CN104505364A - Wafer-rotatable clamping device - Google Patents

Wafer-rotatable clamping device Download PDF

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Publication number
CN104505364A
CN104505364A CN201410821519.6A CN201410821519A CN104505364A CN 104505364 A CN104505364 A CN 104505364A CN 201410821519 A CN201410821519 A CN 201410821519A CN 104505364 A CN104505364 A CN 104505364A
Authority
CN
China
Prior art keywords
wafer
clamping device
major axis
clamping
claw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410821519.6A
Other languages
Chinese (zh)
Inventor
刘思佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Kai De Microtronics AS
Original Assignee
Suzhou Kai De Microtronics AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Kai De Microtronics AS filed Critical Suzhou Kai De Microtronics AS
Priority to CN201410821519.6A priority Critical patent/CN104505364A/en
Publication of CN104505364A publication Critical patent/CN104505364A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer-rotatable clamping device, and belongs to the technical field of clamping devices. According to the technical scheme, the wafer-rotatable clamping device is characterized by comprising a long shaft, wherein a shaft sleeve is arranged outside the long shaft; a suspension hole is formed in the upper end of the long shaft; a lower support is arranged at the lower end of the long shaft; a plurality of clamping jaws are movably arranged on the lower support through pin shafts; the upper ends of the clamping jaws are movably connected with the lower ends of diagonal pull rods through the pin shafts; the upper ends of the diagonal pull rods are movably connected with the shaft sleeve through the pin shafts; horizontal clamping arms are arranged at the lower ends of the clamping jaws, and are connected with rotating clamping arms in a matching way. According to the device, the rotating clamping arms are rotated to rotate a wafer according to needs, so that various kinds of detection and cleaning of the wafer can be conveniently realized by once wafer clamping.

Description

The rotatable clamping device of a kind of wafer
Technical field
The present invention relates to the rotatable clamping device of a kind of wafer, belong to clamping device technical field.
Background technology
After wafer completion of processing, need to be fixed by the wafer completed by clamping device, do various detection and cleaning to facilitate, traditional clamping device can not realize once clamping the detection and cleaning object that just can solve wafer two faces.
Summary of the invention
For solving the problems of the technologies described above, overcoming the deficiency that prior art exists, the invention provides the rotatable clamping device of a kind of wafer.
The present invention adopts following technical scheme: the rotatable clamping device of a kind of wafer, it is characterized in that, comprise major axis, described major axis outer setting has axle sleeve, the upper end of described major axis has hanging hole, the lower end of described major axis is provided with lower support, described lower support is movably set with multiple claw by bearing pin, the upper end of described claw is flexibly connected with the lower end of brace by bearing pin, the upper end of described brace is flexibly connected with described axle sleeve by bearing pin, the lower end of described claw is provided with horizontal clamping limb, and described horizontal clamping limb and pivoting holding aims are connected.
Furthermore, the spring washer be locked and nut is provided with between described lower support and described major axis.
Furthermore, described horizontal clamping limb has groove, described pivoting holding aims is provided with the fin with described groove fit near the side of horizontal clamping limb.
Furthermore, described groove is two orthogonal crossing grooves.
Furthermore, the number of described claw is 2.
Furthermore, described claw is provided with reinforcement support bar.
The beneficial effect that the present invention reaches: by once clamping wafer, rotate pivoting holding aims as required, wafer rotates thereupon, thus realize doing various detection and cleaning to wafer easily.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the schematic diagram of a kind of embodiment of horizontal clamping limb upper groove of the present invention.
Fig. 3 is the schematic diagram of a kind of embodiment of pivoting holding aims projection of the present invention.
The implication marked in figure: 1-major axis, 2-axle sleeve, 3-hangs hole, 4-lower support, 5-spring washer, 6-spring, 7-bearing pin, 8-claw, and 9-strengthens support bar, 10-brace, the horizontal clamping limb of 11-, 12-pivoting holding aims, 13-wafer.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1 be structural representation of the present invention, the invention provides the rotatable clamping device of a kind of wafer, comprise major axis 1, major axis 1 outer setting has axle sleeve 2, the upper end of major axis 1 has hanging hole 3, the lower end of major axis 1 is provided with lower support 4, lower support 4 is movably set with multiple claw 8 by bearing pin 7, the upper end of claw 8 is flexibly connected with the lower end of brace 10 by bearing pin 7, the upper end of brace 10 is flexibly connected with axle sleeve 2 by bearing pin 7, the lower end of claw 8 is provided with horizontal clamping limb 11, and described horizontal clamping limb 11 is connected with pivoting holding aims 12.
Preferably, the spring washer 5 be locked and nut 6 is provided with between lower support 4 and major axis 1.
Preferably, the number of claw 8 is 2.
Preferably, claw 8 is provided with reinforcement support bar 9.
Preferably, horizontal clamping limb 11 has groove, pivoting holding aims 12 is provided with the fin with groove fit near the side of horizontal clamping limb 11.
Preferably, groove be two orthogonal crossing grooves 1 as shown in Figures 2 and 3 be the structural representation of a kind of embodiment of groove and the fin of working in coordination, rotate pivoting holding aims 12, wafer 13 rotates thereupon, thus realizes doing various detection and cleaning to wafer 13 easily.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.

Claims (6)

1. the rotatable clamping device of wafer, it is characterized in that, comprise major axis, described major axis outer setting has axle sleeve, the upper end of described major axis has hanging hole, the lower end of described major axis is provided with lower support, described lower support is movably set with multiple claw by bearing pin, the upper end of described claw is flexibly connected with the lower end of brace by bearing pin, the upper end of described brace is flexibly connected with described axle sleeve by bearing pin, the lower end of described claw is provided with horizontal clamping limb, and described horizontal clamping limb and pivoting holding aims are connected.
2. the rotatable clamping device of a kind of wafer according to claim 1, is characterized in that, be provided with the spring washer be locked and nut between described lower support and described major axis.
3. the rotatable clamping device of a kind of wafer according to claim 2, is characterized in that, described horizontal clamping limb has groove, and described pivoting holding aims is provided with the fin with described groove fit near the side of horizontal clamping limb.
4. the rotatable clamping device of a kind of wafer according to claim 3, is characterized in that, described groove is two orthogonal crossing grooves.
5. the rotatable clamping device of a kind of wafer according to claim 1, is characterized in that, the number of described claw is 2.
6. the rotatable clamping device of a kind of wafer according to claim 1, is characterized in that, described claw is provided with reinforcement support bar.
CN201410821519.6A 2014-12-26 2014-12-26 Wafer-rotatable clamping device Pending CN104505364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410821519.6A CN104505364A (en) 2014-12-26 2014-12-26 Wafer-rotatable clamping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410821519.6A CN104505364A (en) 2014-12-26 2014-12-26 Wafer-rotatable clamping device

Publications (1)

Publication Number Publication Date
CN104505364A true CN104505364A (en) 2015-04-08

Family

ID=52947101

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410821519.6A Pending CN104505364A (en) 2014-12-26 2014-12-26 Wafer-rotatable clamping device

Country Status (1)

Country Link
CN (1) CN104505364A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018054382A1 (en) * 2016-09-26 2018-03-29 清华大学 Wafer clamping device
CN108642476A (en) * 2018-06-05 2018-10-12 汪玉洁 A kind of semiconductor chip production modularization CVD reactor
CN108807258A (en) * 2018-06-05 2018-11-13 王青 A kind of semiconductor chip production technology
CN112315677A (en) * 2020-11-23 2021-02-05 清檬养老服务有限公司 Old person's intelligence nursing system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295840A (en) * 1986-06-16 1987-12-23 Shin Meiwa Ind Co Ltd Grip device
CN101520295A (en) * 2008-02-28 2009-09-02 上海华龙测试仪器有限公司 Sample measurement rotation mechanism
CN103192403A (en) * 2012-01-05 2013-07-10 沈阳新松机器人自动化股份有限公司 Clamping device
CN203336146U (en) * 2013-07-03 2013-12-11 辽宁大化国瑞新材料有限公司 Lifting appliance with turnover function
CN204332931U (en) * 2014-12-26 2015-05-13 苏州凯锝微电子有限公司 The rotatable clamping device of a kind of wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295840A (en) * 1986-06-16 1987-12-23 Shin Meiwa Ind Co Ltd Grip device
CN101520295A (en) * 2008-02-28 2009-09-02 上海华龙测试仪器有限公司 Sample measurement rotation mechanism
CN103192403A (en) * 2012-01-05 2013-07-10 沈阳新松机器人自动化股份有限公司 Clamping device
CN203336146U (en) * 2013-07-03 2013-12-11 辽宁大化国瑞新材料有限公司 Lifting appliance with turnover function
CN204332931U (en) * 2014-12-26 2015-05-13 苏州凯锝微电子有限公司 The rotatable clamping device of a kind of wafer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018054382A1 (en) * 2016-09-26 2018-03-29 清华大学 Wafer clamping device
CN108642476A (en) * 2018-06-05 2018-10-12 汪玉洁 A kind of semiconductor chip production modularization CVD reactor
CN108807258A (en) * 2018-06-05 2018-11-13 王青 A kind of semiconductor chip production technology
CN108807258B (en) * 2018-06-05 2020-12-18 日照亿铭科技服务有限公司 Semiconductor chip production process
CN108642476B (en) * 2018-06-05 2020-12-22 林海 Modularized chemical vapor deposition reactor for semiconductor chip production
CN112315677A (en) * 2020-11-23 2021-02-05 清檬养老服务有限公司 Old person's intelligence nursing system

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Application publication date: 20150408