CN108807258B - Semiconductor chip production process - Google Patents
Semiconductor chip production process Download PDFInfo
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- CN108807258B CN108807258B CN201810568949.XA CN201810568949A CN108807258B CN 108807258 B CN108807258 B CN 108807258B CN 201810568949 A CN201810568949 A CN 201810568949A CN 108807258 B CN108807258 B CN 108807258B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor chip production process, which comprises the following steps: putting the wafer on grinding equipment to be ground into a mirror surface; putting the wafer into a high-temperature diffusion furnace for oxidation treatment; coating photoresist on the surface of the wafer, and then putting the wafer into a photoetching machine for exposure and development; sending the wafer into an etching machine for plasma etching; feeding the wafer into a high-temperature furnace for doping; according to the wafer clamping device, the second air spring is arranged below the compression elastic sheet and compresses the swing elastic sheet, so that the wafer is clamped, and the clamping force is soft and reliable; the top of the other end of the clamping block is hinged with the inclined plate, so that the wafer can conveniently enter the clamping block, the wafer can be clamped by one hand, and the clamping efficiency is higher; the rack and the cam which are meshed with each other are arranged below one end of the clamping block, so that the wafer grinding machine is suitable for grinding wafers with different diameters.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor chip production process.
Background
The wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, the wafer is a carrier used for producing the integrated circuit, and the wafer generally refers to a monocrystalline silicon wafer. Wafers are the most commonly used semiconductor materials, and are classified into 4-inch, 5-inch, 6-inch, 8-inch, and so on, according to their diameters, and recently 12-inch and even larger sizes are developed. The larger the wafer is, the more ICs can be produced on the same wafer, so that the cost can be reduced; but the requirements on material technology and production technology are higher, such as problems of uniformity and the like. In wafer fabrication, as the process technology is upgraded and the sizes of the conductive lines and the gate electrodes are reduced, the requirement of the photolithography technology on the flatness of the wafer surface is higher and higher. The grinding consistency of mechanical grinding is good, the surface flatness is high, and the grinding efficiency is high.
Some technical solutions for grinding semiconductor wafers also appear in the prior art, for example, a chinese patent with application number 201710312993.X discloses a wafer grinding apparatus for manufacturing electronic products, which includes a bottom plate, a left frame, a top plate, a grinding frame, a grinding sheet, an adjusting mechanism, and the like; the grinding device comprises a bottom plate, a left frame, a top plate, a rotating mechanism, a grinding frame, an adjusting mechanism, a lifting mechanism and a grinding sheet, wherein the left frame is installed on the left side of the top of the bottom plate, the top end of the left frame is connected with the top plate, the rotating mechanism is installed on the right side of the top of the bottom plate, the rotating mechanism is connected with the grinding frame, the bottom of.
The wafer grinding method of the technical scheme can place different wafers into different adjusting mechanisms and then grind the wafers. However, the mode of clamping the wafer on the grinding disc in the scheme is inconvenient for taking out the wafer, so that the processing efficiency is influenced; during grinding, the wafer can slide in the placing groove, so that the grinding quality of the surface of the wafer is influenced; when wafers with different diameters are ground, the grinding disc needs to be replaced, the model replacement time is long, and the processing efficiency is influenced.
Disclosure of Invention
In order to make up the defects of the prior art, the invention provides a semiconductor chip production process, grinding equipment used in the process is provided with a hinged baffle and an air spring I on one side of a fixed block, a clamping block is arranged on one side of a connecting block, and reliable clamping of a wafer is realized through the mutual cooperation of the clamping block and the hinged baffle; the top of the other end of the clamping block is hinged with the inclined plate, so that the wafer can conveniently enter the clamping block, the wafer can be clamped by one hand, and the clamping efficiency is higher; the first connecting rod and the second connecting rod are arranged below the other end of the clamping block, so that the clamping block can be locked during grinding of the wafer, and the clamping reliability is further ensured; through set up intermeshing's rack and cam below clamping block one end, the cam compresses tightly the centre gripping width that the convex rack meshing realized quick adjustment clamping block, realizes being suitable for the wafer of grinding different diameters.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a semiconductor chip production process, which comprises the following steps:
the method comprises the following steps: putting the wafer on grinding equipment to be ground into a mirror surface;
step two: putting the wafer in the first step into a high-temperature diffusion furnace for oxidation treatment;
step three: coating photoresist on the surface of the wafer in the second step, and then putting the wafer into a photoetching machine for exposure and development;
step four: sending the wafer in the third step into an etching machine for plasma etching;
step five: feeding the wafer obtained in the fourth step into a high-temperature furnace for doping;
the grinding equipment in the first step comprises a grinding sheet, a grinding frame, a grinding disc and a clamping device, wherein the grinding sheet is arranged above the grinding frame and can move up and down; a grinding disc is arranged in the grinding frame; the grinding disc is driven by a motor to rotate, and a group of clamping devices are arranged at the upper end of the grinding disc; the clamping device is used for clamping the wafer during grinding and is radially arranged on the upper surface of the grinding disc; the clamping device comprises a fixed block, a hinged baffle, a first air spring, a clamping block and a connecting block, wherein the bottom surface of the fixed block is fixedly connected to the grinding disc, and a first rectangular groove is formed in one edge of the fixed block; one end of the first air spring is hinged to the notch of the first rectangular groove, and the first air spring is symmetrically arranged along the central line of the first rectangular groove; the other end of the first air spring is fixedly connected with one end of the hinged baffle; the hinged baffles are symmetrically arranged, and the ends of the two hinged baffles are hinged with each other; one side of the clamping block is provided with a V-shaped groove, the clamping block is arranged opposite to the hinged baffle, and the clamping block and the hinged baffle are mutually matched to clamp the wafer; the bottom of one end of the clamping block is hinged with the shoulder of one end of the connecting block, and the top of one end of the clamping block is connected with the top of one end of the connecting block through a spring; the connecting block is arranged opposite to the fixing block, and the bottom surface of the connecting block is fixedly connected to the upper surface of the grinding disc. When the wafer clamping device works, the other end of the clamping block is pressed by a hand, a wafer is placed in the V-shaped groove of the clamping block, the hand for pressing the clamping block is released, one end of the clamping block is tensioned by the spring, the clamping block extrudes the wafer to move towards one side of the hinged baffle, the wafer extrudes the hinged baffle, the hinged baffle swings, the first air spring extends, and when the spring force is balanced with the elastic force of the first air spring, the wafer is clamped; the motor drives the grinding disc to rotate, and the grinding sheet descends to grind the wafer.
Preferably, a second rectangular groove is formed in one side, close to the wafer, of the clamping block; one end of a supporting column is fixedly connected to the bottom surface of the second rectangular groove; the supporting columns are symmetrically arranged, and the other ends of the supporting columns are hinged to the middle of the swing elastic sheet; the two swing elastic pieces are symmetrically arranged, the swing elastic pieces are S-shaped, one ends of the swing elastic pieces are used for pressing the wafer, the ends of the two swing elastic pieces are connected through a spring, and the middle parts of the two swing elastic pieces are connected through a compression elastic piece; the compression elastic sheet is arc-shaped, the two second air springs are arranged corresponding to the swing elastic sheet, the two second air springs are symmetrically arranged, and one end of each second air spring is hinged to the middle of the compression elastic sheet; the other end of the second air spring is hinged to the end head of the swing elastic sheet. When the wafer clamping device works, the other end of the clamping block is pressed by a hand, a wafer is placed on the compression elastic sheet in the clamping block, the hand pressing the clamping block is released, the reaction force of the wafer pair extrudes the compression elastic sheet, the compression elastic sheet deforms and extrudes one end of the second air spring, the other end of the second air spring extrudes the other end of the swing elastic sheet, the swing elastic sheet swings, one end of the swing elastic sheet presses the wafer, and the wafer is clamped after being balanced in stress; through the cooperation of the second air spring and the spring, the wafer is clamped, and the clamping force is soft and reliable.
Preferably, the top of the other end of the clamping block is hinged with a sloping plate. During operation, the inclined plate enables the clamping block to swing when used for clamping a wafer, the wafer can conveniently enter the clamping block, the wafer can be clamped by one hand, and the clamping efficiency is higher.
Preferably, the middle part of the inclined plate is provided with a third rectangular groove; the middle part of the third rectangular groove is provided with a rotating shaft; the rotating shaft slides in a linear groove at one end of the push rod; the other end of the push rod is hinged with one end of a first connecting rod and one end of a second connecting rod; the other end of the first connecting rod is hinged to the middle of the upper surface of the connecting block; the other end of the second connecting rod is hinged to the bottom of the other end of the clamping block. During operation, the wafer is pushed to slide along the inclined plate, one end of the push rod is extruded by the wafer, the push rod pushes the first connecting rod and the second connecting rod to swing, the second connecting rod drives the clamping block to swing, the wafer moves into the clamping block, the clamping block clamps the wafer, the first connecting rod and the second connecting rod are in the same straight line after clamping, the clamping block can be locked during grinding of the wafer, and clamping reliability is further guaranteed.
Preferably, one end of the push rod is provided with a roller; one side of the inclined plate is provided with a pressing elastic sheet; the pressing elastic sheet covers the roller. When the wafer pushing device works, the wafer is pushed to slide along the inclined plate, the wafer extrudes the pressing elastic sheet, the pressing elastic sheet deforms, the pressing elastic sheet extrudes the roller, and the roller pushes the push rod to move; the wafer can slide along the inclined plate more easily by pressing the elastic sheet, and the roller is arranged at one end of the push rod, so that the force is saved when the push rod is extruded by the pressing elastic sheet.
Preferably, the bottom of one end of the clamping block is hinged with one end of the movable rack; the movable rack is meshed with the fixed rack through arc-shaped teeth; the fixed rack is fixedly connected to a shoulder at one end of the connecting block; the smooth surface of the movable rack is contacted with the cam; the cam is rotationally connected to one end of the fixed bracket; and the other end of the fixed support is fixedly connected to the upper surface of the connecting block. When the grinding machine works, if the diameter of the ground wafer is increased, the cam is rotated to ensure that the cam does not extrude the movable rack any more, the movable rack is moved and then is meshed with the fixed rack again, and the cam is rotated to lock the movable rack; the clamping width of the clamping block can be rapidly adjusted by compressing the arc-shaped rack through the cam to be meshed, so that the wafer grinding machine is suitable for grinding wafers with different diameters.
The invention has the following beneficial effects:
1. according to the semiconductor chip production process, the grinding equipment used in the process is provided with the hinged baffle and the first air spring on one side of the fixed block, the clamping block on one side of the connecting block, and the wafer is reliably clamped through the mutual matching action of the clamping block and the hinged baffle.
2. According to the semiconductor chip production process, the grinding equipment used in the process clamps the wafer through the arrangement of the second air spring below the compression elastic sheet and the compression swing elastic sheet of the second air spring under the matching action of the second air spring and the spring, and the clamping force is soft and reliable.
3. According to the semiconductor chip production process, the grinding equipment used in the process is hinged with the inclined plate at the top of the other end of the clamping block, so that wafers can conveniently enter the clamping block, the wafers can be clamped by one hand, and the clamping efficiency is higher.
4. According to the semiconductor chip production process, the first connecting rod and the second connecting rod are arranged below the other end of the clamping block of the grinding equipment used in the process, so that the clamping block can be locked during grinding of a wafer, and the clamping reliability is further guaranteed.
5. According to the semiconductor chip production process, the grinding equipment used in the process is provided with the rack and the cam which are meshed with each other below one end of the clamping block, and the cam compresses the arc-shaped rack to be meshed, so that the clamping width of the clamping block is rapidly adjusted, and the purpose of being suitable for grinding wafers with different diameters is achieved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a front view of the grinding apparatus of the present invention;
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;
FIG. 4 is an enlarged view of FIG. 3 at B and a structural view of the clamping block;
FIG. 5 is a schematic view of another configuration of the clamping block of the grinding apparatus of the present invention;
in the figure: grinding sheet 1, grinding frame 2, grinding disc 3, clamping device 4, fixed block 41, first rectangular groove 411, hinged baffle 42, first air spring 43, clamping block 44, second rectangular groove 441, connecting block 45, supporting column 51, swing elastic sheet 52, compression elastic sheet 53, second air spring 54, inclined plate 61, third rectangular groove 611, rotating shaft 71, push rod 72, first connecting rod 73, second connecting rod 74, roller 81, pressing elastic sheet 82, moving rack 91, fixed rack 92, cam 93 and fixed support 94.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, a semiconductor chip manufacturing process according to the present invention includes the following steps:
the method comprises the following steps: putting the wafer on grinding equipment to be ground into a mirror surface;
step two: putting the wafer in the first step into a high-temperature diffusion furnace for oxidation treatment;
step three: coating photoresist on the surface of the wafer in the second step, and then putting the wafer into a photoetching machine for exposure and development;
step four: sending the wafer in the third step into an etching machine for plasma etching;
step five: feeding the wafer obtained in the fourth step into a high-temperature furnace for doping;
the grinding equipment in the first step comprises a grinding sheet 1, a grinding frame 2, a grinding disc 3 and a clamping device 4, wherein the grinding sheet 1 is arranged above the grinding frame 2, and the grinding sheet 1 can move up and down; a grinding disc 3 is arranged in the grinding frame 2; the grinding disc 3 is driven by a motor to rotate, and a group of clamping devices 4 are arranged at the upper end of the grinding disc 3; the clamping device 4 is used for clamping the wafer during grinding, and the clamping device 4 is radially arranged on the upper surface of the grinding disc 3; the clamping device 4 comprises a fixed block 41, a hinged baffle 42, a first air spring 43, a clamping block 44 and a connecting block 45, the bottom surface of the fixed block 41 is fixedly connected to the grinding disc 3, and a first rectangular groove 411 is formed in one edge of the fixed block 41; the notch of the first rectangular groove 411 is hinged with one end of the first air spring 43, and the first air spring 43 is symmetrically arranged along the central line of the first rectangular groove 411; the other end of the first air spring 43 is fixedly connected with one end of the hinged baffle 42; the hinged baffles 42 are symmetrically arranged, and the ends of the two hinged baffles 42 are hinged with each other; one side of the clamping block 44 is provided with a V-shaped groove, the clamping block 44 is arranged opposite to the hinged baffle 42, and the clamping block 44 and the hinged baffle 42 are mutually matched to clamp the wafer; the bottom of one end of the clamping block 44 is hinged with a shoulder of one end of the connecting block 45, and the top of one end of the clamping block 44 is connected with the top of one end of the connecting block 45 through a spring; the connecting block 45 is arranged opposite to the fixing block 41, and the bottom surface of the connecting block 45 is fixedly connected to the upper surface of the grinding disc 3. When the wafer clamping device works, the other end of the clamping block 44 is pressed by a hand, a wafer is placed in the V-shaped groove of the clamping block 44, the hand pressing the clamping block 44 is released, one end of the clamping block 44 is tensioned by the spring, the clamping block 44 presses the wafer to move towards one side of the hinged baffle 42, the wafer presses the hinged baffle 42, the hinged baffle 42 swings, the first air spring 43 extends, and when the spring force is balanced with the elastic force of the first air spring 43, the wafer is clamped; the motor drives the grinding disc 3 to rotate, and the grinding sheet 1 descends to grind the wafer.
As an embodiment of the present invention, a second rectangular groove 441 is disposed on one side of the clamping block 44 close to the wafer; one end of a supporting column 51 is fixedly connected to the bottom surface of the second rectangular groove 441; the supporting columns 51 are symmetrically arranged, and the other ends of the supporting columns 51 are hinged to the middle of the swing elastic sheets 52; the two swing elastic pieces 52 are symmetrically arranged, the swing elastic piece 52 is S-shaped, one end of the swing elastic piece 52 is used for pressing the wafer, the ends of the two swing elastic pieces 52 are connected through a spring, and the middle parts of the two swing elastic pieces 52 are connected through a compression elastic piece 53; the compression spring piece 53 is arc-shaped, the two second air springs 54 are arranged corresponding to the swing spring piece 52, the two second air springs 54 are symmetrically arranged, and one end of each second air spring 54 is hinged to the middle of the compression spring piece 53; the other end of the second air spring 54 is hinged to the end head of the swing elastic sheet 52. When the wafer clamping device works, the other end of the clamping block 44 is pressed by a hand, a wafer is placed on the compression elastic sheet 53 in the clamping block 44, the hand pressing the clamping block 44 is released, the reaction force of the wafer pair extrudes the compression elastic sheet 53, the compression elastic sheet 53 deforms and extrudes one end of the second air spring 54, the other end of the second air spring 54 extrudes the other end of the swing elastic sheet 52, the swing elastic sheet 52 swings, one end of the swing elastic sheet 52 presses the wafer, and the wafer is clamped after being balanced in stress; the wafer is clamped through the cooperation of the second air spring 54 and the spring, and the clamping force is soft and reliable.
In one embodiment of the present invention, the other end of the clamping block 44 is hinged to a sloping plate 61. During operation, the inclined plate 61 enables the clamping block 44 to swing when used for clamping a wafer, so that the wafer can conveniently enter the clamping block 44, the wafer can be clamped by one hand, and the clamping efficiency is higher.
As an embodiment of the present invention, a third rectangular groove 611 is formed in the middle of the inclined plate 61; the middle part of the third rectangular groove 611 is provided with a rotating shaft 71; the rotating shaft 71 slides in a linear groove at one end of the push rod 72; the other end of the push rod 72 is hinged with one end of a first connecting rod 73 and one end of a second connecting rod 74; the other end of the first connecting rod 73 is hinged to the middle of the upper surface of the connecting block 45; the other end of the second connecting rod 74 is hinged with the bottom of the other end of the clamping block 44. During operation, the wafer is pushed to slide along the inclined plate 61, one end of the push rod 72 is extruded by the wafer, the push rod 72 pushes the first connecting rod 73 and the second connecting rod 74 to swing, the second connecting rod 74 drives the clamping block 44 to swing, the wafer moves into the clamping block 44, the clamping block 44 clamps the wafer, and the clamped first connecting rod 73 and the clamped second connecting rod 74 are located on the same straight line, so that the clamping block 44 can be locked during wafer grinding, and the clamping reliability is further guaranteed.
As an embodiment of the present invention, one end of the push rod 72 is provided with a roller 81; a pressing elastic sheet 82 is arranged on one side of the inclined plate 61; the pressing elastic sheet 82 covers the roller 81. When the wafer pushing device works, the wafer is pushed to slide along the inclined plate 61, the wafer presses the pressing elastic sheet 82, the pressing elastic sheet 82 deforms, the pressing elastic sheet 82 presses the roller 81, and the roller 81 pushes the push rod 72 to move; the wafer can slide along the inclined plate 61 more easily by pressing the elastic sheet 82, and the roller 81 is arranged at one end of the push rod 72, so that the force is saved when the push rod 72 is pressed by the elastic sheet 82.
As an embodiment of the present invention, the bottom of one end of the clamping block 44 is hinged to one end of the moving rack 91; the movable rack 91 is meshed with the fixed rack 92 through arc-shaped teeth; the fixed rack 92 is fixedly connected to a shoulder at one end of the connecting block 45; the smooth surface of the movable rack 91 is contacted with the cam 93; the cam 93 is rotatably connected to one end of the fixed bracket 94; the other end of the fixed bracket 94 is fixedly connected to the upper surface of the connecting block 45. During working, if the diameter of the ground wafer is increased, the cam 93 is rotated to ensure that the cam 93 does not extrude the movable rack 91 any more, the movable rack 91 is moved and then is meshed with the fixed rack 92 again, and the movable rack 91 is locked by the rotating cam 93; the cam 93 is used for pressing the arc-shaped rack to be meshed so as to realize rapid adjustment of the clamping width of the clamping block 44, and further realize the suitability for grinding wafers with different diameters.
When the wafer pushing device is used, the wafer is pushed to slide along the inclined plate 61, the wafer presses the pressing elastic sheet 82, the pressing elastic sheet 82 deforms, the pressing elastic sheet 82 presses the roller 81, and the roller 81 pushes the push rod 72 to move; the wafer can slide along the inclined plate 61 more easily by pressing the elastic sheet 82, and the roller 81 is arranged at one end of the push rod 72, so that the force is saved when the push rod 72 is extruded by the pressing elastic sheet 82; the push rod 72 pushes the first connecting rod 73 and the second connecting rod 74 to swing, the second connecting rod 74 drives the clamping block 44 to swing, and the wafer moves into the clamping block 44; the reaction force of the wafer pair extrudes the compression spring plate 53, the compression spring plate 53 deforms and extrudes one end of the second air spring 54, the other end of the second air spring 54 extrudes the other end of the swing spring plate 52, the swing spring plate 52 swings, and one end of the swing spring plate 52 presses the wafer; the wafer is clamped through the cooperation of the second air spring 54 and the spring, and the clamping force is soft and reliable; one end of the clamping block 44 is tensioned by a spring, the clamping block 44 presses the wafer to move towards one side of the hinged baffle 42, the wafer presses the hinged baffle 42, the hinged baffle 42 swings, the first air spring 43 extends, and when the spring force is balanced with the elastic force of the first air spring 43, the wafer is clamped; the first connecting rod 73 and the second connecting rod 74 are clamped on the same straight line, so that the clamping block 44 can be locked during wafer grinding, and the clamping reliability is further ensured; the motor drives the grinding disc 3 to rotate, and the grinding sheet 1 descends to grind the wafer; if the diameter of the ground wafer is increased, rotating the cam 93 to ensure that the cam 93 does not extrude the movable rack 91 any more, moving the movable rack 91 and then meshing with the fixed rack 92 again, and rotating the cam 93 to lock the movable rack 91; the cam 93 is used for pressing the arc-shaped rack to be meshed so as to realize rapid adjustment of the clamping width of the clamping block 44, and further realize the suitability for grinding wafers with different diameters.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (6)
1. A semiconductor chip production process is characterized in that: the process comprises the following steps:
the method comprises the following steps: putting the wafer on grinding equipment to be ground into a mirror surface;
step two: putting the wafer in the first step into a high-temperature diffusion furnace for oxidation treatment;
step three: coating photoresist on the surface of the wafer in the second step, and then putting the wafer into a photoetching machine for exposure and development;
step four: sending the wafer in the third step into an etching machine for plasma etching;
step five: feeding the wafer obtained in the fourth step into a high-temperature furnace for doping;
the grinding equipment in the first step comprises a grinding sheet (1), a grinding frame (2), a grinding disc (3) and a clamping device (4), wherein the grinding sheet (1) is arranged above the grinding frame (2), and the grinding sheet (1) can move up and down; a grinding disc (3) is arranged in the grinding frame (2); the grinding disc (3) is driven by a motor to rotate, and a group of clamping devices (4) are arranged at the upper end of the grinding disc (3); the clamping device (4) is used for clamping the wafer during grinding, and the clamping device (4) is radially arranged on the upper surface of the grinding disc (3); the clamping device (4) comprises a fixed block (41), a hinged baffle (42), a first air spring (43), a clamping block (44) and a connecting block (45), the bottom surface of the fixed block (41) is fixedly connected to the grinding disc (3), and a first rectangular groove (411) is formed in one edge of the fixed block (41); one end of a first air spring (43) is hinged to the notch of the first rectangular groove (411), and the first air spring (43) is symmetrically arranged along the center line of the first rectangular groove (411); the other end of the first air spring (43) is fixedly connected with one end of the hinged baffle (42); the hinged baffles (42) are symmetrically arranged, and the ends of the two hinged baffles (42) are hinged with each other; one side of the clamping block (44) is provided with a V-shaped groove, the clamping block (44) is arranged opposite to the hinged baffle (42), and the clamping block (44) and the hinged baffle (42) are mutually matched to clamp the wafer; the bottom of one end of the clamping block (44) is hinged with a shoulder of one end of the connecting block (45), and the top of one end of the clamping block (44) is connected with the top of one end of the connecting block (45) through a spring; connecting block (45) and fixed block (41) set up relatively, and connecting block (45) bottom surface fixed connection is on the upper surface of abrasive disc (3).
2. A semiconductor chip production process according to claim 1, characterized in that: a second rectangular groove (441) is formed in one side, close to the wafer, of the clamping block (44); one end of a supporting column (51) is fixedly connected to the bottom surface of the second rectangular groove (441); the supporting columns (51) are symmetrically arranged, and the other ends of the supporting columns (51) are hinged to the middle of the swinging elastic sheets (52); the two swing elastic pieces (52) are symmetrically arranged, the swing elastic pieces (52) are S-shaped, one ends of the swing elastic pieces (52) are used for pressing the wafer, the ends of the two swing elastic pieces (52) are connected through a spring, and the middle parts of the two swing elastic pieces (52) are connected through a compression elastic piece (53); the compression spring plate (53) is arc-shaped, the two second air springs (54) are arranged corresponding to the swing spring plate (52), the two second air springs (54) are symmetrically arranged, and one ends of the second air springs (54) are hinged to the middle of the compression spring plate (53); the other end of the second air spring (54) is hinged to the end head of the swing elastic sheet (52).
3. A semiconductor chip production process according to claim 1, characterized in that: the top of the other end of the clamping block (44) is hinged with a sloping plate (61).
4. A semiconductor chip production process according to claim 3, wherein: a third rectangular groove (611) is formed in the middle of the inclined plate (61); a rotating shaft (71) is arranged in the middle of the third rectangular groove (611); the rotating shaft (71) slides in a linear groove at one end of the push rod (72); the other end of the push rod (72) is hinged with one end of a first connecting rod (73) and one end of a second connecting rod (74); the other end of the first connecting rod (73) is hinged to the middle of the upper surface of the connecting block (45); the other end of the second connecting rod (74) is hinged with the bottom of the other end of the clamping block (44).
5. A semiconductor chip production process according to claim 4, wherein: one end of the push rod (72) is provided with a roller (81); a pressing elastic sheet (82) is arranged on one side of the inclined plate (61); the pressing elastic sheet (82) covers the roller (81).
6. A semiconductor chip production process according to claim 1, characterized in that: the bottom of one end of the clamping block (44) is hinged with one end of the movable rack (91); the movable rack (91) is meshed with the fixed rack (92) through arc-shaped teeth; the fixed rack (92) is fixedly connected to a shoulder at one end of the connecting block (45); the smooth surface of the movable rack (91) is contacted with the cam (93); the cam (93) is rotatably connected to one end of the fixed bracket (94); and the other end of the fixed support (94) is fixedly connected to the upper surface of the connecting block (45).
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004255568A (en) * | 2004-05-14 | 2004-09-16 | Tokyo Seimitsu Co Ltd | Wafer positioning method and apparatus |
| CN101090087A (en) * | 2006-06-14 | 2007-12-19 | 西门子公司 | Clamping device for a wafer |
| CN101728302A (en) * | 2009-12-08 | 2010-06-09 | 中国电子科技集团公司第四十五研究所 | Edge contact clamping type wafer end actuator |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| CN102950536A (en) * | 2011-08-30 | 2013-03-06 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical grinding device and method |
| CN104505364A (en) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | Wafer-rotatable clamping device |
| CN104786139A (en) * | 2014-01-21 | 2015-07-22 | 株式会社荏原制作所 | Substrate holding apparatus and polishing apparatus |
| CN106938436A (en) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5221279B2 (en) * | 2008-10-22 | 2013-06-26 | 株式会社ディスコ | Manufacturing method of laminated device |
-
2018
- 2018-06-05 CN CN201810568949.XA patent/CN108807258B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004255568A (en) * | 2004-05-14 | 2004-09-16 | Tokyo Seimitsu Co Ltd | Wafer positioning method and apparatus |
| CN101090087A (en) * | 2006-06-14 | 2007-12-19 | 西门子公司 | Clamping device for a wafer |
| CN101728302A (en) * | 2009-12-08 | 2010-06-09 | 中国电子科技集团公司第四十五研究所 | Edge contact clamping type wafer end actuator |
| CN102950536A (en) * | 2011-08-30 | 2013-03-06 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical grinding device and method |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| CN104786139A (en) * | 2014-01-21 | 2015-07-22 | 株式会社荏原制作所 | Substrate holding apparatus and polishing apparatus |
| CN104505364A (en) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | Wafer-rotatable clamping device |
| CN106938436A (en) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
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