SG10202008012WA - Elastic membrane and substrate holding apparatus - Google Patents

Elastic membrane and substrate holding apparatus

Info

Publication number
SG10202008012WA
SG10202008012WA SG10202008012WA SG10202008012WA SG10202008012WA SG 10202008012W A SG10202008012W A SG 10202008012WA SG 10202008012W A SG10202008012W A SG 10202008012WA SG 10202008012W A SG10202008012W A SG 10202008012WA SG 10202008012W A SG10202008012W A SG 10202008012WA
Authority
SG
Singapore
Prior art keywords
substrate holding
elastic membrane
holding apparatus
membrane
elastic
Prior art date
Application number
SG10202008012WA
Inventor
Cheng Cheng
Togashi Shingo
Fukushima Makoto
Hirokawa Kazuto
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019156988A external-priority patent/JP7344048B2/en
Priority claimed from JP2019156987A external-priority patent/JP2021030409A/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202008012WA publication Critical patent/SG10202008012WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
SG10202008012WA 2019-08-29 2020-08-20 Elastic membrane and substrate holding apparatus SG10202008012WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019156988A JP7344048B2 (en) 2019-08-29 2019-08-29 Elastic membrane and substrate holding device
JP2019156987A JP2021030409A (en) 2019-08-29 2019-08-29 Elastic film, and substrate holding device

Publications (1)

Publication Number Publication Date
SG10202008012WA true SG10202008012WA (en) 2021-03-30

Family

ID=74680588

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202008012WA SG10202008012WA (en) 2019-08-29 2020-08-20 Elastic membrane and substrate holding apparatus

Country Status (5)

Country Link
US (1) US11472001B2 (en)
KR (1) KR20210027116A (en)
CN (1) CN112440204A (en)
SG (1) SG10202008012WA (en)
TW (1) TW202108294A (en)

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6159079A (en) * 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6712673B2 (en) * 2001-10-04 2004-03-30 Memc Electronic Materials, Inc. Polishing apparatus, polishing head and method
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
KR100481872B1 (en) * 2003-01-14 2005-04-11 삼성전자주식회사 Polishing head and chemical mechanical polishing apparatus
JP4086722B2 (en) * 2003-06-24 2008-05-14 株式会社荏原製作所 Substrate holding device and polishing device
KR100586018B1 (en) * 2004-02-09 2006-06-01 삼성전자주식회사 Flexible membrane for a polishing head and chemical mechanical polishing apparatus including the same
JP5112614B2 (en) 2004-12-10 2013-01-09 株式会社荏原製作所 Substrate holding device and polishing device
US8454413B2 (en) * 2005-12-29 2013-06-04 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7959496B2 (en) * 2008-01-03 2011-06-14 Strasbaugh Flexible membrane assembly for a CMP system and method of using
KR20170038113A (en) * 2008-03-25 2017-04-05 어플라이드 머티어리얼스, 인코포레이티드 Carrier head membrane
US10160093B2 (en) * 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
KR101196652B1 (en) * 2011-05-31 2012-11-02 주식회사 케이씨텍 Membrane assembly in carrier head
JP5635482B2 (en) * 2011-11-30 2014-12-03 株式会社荏原製作所 Elastic membrane
KR20130131120A (en) * 2012-05-23 2013-12-03 삼성전자주식회사 A flexible membrane for polishing head
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
JP6165795B2 (en) * 2014-03-27 2017-07-19 株式会社荏原製作所 Elastic film, substrate holding device, and polishing device
US11179823B2 (en) * 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane

Also Published As

Publication number Publication date
CN112440204A (en) 2021-03-05
US20210060725A1 (en) 2021-03-04
KR20210027116A (en) 2021-03-10
US11472001B2 (en) 2022-10-18
TW202108294A (en) 2021-03-01

Similar Documents

Publication Publication Date Title
SG10201502293TA (en) Elastic membrane, substrate holding apparatus, and polishing apparatus
SG10202111430WA (en) Elastic membrane, substrate holding device, and polishing apparatus
EP3751613A4 (en) Display substrate and display apparatus
SG10201606197XA (en) Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
IL287346A (en) Bioreactor device and methods
EP3807050A4 (en) Advanced holding apparatus
EP3841062A4 (en) Devices and methods for water-filtration membranes
GB2571833B (en) Holding apparatus
SG11202007852YA (en) Substrate cleaning device and substrate cleaning method
EP4075511A4 (en) Display substrate and display apparatus
EP3623062A4 (en) Cleaning device and cleaning apparatus
GB2586060B (en) Surface characterisation apparatus and system
EP3860955A4 (en) Bioreactor insert and biofilm support, related apparatus and related methods
EP3778323A4 (en) Positioning device and battery replacement apparatus
EP3794946A4 (en) Elastic support device
SG10201909509UA (en) Substrate cleaning member and substrate cleaning apparatus
EP4075420A4 (en) Display substrate and display device
EP3859335A4 (en) Membrane carrier for test kit and test kit
SG11202011443TA (en) Membrane cleaning device and membrane cleaning method
GB201807052D0 (en) Mounting methhod and apparatus
SG10202008012WA (en) Elastic membrane and substrate holding apparatus
GB202103326D0 (en) Membrane device
EP3515611A4 (en) Methods and apparatus for cleaning substrates
EP4020528A4 (en) Substrate cleaning method and substrate cleaning device
SG10201708713XA (en) Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane