laterally outer side of the cup 5 so as to be rotatable around a first axis P1 in a vertical direction by an electric motor (not shown). A cleaning brush 8 as a cleaning tool for cleaning the surface of the substrate W (the cleaning surface in this embodiment) is provided below the distal end arm portion 7a so as to be rotatable around a second axis P2 in the vertical direction. ing.

As the cleaning brush 8, a nylon brush, mohair brush, sponge, felt, plastic or the like is used.

As shown in the enlarged vertical sectional view of the main part of FIG.
A bearing 9 is provided on the tip side arm portion 7a of the support arm 7.
Rotator 1 rotatably around the second axis P2 through
0, and a pulley 11 and a motor M, which are attached to the rotating body 10 so as to be able to rotate integrally,
Are interlocked and linked. Pulley 1 of rotating body 10
A pair of guide rollers 1 on each side of the guide roller 1
0a is provided, and the guide roller 10a is configured to act on a spline portion 13a formed in the middle of the cleaning tool support 13, so that the cleaning tool support 13 can be moved up and down with low resistance while rotating integrally with the rotating body 10. It is configured as follows. The cleaning brush 8 is integrally attached to the lower end of the cleaning tool support 13.

A spring seat 14 is attached to the cleaning tool support 13 so as to be integrally rotatable, and a compression coil spring 16 is provided over the spring seat 14 and a spring seat 15 attached to the rotating body 10. A weight balancing mechanism 17 is configured to maintain the cleaning brush 8 at a predetermined height with respect to the distal arm 7a in proportion to the weight of the cleaning tool support 13.

A bearing 18 is provided on the upper end of the cleaning tool support 13.
An abutment member 19 is attached so as to be able to rotate only relative to each other, and an air cylinder 20 is provided on an upper side of the distal end arm portion 7a so as to correspond to an upper end of the abutment member 18. The lower end of the cylinder rod 21 is in contact with the contact member 19.

The air cylinder 20 is, as shown in FIG.
A minute gap is formed between the inner peripheral surface of the cylinder 22 and the outer peripheral surfaces of the piston 23 and the cylinder rod 21, respectively. A relief valve 2 capable of setting and changing a relief pressure between a space on the opposite side of the cylinder rod 21 between the piston 23 and the compressor 24.
5 is connected via a first air pipe 26 interposed therebetween, while a space on the side of the cylinder rod 21 between the piston 23 and the compressor 24 is connected to a second air pipe 28 interposed with a fixed quantity valve 27. The air cylinder 20 is configured so as to be able to expand and contract with little resistance in a non-sliding state while being centered by the supply air.

The weight balance mechanism 17 comprising the spring seats 14 and 15 and the compression coil spring 16 and the center of the air cylinder 20 in plan view are provided so as to coincide with the rotation center P2 of the cleaning brush 8. .

As shown in FIG. 3, a sensor arm 29 is integrally attached to the contact member 19, and the sensor arm 29 is provided by the vertical wall of the support arm 7 so that it can only move up and down. A screw member 30 is attached to the tip of the arm 29 for use. Support arm 7
A load cell type pressure sensor 31 is provided at a predetermined position in the inside, and the screw member 30 is configured to come into contact with the pressure sensor 31 by descending.

A magnetic fluid seal 32 and a labyrinth mechanism 33 are provided between the distal arm 7a and the lower part of the rotating body 10.
Is provided so that dust generated by abrasion caused by rotation of the bearing 9 on the upper portion thereof can be prevented from dropping onto the substrate W and the cleaning liquid from entering.

As shown in FIG. 4, a controller 34 is connected to the relief valve 25, and the controller 34 includes a pressing load setting device 35 as pressing load specifying means, and a pressing load adjusting switch constituting detection information associating means. 36, an adjustment confirmation switch 37, and a preparation start command switch 3
8 and a pressure sensor 31 via a load cell amplifier 39. The controller 34 includes a detection information storage memory 40 as a detection information storage unit.

This embodiment is provided with a pressing load measuring device 50 as pressing load measuring means. This will be described with reference to FIGS.

As shown in the exploded perspective view of FIG.
A cylindrical member 42 externally fitted to the rotary shaft 2 is connected to a lower portion of the rotary shaft 2, and a notch 43 formed in the cylindrical member 42 is externally fitted to a positioning pin 44 attached to the rotary shaft 2 and rotated. The central portion of the base 3 is fastened and fixed to the upper end of the rotating shaft 2 by a pair of screws 45, so that the rotating base 3 can be attached to and detached from the rotating shaft 2.

Further, a load member 53 is provided on a support bracket 52 which is provided with a cylindrical member 51 which is fitted to the positioning pin 44 and which can be tightened by a pair of screws 45. By mounting the support bracket 52 on the rotating shaft 2 and placing the load meter 53 on the support bracket 52, the load brush 53 is received by the cleaning brush 8 and pressed so that the actual pressing load from the cleaning brush 8 can be measured. The load measuring device 50 is configured.

Although not shown, the load cell 53 is provided with a load cell for measuring the load therein, and receives the cleaning brush 8 by the load cell and measures the actual pressing load from the cleaning brush 8; A display unit 55 for displaying the measured actual pressing load is provided.

As shown in the side view of the main part in FIG. 6, the surface of the pressure-sensitive portion 54 for receiving the cleaning brush 8 in a state where the pressing load measuring tool 50 is provided on the rotating shaft 2 (see FIG. 6A). Is the substrate W held by the substrate holding mechanism 4 [FIG.
(See (b)).

The pressing load measuring device 50 may be configured as shown in FIG. 7, for example, in addition to the above configuration. In the configuration of FIG. 7, instead of the tubular member 51 provided on the support bracket 52 of FIGS. 5 and 6, a locking member 56 that externally locks the vertical wall 5 a of the cup 5 from above is connected and the screw 57 is connected. The pressing load measuring tool 50 is configured to be tightened and fixed.

Then, the locking member 56 is fixed to the vertical wall 5a of the cup 5 with the cup 5 lowered to the lowermost position, and the load meter 53 is mounted on the support bracket 52, whereby the pressure-sensitive portion 54 is Of the cleaning brush 8 is set to be at the same level as the surface of the substrate W held by the substrate holding mechanism 4. 7A is a plan view of a main part showing a configuration of a modification of the pressing load measuring device 50, and FIG. 7B is a view taken along line AA of FIG. 7A.

With the above configuration, for example, in a state where the apparatus is assembled and set in a factory, the next preparation step including calibration of the pressing load detecting means including the pressure sensor 31 and the load cell amplifier 39 is performed.

That is, the operator first attaches the support bracket 52 to the rotating shaft 2 instead of the turntable 3, and places the load meter 53 on the support bracket 52. Next, the cleaning arm 8 is positioned above the load meter 53 by rotating the support arm 7 around the first axis P1. Then, the preparation start command switch 38 is pressed. When the preparation start command switch 38 is pressed, a predetermined pressing load W1 (for example, 20
The controller 34 sets the relief pressure of the relief valve 25 with the temporarily stored control value so that the cleaning brush 8 presses the pressure-sensitive part 54 of the load meter 53 in g). The operator checks the actual pressing load in this state on the display unit 55 of the load meter 53, and presses the adjustment confirmation switch 37 if the actual pressing load is the same as the pressing load W1. On the other hand, if the actual pressing load is different from the pressing load W1, the pressing load adjusting switch 36 is adjusted so that the actual pressing load becomes the pressing load W1. The pressing load adjusting switch 36 is connected to the relief valve 2.
5 is a switch for giving a command to finely change the control value from the controller 34 for setting the relief pressure of 5 up and down. The controller 34 changes the control value for setting the relief pressure of the relief valve 25 according to a command from the pressing load adjustment switch 36. In response,
The actual pressing load at which the cleaning brush 8 presses the pressure-sensitive portion 54 of the load meter 53 changes. The operator performs adjustment by the pressing load adjustment switch 36 so that the actual pressing load displayed on the display unit 55 of the load meter 53 becomes the same as the above pressing load W1, and the actual pressing load becomes the same as the above pressing load W1. Then, the adjustment confirmation switch 37 is pressed. When the adjustment confirmation switch 37 is pressed, the controller 34 determines at this point that the detected value (S1) from the pressure sensor 31 input to the controller 34 via the load cell amplifier 39 corresponds to the pressing load W1. Detection information storage memory 40
To memorize.

When the adjustment confirmation switch 37 is pressed in the adjustment of the first pressing load W1, the controller 34
Is a control value temporarily stored so that the cleaning brush 8 presses the pressure-sensitive portion 54 of the load meter 53 with a predetermined pressing load W2 (for example, 50 g) different from the initial pressing load W1. Sets the relief pressure of the relief valve 25.
Hereinafter, similarly to the above, the actual pressing load displayed on the display unit 55 of the load meter 53 is adjusted so as to be the same as the pressing load W2, and when the actual pressing load becomes the same as the pressing load W2, an adjustment confirmation switch is set. Press 37. At this time, the controller 34 sets the detection value (S2) from the pressure sensor 31 input to the controller 34 via the load cell amplifier 39 at this time as a value corresponding to the pressing load W2. Store in 40.

As a result, the correspondence between the actual pressing load and the detection value from the pressure sensor 31 (the detection value from the pressing load detecting means) input to the controller 34 via the load cell amplifier 39 differs between two points. This is obtained for the actual pressing load. FIG. 8 is a graph showing this correspondence.

As is clear from the graph shown in FIG. 8, from the correspondence between the actual pressing load obtained for two different actual pressing loads and the detection value from the pressure load detecting means, it is obtained from the pressing load detecting means. The following relational expression (linear expression) for obtaining the actual pressing load (Wx) corresponding to the detection value (Sx)
Is required.

Wx = a × Sx + b (1) where a and b are determined from the correspondence between the actual pressing load obtained for two different actual pressing loads and the detection value from the pressure load detecting means. It is a coefficient.

The actual substrate cleaning step performed after the above-mentioned preparation step is performed as follows. First, the operator first sets the substrate W
Types of films formed on the substrate W (aluminum film, oxide film, nitride film, polysilicon film, pattern film,
Depending on the nature and type of contaminants adhering to the substrate W) and the contaminants adhering to the substrate W, the corresponding pressing load (Ws) during cleaning is designated from the pressure load setting device 35, and the cleaning brush is designated. 8 is positioned off the substrate W. In this state, the controller 34 opens the relief valve 25 and applies a pressing load of the cleaning brush 8 to the substrate W at the time of cleaning the substrate. Along with this, the detection value (Sx) from the pressing load detecting means is input to the controller 34.
When the detection value (Sx) is input from the pressing load detecting means, the controller 34 substitutes the detection value (Sx) into the above equation (1), and presses the pressing load (Wx) corresponding to the detection value (Sx). ). Then, the pressing load (Wx) corresponding to the detection value (Sx) from the pressing load detecting means is compared with the pressing load (Ws) specified by the pressure load setting device 35, and when they match (Wx = Ws), The controller 34 stores the control value for the relief valve 25 at that time.

When the cleaning is started by positioning the cleaning brush 8 on the substrate W, the controller 34 gives the control value stored as described above to the relief valve 25,
Initializing the relief valve 25 so that the relief valve 25 maintains a relief pressure according to the control value, and cleaning the substrate W by pressing the cleaning brush 8 against the substrate W with a specified pressing load (Ws). Is performed. The relief valve 25
By cleaning the substrate W while maintaining a relief pressure corresponding to a specified pressing load (Ws), for example, a height difference due to warpage deformation or the like on the surface of the substrate W held by the substrate holding mechanism 4 is reduced. Even if there is, the pressing load that the cleaning brush 8 presses against the surface of the substrate W is always a specified pressing load over the entire surface of the substrate W, and is always constant regardless of the height difference of the surface of the substrate W. The entire surface of the substrate W can be cleaned while applying a load to the substrate W.

Thereafter, similarly, the substrate W under various pressing loads is
Can be continuously performed. In addition, for example, the pressure sensor 3
1 and the load cell amplifier 39, the sensor arm 29, the screw member 30, and the other members are exchanged, and the correspondence between the actual pressing load stored in the detection information storage memory 40 and the detection value from the pressing load detecting unit changes. In such a case, the above-described preparation step is performed after the replacement of the member (after being incorporated into the apparatus).
Moreover, you may perform the said preparation process regularly. In any case, if the above-described preparation step is performed once, the substrate W can be continuously washed with various pressing loads, thereby improving the processing efficiency and improving the productivity. In this embodiment, the pressure sensor 3
1 and the load cell amplifier 39, the sensor arm 29, the screw member 30, the cleaning brush 8, and other members are incorporated into the apparatus, and then the pressing load detecting means is calibrated. The correspondence relationship is accurate for each device.

In the above embodiment, the pressing load measuring device 5
The correspondence between the actual pressing load measured using 0 and the detected value from the pressing load detecting means is compared with the actual pressing load and the detected value from the pressing load detecting means from the result of examining the actual pressing load at two different points. Of (1) was determined,
For example, the correspondence relationship between the actual pressing load measured using the pressing load measuring tool 50 and the detection value from the pressing load detecting unit is
A more accurate relational expression can be obtained by examining three or more different actual pressing loads and determining a relational expression (linear expression) between the actual pressing load and the detection value from the pressing load detecting means by a method such as the least square method from the results. Is obtained. This modified example can be similarly applied to the case where the relational expression between the actual pressing load and the detection value from the pressing load detecting means is determined in the following embodiments.

The correspondence between the actual pressing load measured by using the pressing load measuring device 50 and the detection value from the pressing load detecting means is not limited to the configuration of the above-described embodiment, for example, by the following configuration. Can also be realized. That is, a setting device capable of setting the actual pressing load is provided, and in the preparation step, the controller 34 controls the pressing unit with a predetermined control value, and calculates the actual pressing load of the cleaning brush 8 by the pressing unit with the control value. It measures with the pressing load measuring tool 50. If the operator sets the measured value (actual pressing load) from the setting device,
The controller 34 grasps the predetermined control value and the actual pressing load set by the setting device, and can associate the two with each other. This modification can be similarly applied to the case where the actual pressing load and the detection value from the pressing load detecting unit are associated with each other in the following embodiments.

<Second Embodiment> The structure of the second embodiment will be described with reference to FIGS. 9 and 10. FIG.

In the device of the second embodiment, the pressure sensor 31, the load cell amplifier 39, the arm 29 for the sensor, and the screw member 30 are omitted from the device of the first embodiment. Alternatively, a control information storage memory 41 is provided, and when a pressing load is designated by the pressing load setting device 35 when the substrate W is washed,
The controller 34 is configured to control the pressing means with a control value corresponding to the pressing load.

Therefore, in the preparation process of the second embodiment, the correspondence between the actual pressing load and the control value of the pressing means is examined.

That is, the preparatory process of the first embodiment is performed in the same manner, and the measurement value (actual pressing load) of the pressing load measuring device 50 is changed to a predetermined pressing load Wi (i = 1, 2,
…)) And press the adjustment confirmation switch 37. Thereby, the controller 34 sets the control value Ci at the time when the adjustment confirmation switch 37 is pressed to the pressing load Wi.
Are stored in the control information storage memory 41 as those corresponding to. In this embodiment, the pressing load adjustment switch 36 and the adjustment confirmation switch 37 constitute a control information association unit in the present invention.

When the correspondence between the actual pressing load and the control value of the pressing means is examined for at least two different actual pressing loads, the specified pressing load (Wx) is obtained as shown in FIG.
The following relational expression (linear expression) for obtaining the control value (Cx) corresponding to the following can be determined.

Cx = c × Wx + d (2) where c and d are coefficients determined from the correspondence between the actual pressing load obtained for two different actual pressing loads and the control value of the pressing means. .

When cleaning the substrate W, the pressing load setting device 3
When the pressing load (Ws) is designated from 5, the controller 34 obtains the control value of the pressing means corresponding to the pressing load (Ws) by the above equation (2). Then, when cleaning is started with the cleaning brush 8 positioned on the substrate W, the controller 34 gives the control value obtained as described above to the pressing means (relief valve 25), and the relief valve 25 Relief valve 25 so as to maintain the relief pressure according to the value.
Is performed, and the cleaning of the substrate W is performed by pressing the cleaning brush 8 against the substrate W with a specified pressing load (Ws). The other configuration is the same as that of the first embodiment, so that the detailed description is omitted.

Also in the second embodiment, the above-described preparation step may be performed when the apparatus is assembled and set in a factory, after replacing parts, or periodically, and after the preparation step is performed. In the method, the substrate W can be continuously washed with various pressing loads, and the processing efficiency is improved and the productivity is improved. Also, since the actual pressing load and the control value of the pressing means are associated after the member is incorporated in the device, the correspondence between the actual pressing load and the control value of the pressing means is accurately determined for each device. It is.

When a relational expression (linear equation) for obtaining a control value corresponding to a specified pressing load is determined, the correspondence between the actual pressing load and the detection value from the pressing means is determined by comparing two different points of actual pressing. You may decide from the result of examining the load,
It may be determined by a method such as the least square method from the result of examining three or more different actual pressing loads. This modified example can be similarly applied to the case where the relational expression between the actual pressing load and the control value of the pressing means is determined in the following embodiments.

The correspondence between the actual pressing load measured using the pressing load measuring device 50 and the control value of the pressing means is also described in terms of the actual pressing load measured using the pressing load measuring device 50 and the pressing load detection. As in the case of the association with the detection value from the means, for example, a setting device that can set the actual pressing load is provided, and in the preparation step, the controller 34 controls the pressing means with a predetermined control value, and The actual pressing load from the cleaning brush 8 by the pressing means at the control value is measured by the pressing load measuring device 5.
The measurement may be performed at 0, and the measured value (actual pressing load) may be set from the setting device so that the two are associated with each other. This modification can be similarly applied to the following embodiment in the case of associating the actual pressing load with the control value of the pressing unit.

<Third Embodiment> A device according to a third embodiment is shown in FIG.
This will be described with reference to FIG.

The device of the third embodiment has a pressure sensor 31,
While omitting the load cell amplifier 39, the sensor arm 29, and the screw member 30, the load cell type pressure sensor 60 is sandwiched between the upper end of the contact member 19 and the lower end of the cylinder rod 21 of the air cylinder 20. attachment,
The pressure sensor 60 detects the pressing load of the cleaning brush 8 with respect to the substrate W at the time of cleaning the substrate W, by receiving a reaction force from the substrate W at the time of cleaning the substrate W. The center of the pressure sensor 60 in plan view is configured to coincide with the rotation center P2 of the cleaning brush 8. Then, at the time of cleaning the substrate W, the controller 34 takes in the detection information from the pressure sensor 60 and controls the pressing means by feedback control so that the specified pressing load is always obtained.

Therefore, in the preparation process of the third embodiment, the correspondence between the actual pressing load and the control value of the pressing means is checked for two or more different actual pressing loads, and the control information storage memory in the controller 34 is checked. 41,
Actual pressing load, pressure sensor 60, load cell amplifier 61
The corresponding relationship with the detection value from the pressing load detecting means is checked for two or more different actual pressing loads, and stored in the detection information storage memory 40 in the controller 34.

The correspondence between the actual pressing load and the control value of the pressing means can be checked by the same configuration as in the second embodiment or its modification, and based on the result, the corresponding pressing load corresponds to the specified pressing load. Relational expression for obtaining control value (Equation (2) above)
Can be determined. In addition, the correspondence between the actual pressing load and the detection value from the pressing load detecting means can be checked by the same configuration as that of the first embodiment or its modified example. A relational expression (formula (1) above) for obtaining the pressing load corresponding to the detected value can be determined. In this embodiment, the pressing load adjustment switch 36 and the adjustment confirmation switch 37 constitute a detection information association unit and a control information association unit in the present invention.

When cleaning the substrate W, the pressing load setting device 3
When the pressing load (Ws) is designated from 5, the controller 34 obtains the control value of the pressing means corresponding to the pressing load (Ws) by the above equation (2). Then, when cleaning is started with the cleaning brush 8 positioned on the substrate W, the controller 34 gives the control value obtained as described above to the pressing means (relief valve 25), and applies the specified pressing load ( W
In step s), the cleaning of the substrate W is performed by pressing the cleaning brush 8 against the substrate W. During the cleaning of the substrate W, the controller 34
Receives the detection value from the pressing load detecting means, finds the pressing load (current pressing load) corresponding to the detected value using the above equation (1), and compares it with the specified pressing load (Ws). When the current pressing load is smaller than the specified pressing load (Ws), the pressing unit is controlled so as to increase the pressing load of the cleaning brush 8 against the substrate W, while the current pressing load is specified. Pressing load (W
When it is larger than s), the pressing means is controlled so as to reduce the pressing load of the cleaning brush 8 on the substrate W. In this way, the pressing load is always applied to the substrate W with the specified pressing load, and the substrate W is uniformly cleaned.

The feedback control may be performed with a certain allowable range. That is, an allowable range between a lower limit pressing load obtained by subtracting a predetermined amount from the specified pressing load (Ws) and an upper limit pressing load obtained by adding a predetermined amount to the specified pressing load (Ws) is determined. Only when it is out of the allowable range, the pressing means is controlled so as to fall within the allowable range.

The other configuration is the same as that of the first and second embodiments, so that the detailed description is omitted. According to the third embodiment, the same effects as those of the first and second embodiments can be obtained.

<Fourth Embodiment> The configuration of the fourth embodiment will be described with reference to FIGS.

In the fourth embodiment, the pressing means in the third embodiment is replaced with a linear actuator 70 and a power supply 71 instead of the air cylinder 20.

The upper end of the contact member 19 has a pressure sensor 60
The operation rod 72 is connected with the operation rod 7 therebetween.
2 is a coil 73 constituting the linear actuator 70
Penetrated inside.

As shown in FIG. 14, the power supply 72 includes a power supply 74 and a variable resistor 75, and the controller 34 adjusts the resistance (control value) of the variable resistor 75 to the coil 73. By changing the flowing current and adjusting the electromagnetic force of the linear actuator 70, the operation rod 72 is moved up and down linearly in the coil 73, so that the pressing load of the cleaning brush 8 against the substrate W can be changed.
Other configurations, operations, and the like are the same as those in the third embodiment, and therefore, detailed description thereof is omitted.

In the first and second embodiments,
The pressing means may be constituted by a linear actuator 70 and a power supply 71 instead of the air cylinder 20. Further, the pressing means of the fifth and sixth embodiments described later is replaced with an air cylinder 20.
May be configured.

<Fifth Embodiment> The structure of the fifth embodiment will be described with reference to FIGS. FIG. 15 is an enlarged vertical sectional view of a main part of the fifth embodiment, and FIG.
5 is a side view, and FIG. 17 is a transverse sectional view.

The apparatus of the fifth embodiment has a cleaning tool support 13
And the rotating body 10 are connected via a pair of upper and lower links 80 so as to form a parallel quadruple link mechanism, and a contact member 81 rotatably attached to the upper end of the cleaning tool support 13 is operated. The rod 72 is in contact with the pressure sensor 60 via the pressure sensor 60. The center of the pressure sensor 60 in plan view is configured to coincide with the rotation center P2 of the cleaning brush 8. Other configurations, operations, and the like are the same as those of the fourth embodiment, and thus detailed description thereof is omitted.

<Sixth Embodiment> The configuration of the sixth embodiment will be described with reference to FIG.

The apparatus of the sixth embodiment is configured as follows. That is, the support cylinder 91 is attached to the device frame 90.
Is rotatably provided via a bearing 92, and a rotary support shaft 93 integrated with one end of the support arm 7 is provided on the support cylinder 91 so as to be able to move only up and down. A pulley 94 is integrally attached to the support cylinder 91, and the pulley 9
4 and an electric motor 95 that can rotate in the forward and reverse directions are linked to each other via a transmission belt 96.

On the other end side of the support arm 7, a cleaning tool support 13 to which the cleaning brush 8 is attached is provided so as to be rotatable only. The cleaning tool support 13 and the electric motor M provided on the support arm 7 are connected to each other. They are linked and connected via a belt type transmission mechanism 97.

A spring seat 98 is attached to the rotation support shaft 93 at an intermediate position, and between the spring seat 98 and the support cylinder 91,
A compression coil spring 99 is provided to urge the rotating shaft 93 upward, and the weight balancing mechanism 100 is configured to maintain the cleaning brush 8 at the cleaning position with respect to the substrate W with a small supporting force in a natural state. ing.

A linear actuator 70 is provided below and corresponding to the rotation support shaft 93, and the rotation support shaft 93 is supported by the operation rod 72 in the coil 73 via the pressure sensor 60. Other configurations, operations, and the like are the same as those of the fourth embodiment, and thus detailed description thereof is omitted.

Note that, instead of the compression coil spring 99, a non-linear spring having a constant repulsive force regardless of the degree of elastic displacement may be used. In this regard, the compression coil springs 16 of the first to fifth embodiments can be similarly applied.

<Seventh Embodiment> The configuration of the seventh embodiment will be described with reference to FIG.

The device of the seventh embodiment is configured as follows. Cleaning tool support 13 inserted into rotating body 10
A little upper than the middle of and the upper side of the rotating body 10, and
A slightly lower side than the middle of the cleaning tool support 13 and a lower side of the rotator 10 are integrally rotatably connected via a stretchable stainless steel first bellows 110.

At the position opposed to the upper end of the cleaning tool support 13, the stopper member 11 is inserted into the distal end arm portion 7 a through a second stainless steel bellows 111 which can be extended and retracted.
2 is provided, and the upper end side of the cleaning tool support 13 is rotatably fitted and held in the stopper member 112. A sealed space S is formed by the distal arm portion 7a, the second bellows 111, and the stopper member 112, and a supply / discharge hole 113 connected to the sealed space S is provided above the distal arm portion 7a. Each of the first and second bellows 110 and 111 may be made of plastic.

A supply source (not shown) of pressurized air is connected to the supply / discharge hole 113 via an air pipe 114, and a pressure gauge 115 as a pressing load detecting means is provided at an intermediate portion of the air pipe 114. Regulator 116 as pressing means
And an on-off valve 117 are interposed to automatically maintain the pressure in the air pipe 114 within a set range.

In the cleaning of the substrate W in the seventh embodiment, the regulator 116 adjusts the pressure in the air pipe 18 by feedback control based on the pressure in the air pipe 114 detected by the pressure gauge 19. The substrate W is cleaned with a specified pressing load.

That is, for example, when the substrate W held by the substrate holding mechanism 4 is warped and has a height difference on its surface, the cleaning brush 8 moves with the rotation of the substrate W and the movement of the cleaning brush 8. 8 causes a change in the pressing load on the substrate W. At a warped portion (high portion) of the substrate W, the pressure gauge 115 detects a pressure higher than the pressure in the air pipe 114 according to the specified pressing load. Therefore, the regulator 116 acts to reduce the pressure in the air pipe 114 so that the pressure in the air pipe 114 becomes a pressure corresponding to the specified pressing load.
The second bellows 111 is contracted. As a result, the cleaning brush 8 supported by the cleaning tool support 13 is raised, and the pressing load of the cleaning brush 8 on the substrate W is maintained at the specified pressing load. On the other hand, at the concave portion (low portion) of the substrate W, the pressure gauge 115 detects a pressure lower than the pressure in the air pipe 114 according to the specified pressing load. The pressure in the pipe 114 is increased, and the second bellows 111 is extended so that the pressure in the air pipe 114 becomes a pressure corresponding to the specified pressing load. As a result, the cleaning brush 8 supported by the cleaning tool support 13 is lowered, and the pressing load of the cleaning brush 8 against the substrate W can be maintained at the specified pressing load. In this feedback control, an allowable range may be provided, and the pressing means may be controlled so as to fall within the allowable range.

In the preparatory step in the seventh embodiment, the correspondence between the actual pressing load and the control value of the regulator 116 is examined for two or more different actual pressing loads, and a control (not shown) in the regulator 116 is performed. While being stored in the information storage memory, the actual pressing load and the pressure gauge 115
The corresponding relationship with the pressure (detected value) in the air pipe 114 detected by the above is checked for two or more different actual pressing loads and stored in a detection information storage memory (not shown) in the regulator 116. Thereby, a relational expression for obtaining a control value corresponding to the designated pressing load and a relational expression for obtaining a pressing load corresponding to the pressure (detection value) in the air pipe 114 detected by the pressure gauge 115 are determined.

When cleaning the substrate W, a pressing load is specified to the regulator 116 from a pressing load setting device (not shown). The regulator 116 obtains a control value corresponding to the specified pressing load by the above-mentioned relational expression, adjusts the pressure in the air pipe 114 by the control value, and causes the cleaning brush 8 to move the substrate W with the specified pressing load. Press on the surface. The other configuration is the same as that of the third embodiment, and the detailed description is omitted.

<Eighth Embodiment> The configuration of the eighth embodiment is shown in FIG.
This will be described with reference to FIG.

The device of the eighth embodiment is similar to the device of the seventh embodiment.
Of the first bellows 11 on the upper side
The upper side of O is closed by a lid member 120 to form a sealed space S1, and the lid member 120 is provided in the distal arm 7a via a seal member 121 so as to be rotatable and vertically movable. Further, the supply / discharge hole 113 formed in the distal arm 7 a and the closed space S <b> 1 are connected to each other through a through hole 122 formed in the lid member 120.

A vacuum suction source (not shown) is connected to the supply / discharge hole 113 via an air pipe 114a, and a pressure gauge 115a and a vacuum regulator 116a are interposed at an intermediate position of the air pipe 114a. The pressure in the air pipe 114a is automatically maintained at a pressure corresponding to the specified pressing load.

In the eighth embodiment, when the weight of the cleaning brush 8 and the cleaning tool support 13 is such that the pressing load applied to the substrate W by itself becomes larger than the specified pressing load, the internal space S1 It has the advantage that it is possible to obtain a specified pressing load by raising the pressure by making the internal pressure negative, canceling a part of the above weight, and obtaining a specified pressing load. When the specified pressing load becomes larger than the above weight, the eighth
As in the embodiment, the air pipe 114a may be connected to a source of pressurized air. Other configurations, operations, and the like are the same as those of the seventh embodiment, and a detailed description thereof will be omitted.

Ninth Embodiment A ninth embodiment of the present invention will be described with reference to FIG. FIG. 21A is an enlarged vertical sectional view of a main part of the ninth embodiment, and FIG. 21B is a horizontal sectional view.

The apparatus according to the ninth embodiment includes a cleaning tool support 13
The middle portion in the longitudinal direction is formed in an oval cross-sectional shape, and the oval portion is provided on the rotating body 10 so as to be able to move only up and down. A compression coil spring 130 driven by air is interposed so that the upper end of the cleaning tool support 13 and the upper part of the tip side arm portion 7a apply a pressing force to the side where the cleaning tool support 13 is lowered. Single acting air cylinder 1
31 and the single-acting air cylinder 131
Is connected to an air pipe 114. Also, the rotating body 1
0 is provided integrally with the lower part of the cleaning tool support 13 by heat welding between the lower part of the cleaning tool support 13 and the lower part of the cleaning tool support 13 for sliding between the rotating body 10 and the cleaning tool support 13. The configuration is such that dust generated by the dropping onto the substrate W and the intrusion of the cleaning liquid can be avoided.
Other configurations, operations, and the like are the same as those of the seventh embodiment, and a detailed description thereof will be omitted.

<Tenth Embodiment> The structure of the tenth embodiment will be described with reference to FIG.

The tenth embodiment differs from the ninth embodiment in that the pressing means and the pressing load detecting means of the sixth embodiment are replaced with those of the ninth embodiment, and the weight balancing mechanism 100 is omitted, and the single-acting air cylinder 131 is omitted. The structure is such that the weight of each member above is received by the single-acting air cylinder 131.
The cylinder rod 140 of the single-acting air cylinder 131 is connected to the lower end of the rotating shaft 93. Note that this tenth
The apparatus of the embodiment may also be provided with a weight balancing mechanism 100. Other configurations, operations, and the like are the same as those in the sixth and ninth embodiments, and a detailed description thereof will be omitted.

The cleaning of the substrate W in each of the above embodiments may be performed while rotating the cleaning brush 8 around the second axis P2, or rotating the cleaning brush 8 around the second axis P2. You may go without doing it.

In each of the above embodiments, in order to clean the entire surface of the substrate W to be rotated with the cleaning brush 8, the support arm 7 is rotated around the first axis P1, and the cleaning brush 8 is rotated. The substrate W is horizontally moved in an arc from the center of the surface of the substrate W to the outer periphery along the surface of the substrate W (reciprocating movement between them as necessary). You may comprise so that it may move.

The present invention can be applied not only to the circular substrate as in the above embodiments but also to a substrate cleaning apparatus for a square substrate.

[0119]

As is apparent from the above description, according to the substrate cleaning method according to the first aspect of the present invention, as a preparation step, cleaning of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus is performed. At the same level as the surface, the correspondence between the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the control value of the pressing means incorporated in the substrate cleaning apparatus is described for two or more different actual pressing loads. It is configured to perform the press control in the subsequent substrate cleaning step using a relational expression determined based on the correspondence between the checked actual press load and the control value of the press means, so that individual Accurate pressing control can be performed according to the assembly accuracy of the mechanical part of the substrate cleaning apparatus, the accuracy of the control system, and the like. Also, the preparation process is when the device is assembled (setting in the factory)
And the replacement of the pressing means, etc., so that the labor required for the operation is reduced, and after the preparation process, the substrate can be continuously washed with various pressing loads, so that the conventional apparatus can be used. It is not necessary to adjust the pressing means every time the pressing load changes, so that the productivity is improved.

According to the substrate cleaning method of the second aspect, the following effect can be obtained in addition to the effect of the first aspect. That is, in the preparation step, the actual pressing load from the cleaning tool incorporated in the substrate cleaning device at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning device, The correspondence between the detected actual pressure load and the detected value from the pressure detection unit is checked for two or more different actual pressure loads. By using a relational expression determined based on the correspondence relation, it is configured to determine the pressing load corresponding to the detection value obtained from the pressing load detecting means, so that the pressing load detecting means is incorporated in the device Thus, the pressing load detecting means can be calibrated, and the correspondence between the actual pressing load and the detection value from the pressing load detecting means becomes accurate. Therefore, the pressing load of the cleaning tool on the substrate can be detected, and the substrate can be cleaned using the detected information with high accuracy.

According to the method for cleaning a substrate according to the third aspect of the present invention, similarly to the second aspect of the invention, the calibration of the pressing load detecting means is performed with the pressing load detecting means incorporated in the apparatus. Can be performed, and the correspondence between the actual pressing load and the detection value from the pressing load detecting means becomes accurate, so that the pressing load of the cleaning tool on the substrate is detected, and the pressing means is controlled based on the detection information. In addition, the substrate can be cleaned with high accuracy by applying the cleaning tool to the substrate with a specified pressing load.

According to the invention set forth in claim 4, claim 1 is provided.
A substrate cleaning apparatus capable of suitably executing the substrate cleaning method according to the invention described in (1) can be realized.

According to the invention set forth in claim 5, according to claim 2,
A substrate cleaning apparatus capable of suitably executing the substrate cleaning method according to the invention described in (1) can be realized.

According to the invention set forth in claim 6, according to claim 3,
A substrate cleaning apparatus capable of suitably executing the substrate cleaning method according to the invention described in (1) can be realized.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a schematic configuration of an entire substrate cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of the entire first embodiment apparatus.

FIG. 3 is an enlarged longitudinal sectional view of a main part of the first embodiment device.

FIG. 4 is a block diagram illustrating a schematic configuration of a control system of the first embodiment.

FIG. 5 is an exploded perspective view showing a configuration of a pressing load measuring device.

FIG. 6 is a longitudinal sectional view showing a configuration of a pressing load measuring device.

FIG. 7 is a plan view of a main part and a view taken along a line AA showing a configuration of a modification of the pressing load measuring device.

FIG. 8 is a graph showing a correspondence relationship between an actual pressing load and a detection value from a pressing load detecting unit.

FIG. 9 is a graph showing the correspondence between the actual pressing load and the control value of the pressing means.

FIG. 10 is a block diagram showing a schematic configuration of a control system of the second embodiment apparatus.

FIG. 11 is an enlarged longitudinal sectional view of a main part of the device of the third embodiment.

FIG. 12 is a block diagram showing a schematic configuration of a control system of the third embodiment.

FIG. 13 is an enlarged longitudinal sectional view of a main part of the device of the fourth embodiment.

FIG. 14 is a block diagram illustrating a schematic configuration of a control system of the fourth embodiment.

FIG. 15 is an enlarged longitudinal sectional view of a main part of the fifth embodiment device.

FIG. 16 is a side view of FIG.

FIG. 17 is a cross-sectional view of the device of the fifth embodiment.

FIG. 18 is a front view, partly omitted, showing the configuration of the device of the sixth embodiment.

FIG. 19 is an enlarged vertical sectional view of a main part of the device of the seventh embodiment.

FIG. 20 is an enlarged vertical sectional view of a main part of the eighth embodiment device.

FIG. 21 is an enlarged vertical sectional view and a horizontal sectional view of a main part of the ninth embodiment device.

FIG. 22 is a partially omitted front view showing the configuration of the tenth embodiment apparatus.

[Explanation of symbols]

 4: substrate holding mechanism 8: cleaning brush 20: air cylinder 31, 60: pressure sensor 34: controller 35: pressing load setting device 36: pressing load adjustment switch 37: adjustment confirmation switch 39, 61: load cell amplifier 40: detection information storage Memory 41: Control information storage memory 50: Pressing load measuring instrument 70: Linear actuator 71: Power supply device 75: Variable resistor 115, 115a: Pressure gauge 116, 116a: Regulator W: Substrate

Claims (6)

[Claims] 1. A substrate cleaning method for arbitrarily specifying a pressing load of a cleaning tool on a substrate, controlling a pressing unit, and applying the cleaning tool to the substrate with the specified pressing load to clean the substrate. At the same level as the cleaning surface of the substrate held by the substrate holding device incorporated in the cleaning device, the actual pressing load from the cleaning tool incorporated in the substrate cleaning device, and the actual pressing load of the pressing device incorporated in the substrate cleaning device. A preparatory step of examining the correspondence between the control value and the actual pressing load at two or more different points, and the control value of the pressing means for the specified pressing load,
Determined using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing unit for two or more points examined in the preparation step, controlling the pressing unit with the control value, A substrate cleaning step of cleaning the substrate by applying the cleaning tool to the substrate with a pressing load according to the control value. 2. The substrate cleaning method according to claim 1, wherein the substrate cleaning apparatus includes a pressing load detecting unit configured to detect a pressing load of the cleaning tool on the substrate, and wherein the preparing step includes the step of: At the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus, and the pressing load detecting means incorporated in the substrate cleaning apparatus In addition to further examining the corresponding relationship with the detected value of the actual pressing load at two or more different points, in the substrate cleaning step, when a detected value is obtained from the pressing load detecting means, the two or more points examined in the preparation step Using a relational expression determined based on the correspondence between the actual pressing load and the detected value from the pressing load detecting means, a pressing load corresponding to the obtained detected value is obtained. And cleaning the substrate using the detection information. 3. A pressing force of the cleaning tool on the substrate is arbitrarily designated, the pressing means is controlled based on detection information from the pressing load detecting means, and the cleaning tool is caused to act on the substrate with the specified pressing load. In the substrate cleaning method for cleaning the substrate, the same pressing load from the cleaning tool incorporated in the substrate cleaning device at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning device, A preparatory step of examining the correspondence between the detected value from the pressing load detecting means incorporated in the substrate cleaning device and the actual pressing load at two or more different points, and when the detected value is obtained from the pressing load detecting means, Using a relational expression determined based on the correspondence between the actual pressing load and the detection value from the pressing load detecting means at two or more points examined in the preparation step, the pressing corresponding to the obtained detection value Determining a weight, controlling the pressing means based on the detection information, and applying the cleaning tool to the substrate with a specified pressing load to clean the substrate. Substrate cleaning method. 4. A substrate holding means for rotatably holding a substrate about a vertical axis; a cleaning tool for cleaning a cleaning surface of the substrate; a pressing load specifying means for specifying a pressing load of the cleaning tool on the substrate; Pressing means for applying the cleaning tool to the substrate with a pressing load specified by the pressing load specifying means; and cleaning the substrate by applying the cleaning tool to the substrate held by the substrate holding means with the specified pressing load. Cleaning control means for controlling the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. Pressing load measuring means for receiving and measuring the actual pressing load from the cleaning tool; the actual pressing load measured by using the pressing load measuring means; and a substrate for measuring the actual pressing load. Control information associating means for associating the control value of the pressing means incorporated in the cleaning device, and the actual pressing load and the control value of the pressing means using the pressing load measuring means and the control information associating means. And control information storage means for storing a result obtained by examining the corresponding relationship with the actual pressing load at two or more different points, and wherein the cleaning control means comprises: Is obtained using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing unit for two or more points stored in the control information storage unit, and the control value Wherein the pressing means is controlled so that the cleaning tool acts on the substrate with a pressing load corresponding to the control value to clean the substrate. 5. The substrate cleaning apparatus according to claim 4, wherein: a pressing load detecting unit configured to detect a pressing load of the cleaning tool on the substrate; an actual pressing load measured using the pressing load measuring unit; Using detection information associating means for associating a detection value from the pressing load detecting means incorporated in the substrate cleaning device when measuring the actual pressing load, with the pressing load measuring means and the detection information associating means; And a detection information storage unit for storing a result of examining a correspondence relationship between the actual pressing load and the detection value from the pressing unit for two or more different actual pressing loads, and When a detection value is obtained from the pressing load detecting unit, the cleaning control unit receives the actual pressing load and the pressing load detecting unit for two or more points stored in the detection information storage unit. Using a relational expression determined based on the correspondence relationship with the detection value, a pressing load corresponding to the obtained detection value is obtained, and the substrate is washed using the detection information. Substrate cleaning device. 6. A substrate holding means for holding a substrate rotatably around a vertical axis, a cleaning tool for cleaning a cleaning surface of the substrate, a pressing load specifying means for specifying a pressing load of the cleaning tool on the substrate, Pressing means for applying the cleaning tool to the substrate with the pressing load; pressing load detecting means for detecting a pressing load of the cleaning tool on the substrate; and controlling the pressing means based on detection information from the pressing load detecting means. Cleaning control means for controlling the substrate held by the substrate holding means to clean the substrate by applying a cleaning tool with a specified pressing load, wherein the cleaning means is incorporated in the substrate cleaning apparatus. Pressing load measuring means for receiving the cleaning tool incorporated in the substrate cleaning apparatus and measuring an actual pressing load from the cleaning tool at the same level as the cleaning surface of the substrate held by the substrate holding means; Detection information associating means for associating the actual pressing load measured using the pressing load measuring means with a detection value from the pressing load detecting means incorporated in the substrate cleaning apparatus when measuring the actual pressing load; And, using the pressing load measuring means and the detection information associating means, the correspondence between the actual pressing load and the detection value from the pressing load detecting means was examined for two or more different actual pressing loads. Detection information storage means for storing a result, and wherein the washing control means, when a detection value is obtained from the pressing load detection means, at least two points stored in the detection information storage means. Using a relational expression determined based on the corresponding relationship between the actual pressing load and the detected value from the pressing load detecting means, a pressing load corresponding to the obtained detected value is obtained, By controlling the pressing means on the basis of broadcast information, substrate cleaning apparatus characterized by being configured so as to clean the substrate by the action of cleaning tools on the substrate at a specified pressing load.