CN220138283U - Silicon carbide wafer positioning device - Google Patents

Abstract

The utility model provides a silicon carbide wafer positioning device which is used for positioning a silicon carbide wafer on a sucker of a spin coater and comprises a base and a sucker positioning piece; the base is ring-shaped and is provided with wafer positioning pieces, each wafer positioning piece is provided with a wafer positioning part for abutting against the circumferential surface of the silicon carbide wafer, and the sucker positioning pieces are arranged on the base along the circumferential direction of the base; the positioning end of the sucker positioning piece is used for abutting the circumferential surface of the sucker, and the hinged end is rotationally connected with the base; utilize the locating end of sucking disc setting element and sucking disc global butt for base and sucking disc concentric setting can place the silicon carbide wafer on the sucking disc this moment, and make the global and wafer location portion butt of silicon carbide wafer, utilize the wafer setting element to make silicon carbide wafer and base concentric setting, and then make silicon carbide wafer and sucking disc concentric setting, realize the accurate location and the putting of high efficiency between silicon carbide wafer and the sucking disc, easy operation can effectively improve efficiency.

Description

Silicon carbide wafer positioning device

Technical Field

The utility model belongs to the technical field of semiconductor industry, and particularly relates to a silicon carbide wafer positioning device.

Background

Silicon carbide is an important semiconductor material and is a source of the industry chain of the semiconductor industry. The spin coating process of the silicon carbide wafer is an important ring in the wafer preparation process, and the quality of the spin coating process directly determines the quality of the subsequent photolithography process and the like.

In the industrialized production of silicon wafers, the spin coating process is generally realized in full-automatic equipment, and in some verification links in a laboratory, the spin coating process often adopts a semi-automatic mode, namely a manual loading and unloading method.

The traditional semiautomatic spin coater needs to manually feed and discharge materials, and the placement position of the silicon carbide wafer needs to be judged by experience during feeding, and the silicon carbide wafer is placed and then is centered by continuously adjusting the feel. The silicon carbide wafer is placed manually, so that the placing position of the silicon carbide wafer is difficult to accurately position, the silicon carbide wafer is difficult to place in the middle of a sucker of a spin coater well, if the placing position of the silicon carbide wafer on the spin coater tray is slightly deviated from the center, the silicon carbide wafer can shake when the spin coater rotates at a high speed, uniformity of spin coater is reduced, and severe shake can also cause problems such as falling and cracking of the silicon carbide wafer.

Disclosure of Invention

The utility model provides a silicon carbide wafer positioning device which can accurately place a silicon carbide wafer into a sucker, is simple to operate and improves efficiency.

The utility model provides a silicon carbide wafer positioning device which is used for positioning a silicon carbide wafer on a sucker of a spin coater and comprises a base and a sucker positioning piece;

the base is ring-shaped and is used for encircling the periphery of the sucker, the base is provided with more than three wafer positioning pieces, and the wafer positioning pieces are distributed on the base along the circumferential direction of the base; each wafer positioning piece is provided with a wafer positioning part used for abutting against the circumferential surface of the silicon carbide wafer, and the wafer positioning parts are positioned on the inner side of the ring of the base;

the sucking disc locating pieces are more than three and are distributed on the base along the circumferential direction of the base; the sucker positioning piece is rod-shaped and is provided with an axially opposite hinging end and a positioning end, the positioning end is used for abutting the circumferential surface of the sucker, and the hinging end is rotationally connected to the base so that the positioning end moves between a first position and a second position; when the positioning end is positioned at the first position, the positioning end is abutted against the circumferential surface of the sucker, and when the positioning end is positioned at the second position, the positioning end is positioned between the base and the wafer positioning part.

The wafer positioning pieces and the sucker positioning pieces are arranged in the same number and in one-to-one correspondence, when the positioning ends are located at the first positions, the wafer positioning portions are located above the sucker positioning pieces, and gaps between the lower edges of the wafer positioning portions and the sucker positioning pieces are smaller than 0.1mm.

The wafer positioning part is arc-shaped and matched with the circumferential surface of the silicon carbide wafer.

The silicon carbide wafer positioning device further comprises a first limiting structure, wherein the first limiting structure is used for limiting the positioning end at the first position; the first limiting structure comprises a first limiting plate and a first magnetic attraction structure arranged between the first limiting plate and the sucker positioning piece, and the first limiting plate is fixed on the wafer positioning piece; when the positioning end moves to a first position, the sucker positioning piece is abutted with the first limiting plate, and the sucker positioning piece and the first limiting plate are adsorbed through the first magnetic structure.

The silicon carbide wafer positioning device further comprises a second limiting structure, wherein the second limiting structure is used for limiting the positioning end at a second position; the second limiting structure comprises a second limiting plate and a second magnetic attraction structure arranged between the second limiting plate and the sucker positioning piece, and the second limiting plate is fixed on the base; when the positioning end moves to the second position, the sucker positioning piece is abutted with the second limiting plate, and the sucker positioning piece and the second limiting plate are adsorbed by the second magnetic structure.

The inner side surface of the base is provided with a limit groove, the limit groove is annular arranged along the circumferential direction of the base, and the hinge end is positioned in the limit groove; when the positioning end is located at the second position, the positioning end is located in the limiting groove.

Wherein the hinged end is rotatably connected to the base through a rotating shaft; the hinge end is fixedly connected with the rotating shaft, and the top end of the rotating shaft protrudes out of the top surface of the base and is connected with a handle.

The silicon carbide wafer positioning device further comprises a linkage mechanism, wherein the linkage mechanism comprises a linkage ring and a plurality of linkage rods; the linkage ring is concentrically arranged with the base and is rotationally connected around the center of the base and the base; one end of each linkage rod is hinged to the linkage ring, the other end of each linkage rod is hinged to the middle position of the sucker locating piece, and the linkage rods are hinged to the locating rods in one-to-one correspondence.

The linkage ring is provided with two linkage handles, the base is provided with two linkage grooves, and the linkage grooves are arc-shaped arranged along the circumferential direction of the base; the two linkage handles penetrate through the two linkage grooves respectively and protrude upwards from the top surface of the base; two fixing rods are fixed on the top surface of the base; when the linkage ring rotates relative to the base, the linkage handle moves in the linkage groove along the circumferential direction of the base and moves close to or away from the fixed rod.

The wafer positioning piece comprises a fixed block and a movable block, one end of the fixed block is connected with the base, the other end of the fixed block is provided with a sliding surface and an adsorption surface, the sliding surface is vertically arranged, the adsorption surface is obliquely arranged below the sliding surface, the top end of the adsorption surface is connected with the sliding surface, and the bottom end of the adsorption surface is close to the base relative to the sliding surface; the movable block comprises a vertical plate and a transverse plate, and the vertical plate and the transverse plate are connected into an L shape; the wafer positioning part is arranged on one side of the vertical plate, which faces the transverse plate, and one side of the vertical plate, which faces away from the transverse plate, is vertically connected with the sliding surface in a sliding manner, the movable block is provided with a higher position and a lower position on a vertical sliding track, an elastic piece is arranged between the movable block and the fixed block, and the elastic piece is used for providing elasticity to enable the movable block to move towards the higher position;

the adsorption surface with be provided with the third magnetism between the riser and inhale the structure, works as the movable block removes to lower position department, the magnetic force of third magnetism inhale the structure makes the movable block upset, the adsorption surface with the riser is connected, the diaphragm orientation the fixed block removes and dislocation mutually in vertical with the carborundum wafer.

According to the silicon carbide wafer positioning device provided by the utility model, the positioning end of the sucker positioning piece is abutted with the circumferential surface of the sucker, so that the base and the sucker are concentrically arranged, at the moment, a silicon carbide wafer can be placed on the sucker, the circumferential surface of the silicon carbide wafer is abutted with the wafer positioning part, the silicon carbide wafer is concentrically arranged with the base by the wafer positioning piece, and the silicon carbide wafer is concentrically arranged with the sucker, so that extremely high-efficiency accurate positioning and placement between the silicon carbide wafer and the sucker are realized; through rotatory sucking disc setting element, can make the locating terminal separate with the global of sucking disc, the locating terminal removes to between base and the wafer location portion for the locating terminal is in the position of vertical avoiding the carborundum wafer, can conveniently upwards remove carborundum wafer positioner this moment, thereby takes out carborundum wafer positioner from the spin coater, later alright begin spin coater operation, easy operation can effectively improve efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments are briefly described below, and the drawings in the following description are only drawings corresponding to some embodiments of the present utility model.

FIG. 1 is a vertical cross-sectional view of a silicon carbide wafer positioning apparatus provided in accordance with a first embodiment of the present utility model;

FIG. 2 is a top view of the silicon carbide wafer positioning apparatus of FIG. 1;

FIG. 3 is a perspective view of the silicon carbide wafer positioning apparatus of FIG. 1;

FIG. 4 is a top view of the silicon carbide wafer positioning device of FIG. 1 in another state;

FIG. 5 is a top perspective view of the silicon carbide wafer positioning device of FIG. 4 in another state;

FIG. 6 is a bottom perspective view of the silicon carbide wafer positioning device of FIG. 4 in another state;

FIG. 7 is a schematic view of a silicon carbide wafer positioning apparatus according to a second embodiment of the present utility model;

FIG. 8 is a transverse cross-sectional view of the silicon carbide wafer positioning device of FIG. 7 at a linkage;

FIG. 9 is a top perspective view of the silicon carbide wafer positioning device of FIG. 7 in another state;

FIG. 10 is a bottom perspective view of the silicon carbide wafer positioning device of FIG. 9 in another state;

FIG. 11 is a transverse cross-sectional view of the silicon carbide wafer positioning device of FIG. 9 in another state with the linkage mechanism;

FIG. 12 is a vertical cross-sectional view of a wafer positioner of a silicon carbide wafer positioning device according to a first embodiment of the present utility model;

FIG. 13 is a schematic view of the wafer positioner of FIG. 12 with the movable block moved to a lower position;

fig. 14 is a schematic view of the movable block of fig. 13 after being flipped.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1, a silicon carbide wafer positioning apparatus according to a preferred embodiment of the present utility model is used for positioning a silicon carbide wafer 90 on a chuck 91 of a spin coater. The spin coater comprises a tray 92 and a sucker 91, wherein the sucker 91 is used for adsorbing and fixing the silicon carbide wafer 90, and the sucker 91 is driven by a motor to drive the sucker 91 and the silicon carbide wafer 90 to rotate; the tray 92 is located at the bottom of the suction cup 91, and the edge of the tray 92 is cylindrical and surrounds the suction cup 91, and when the suction cup 91 and the silicon carbide wafer 90 rotate, the tray 92 can receive and collect the glue flowing out from the silicon carbide wafer 90.

As shown in fig. 1 to 6, the silicon carbide wafer positioning device includes a base 1 and a chuck positioning member 2, the base 1 is used for providing support for the whole silicon carbide wafer positioning device, a wafer positioning member 3 is disposed on the base 1, the chuck positioning member 2 is connected to the base 1, after the chuck positioning member 2 is in positioning connection with the chuck 91, the center of the base 1 and the center of the chuck 91 can be coincident, the silicon carbide wafer 90 can be placed on the inner side of the base 1, the peripheral surface of the silicon carbide wafer 90 is abutted against the wafer positioning member 3, the center of the silicon carbide wafer 90 can be positioned by using the wafer positioning member 3 to be coincident with the center of the base 1, and then the center of the silicon carbide wafer 90 is coincident with the center of the chuck 91.

As shown in fig. 2 to 6, the base 1 is in a circular shape and is used to surround the periphery of the suction cup 91, and the base 1 can be placed on a tray 92 of a spin coater. The base 1 is provided with more than three wafer positioning pieces 3, and the wafer positioning pieces 3 are distributed on the base 1 along the circumferential direction of the base 1; each wafer positioning member 3 has a wafer positioning portion 31 for abutting against the peripheral surface of the silicon carbide wafer 90, the wafer positioning portion 31 being located inside the ring of the susceptor 1; the three wafer positioning portions 31 can determine a circle having the same size as the silicon carbide wafer 90, which is concentrically arranged with the susceptor 1; when the silicon carbide wafer 90 is placed between the three wafer positioning portions 31, the three wafer positioning portions 31 are all abutted against the peripheral surface of the silicon carbide wafer 90, so that the silicon carbide wafer 90 and the susceptor 1 can be concentrically arranged.

The sucker positioning pieces 2 are more than three and are arranged on the base 1 along the circumferential direction of the base 1; the chuck positioning member 2 has a rod shape and has an axially opposite hinge end 21 and a positioning end 22, wherein the positioning end 22 is used for abutting against the circumferential surface of the chuck 91, and the hinge end 21 is rotatably connected to the base 1, so that the positioning end 22 moves between a first position and a second position. When the positioning end 22 is located at the first position, the positioning end 22 is abutted against the circumferential surface of the sucker 91, when all the positioning ends 22 are abutted against the circumferential surface of the sucker 91, the base 1 and the sucker 91 are concentrically arranged, at this time, the silicon carbide wafer 90 can be placed on the sucker 91, and the circumferential surface of the silicon carbide wafer 90 is abutted against the wafer positioning part 31, so that the silicon carbide wafer 90 and the base 1 are concentrically arranged, and further, the silicon carbide wafer 90 and the sucker 91 are concentrically arranged, so that extremely high-efficiency accurate positioning and placement between the silicon carbide wafer 90 and the sucker 91 are realized, shaking of the silicon carbide wafer 90 in the rotating process is avoided, and uniformity of spin coating is improved.

By rotating the suction cup positioning member 2, the positioning end 22 can be separated from the peripheral surface of the suction cup 91 and moved to the second position. When the positioning end 22 is located at the second position, the positioning end 22 is located between the susceptor 1 and the wafer positioning portion 31. After the positioning and placing between the silicon carbide wafer 90 and the suction cup 91 are completed, the positioning end 22 is rotated between the base 1 and the wafer positioning portion 31, so that the positioning end 22 vertically avoids the position of the silicon carbide wafer 90, and at this time, the silicon carbide wafer positioning device can be moved upwards, so that the silicon carbide wafer positioning device is taken out from the spin coater, and then spin coater operation can be started. Before the silicon carbide wafer positioning device is taken out, the negative pressure machine of the sucker 91 can be started first, so that the silicon carbide wafer 90 is adsorbed on the sucker 91, after the silicon carbide wafer and the sucker are firmly fixed, the silicon carbide wafer positioning device is taken out, and the silicon carbide wafer 90 is prevented from being deviated from the central position due to touching when the silicon carbide wafer positioning device is taken out.

The silicon carbide wafer positioning device can accurately position and place the silicon carbide wafer 90, is simple to operate, and has no additional requirements on working experience and the like for users.

The wafer positioning pieces 3 and the sucker positioning pieces 2 are the same in number and are arranged in one-to-one correspondence. In this embodiment, the number of wafer positioning members 3 and the number of chuck positioning members 2 are four, and are arranged at equal intervals along the circumferential direction of the susceptor 1. When the positioning end 22 is positioned at the first position abutting against the chuck 91, the wafer positioning portion 31 is positioned above the chuck positioning member 2, and a gap between the lower edge of the wafer positioning portion 31 and the chuck positioning member 2 is smaller than 0.1mm.

Because the thickness of the silicon carbide wafer 90 is about 1mm or less, when the silicon carbide wafer 90 is positioned and placed, in order to avoid the problem that the silicon carbide wafer 90 is broken due to the fact that the silicon carbide wafer 90 is inserted under the wafer positioning portion 31 carelessly, the sucker positioning piece 2 is arranged under the wafer positioning portion 31, and meanwhile, the gap between the sucker positioning piece 2 and the sucker positioning piece is smaller than the thickness of the silicon carbide wafer 90, and the sucker positioning piece 2 can be used for supporting the silicon carbide wafer 90. When placing the silicon carbide wafer 90, the silicon carbide wafer 90 may be placed in an inclined manner, such that one edge thereof abuts against the junction between the wafer positioning portion 31 and the chuck positioning member 2, the silicon carbide wafer 90 is supported by the chuck positioning member 2, and then the silicon carbide wafer 90 is placed flat and in contact with the chuck 91, such that the edge of the silicon carbide wafer 90 abuts against the wafer positioning portion 31, thereby realizing the positioning of the silicon carbide wafer 90.

The wafer positioning portion 31 is circular arc-shaped and matched with the peripheral surface of the silicon carbide wafer 90, and when the silicon carbide wafer 90 is placed, different positions of the plurality of wafer positioning portions 31 around the silicon carbide wafer 90 are attached to the peripheral surface of the silicon carbide wafer 90, so that accurate positioning of the silicon carbide wafer 90 can be better realized. The plurality of wafer positioning portions 31 are arranged at intervals, so that a user can clamp the silicon carbide wafer 90 by using tweezers or other tools, and the silicon carbide wafer 90 is placed horizontally by utilizing the gaps between the wafer positioning portions 31.

The wafer positioning member 3 includes a fixing member 32, and the fixing member 32 is connected between the wafer positioning portion 31 and the inner surface of the susceptor 1. The fixing member 32 is square, one end of the fixing member is connected with the inner surface of the base 1, the other end of the fixing member is fixedly connected with the wafer positioning portion 31, and the fixing member 32 is connected to the middle position of the wafer positioning portion 31 in the circumferential direction of the base 1, so that the wafer positioning portion 31 maintains good balance.

The silicon carbide wafer positioning device further comprises a first limiting structure and a second limiting structure, wherein the first limiting structure is used for limiting the positioning end 22 at the first position, and the second limiting structure is used for limiting the positioning end 22 at the second position.

As shown in fig. 2, the first limiting structure includes a first limiting plate 41 and a first magnetic attraction structure 51 disposed between the first limiting plate 41 and the chuck positioning member 2, and the first limiting plate 41 is fixed on the wafer positioning member 3. When the positioning end 22 moves to the first position, the sucker positioning member 2 is abutted against the first limiting plate 41, and the sucker positioning member 2 and the first limiting plate are attracted by the first magnetic attraction structure 51, so that the sucker positioning member 2 can be reliably positioned at the first position, and the sucker positioning member 2 is prevented from moving when the silicon carbide wafer 90 is placed.

As shown in fig. 4, the second limiting structure includes a second limiting plate 42 and a second magnetic attraction structure 52 disposed between the second limiting plate 42 and the suction cup positioning member 2, and the second limiting plate 42 is fixed on the base 1. When the positioning end 22 moves to the second position, the sucker positioning piece 2 is abutted against the second limiting plate 42, and the sucker positioning piece 2 and the second limiting plate are adsorbed by the second magnetic attraction structure 52, so that the sucker positioning piece 2 is reliably positioned at the second position, and when the silicon carbide wafer positioning device is taken out, the sucker positioning piece 2 can be prevented from shaking to collide with the silicon carbide wafer 90, and a user can conveniently and quickly take out the silicon carbide wafer positioning device.

The inner side surface of the base 1 is provided with a limit groove 11, the limit groove 11 is annular arranged along the circumferential direction of the base 1, and the hinge end 21 is positioned in the limit groove 11; when the positioning end 22 is located at the second position, the positioning end 22 is located in the limiting groove 11. The two ends of the sucking disc locating piece 2 can be conveniently accommodated by utilizing the limiting groove 11. The second limiting plate 42 is fixed in the limiting groove 11, so that the second limiting plate 42 is firmly and reliably connected with the base 1, and the sucker positioning piece 2 can be well contained in the limiting groove 11.

The bottom surface of sucking disc setting element 2 is vertically higher than the bottom surface of base 1 (i.e. when silicon carbide wafer positioner is in the state of use, sucking disc setting element 2 is greater than the minimum distance of base to ground) when the bottom surface of base 1 meets with the interior bottom surface of tray 92, sucking disc setting element 2 hangs in the top of tray 92, avoids sucking disc setting element 2 and tray 92 contact to make things convenient for the rotation of sucking disc setting element 2 relative to base 1. The top surface of sucking disc setting element 2 and the bottom surface of wafer setting element 3 are all fixed with ring magnet, and when locating end 22 was located second position department, two ring magnets inhale mutually, and two ring magnets are located the position department that is close to wafer location portion 31 relative base 1 internal surface, can provide ascending effort to sucking disc setting element 2 with two ring magnets, avoid sucking disc setting element 2 unsettled clearance between leading to sucking disc setting element 2 and the wafer location portion 31 to be too big.

In this embodiment, the base 1 is in a circular shape, so that the circular space between the circular tray 92 and the suction cup 91 is better utilized, and collision between the base 1 and the tray 92 is avoided.

As shown in fig. 1, the hinged end 21 of the suction cup positioning member 2 is rotatably connected to the base 1 by a rotation shaft 23. The hinge end 21 is fixedly connected with a rotating shaft 23, and the top end of the rotating shaft 23 protrudes out of the top surface of the base 1 and is connected with a handle. By utilizing the handle 24 at the top of the base 1, a user can rotate the handle 24 and drive the positioning rod to rotate through the rotating shaft 23, so that the sucker positioning piece 2 can be conveniently moved to the second position after the silicon carbide wafer 90 is placed, and the use is convenient. Bearings are arranged between the rotating shaft 23 and the base 1 to ensure the rotating stability of the rotating shaft 23 and the positioning rod.

Based on the silicon carbide wafer positioning device provided in the first embodiment, the silicon carbide wafer positioning device provided in the second embodiment of the present utility model may include all the structural features in the first embodiment.

As shown in fig. 7 to 11, in this embodiment, the silicon carbide wafer positioning device further includes a linkage mechanism, and the linkage mechanism is connected to all the chuck positioning members 2 to drive all the positioning rods to rotate together, so as to improve efficiency.

As shown in fig. 8, the link mechanism includes a link ring 61 and a plurality of link rods 62. The link ring 61 is disposed concentrically with the base 1 and rotatably connected around the center of both. One end of each linkage rod 62 is hinged to the linkage ring 61, and the other end of each linkage rod 62 is hinged to the middle position of the sucker positioning piece 2 in a one-to-one correspondence manner. When the linkage ring 61 rotates relative to the base 1, the linkage ring 61 drives the linkage rod 62 to move, and the linkage rod 62 drives the sucker positioning member 2 to rotate, so that the sucker positioning member 2 moves between the first position and the second position.

The link ring 61 is disposed in the limit groove 11 of the base 1 to facilitate relative rotation therebetween. The linkage ring 61 is provided with two linkage handles 63, the base 1 is provided with two linkage grooves 16, and the linkage grooves 16 are arc-shaped arranged along the circumferential direction of the base 1; the two linkage handles 63 respectively penetrate through the two linkage grooves 16 and protrude upwards from the top surface of the base 1; two fixing bars 17 are fixed to the top surface of the base 1. When the link ring 61 rotates relative to the base 1, the link lever 63 moves in the link groove 16 in the circumferential direction of the base 1 and moves closer to or farther from the fixed lever 17. When the positioning end 22 is located at the first position, one of the interlocking handles 63 and one of the fixing bars 17 are located at positions close to each other, and the other interlocking handle 63 and the other fixing bar 17 are located at positions far from each other. When the positioning end 22 is located at the second position, one of the interlocking handles 63 and one of the fixing bars 17 are located at positions distant from each other, and the other interlocking handle 63 and the other fixing bar 17 are located at positions close to each other.

As shown in fig. 7 and 8, when a user holds one of the sets of the interlocking handle 63 and the fixing lever 17 in the mutually distant position by hand so as to move them toward each other, the positioning end 22 can move from the first position to the second position while the other set of the interlocking handle 63 and the fixing lever 17 in the mutually close position moves toward the mutually distant position. When the sucker positioning member 2 needs to be rotated, a user can pinch the cooperation of the group of linkage handles 63 and the fixed rod 17 by hand, so that the two can move close to each other, thereby rotating the sucker positioning member 2 and further facilitating the operation of the user.

The hinge shaft between the base 1 and the sucker positioning piece 2, the hinge shaft between the sucker positioning piece 2 and the linkage rod 62, and the hinge shaft between the linkage rod 62 and the linkage piece are mutually parallel and arranged into a triangle, so that the structure is stable, normal linkage between all the components can be ensured, and the clamping is avoided.

Based on the above-mentioned first and second embodiments, a silicon carbide wafer positioning device according to a third embodiment of the present utility model may include all the structural features of the first and second embodiments, and the differences between the silicon carbide wafer positioning device and the first and second embodiments mainly lie in the structure of the wafer positioning member 3, and the structure of the wafer positioning member 3 is described in detail below.

As shown in fig. 12 to 13, the wafer positioning member 3 includes a fixed block 33 and a movable block 34, one end of the fixed block 33 is connected to the base 1, the movable block 34 is movably connected to the other end of the fixed block 33, and is used for positioning and supporting the edge of the silicon carbide wafer 90, and the wafer positioning portion 31 is disposed on the movable block 34.

The other end of the fixed block 33 is provided with a sliding surface 331 and an adsorption surface 332, the sliding surface 331 is vertically arranged, the adsorption surface 332 is obliquely arranged below the sliding surface 331, the top end of the adsorption surface 332 is connected with the sliding surface 331, and the bottom end of the adsorption surface 332 is close to the base 1 relative to the sliding surface 331.

The movable block 34 comprises a vertical plate 341 and a transverse plate 342, wherein the vertical plate 341 and the transverse plate 342 are connected into an L shape, and the vertical plate 341 and the transverse plate 342 can be formed by splicing two plates or bending one plate. The wafer positioning portion 31 is arranged on one side of the vertical plate 341 facing the transverse plate 342, one side of the vertical plate 341 facing away from the transverse plate 342 is vertically and slidably connected with the sliding surface 331, the movable block 34 has a higher position and a lower position on a vertical sliding track, an elastic piece 35 is arranged between the movable block 34 and the fixed block 33, and the elastic piece 35 is used for providing elastic force to enable the movable block 34 to move towards the higher position.

The third magnetic attraction structure is arranged between the attraction surface 332 and the vertical plate 341, when the movable block 34 moves to a lower position, the movable block 34 is turned over by the magnetic force of the third magnetic attraction structure, the attraction surface 332 is connected with the vertical plate 341, and the transverse plate 342 moves towards the fixed block 33 and is staggered with the silicon carbide wafer 90 in the vertical direction, so that the transverse plate 342 can be moved away from the bottom of the silicon carbide wafer 90, and the whole positioning device can be taken out from the spin coater at the moment.

After the silicon carbide wafer positioning device is placed in the spin coater, the movable block 34 is positioned at a higher position, at this time, the upper surface of the transverse plate 342 is higher than the upper surface of the suction cup 91, at this time, the silicon carbide wafer 90 can be placed in, the transverse plate 342 is supported below the edge of the silicon carbide wafer 90, and the wafer positioning portion 31 of the vertical plate 341 abuts against the peripheral surface of the silicon carbide wafer 90 to position the center position of the silicon carbide wafer 90. After the silicon carbide wafer 90 is positioned by the wafer positioning parts 31 of the movable blocks 34, the silicon carbide wafer 90 is suspended above the sucker 91, the sucker 91 is started at the moment, the suction force generated by the sucker 91 can enable the silicon carbide wafer 90 to move downwards, the silicon carbide wafer 90 drives the movable blocks 34 to move to a lower position, the third magnetic attraction structure drives the movable blocks 34 to turn over, the adsorption surface 332 is connected with the vertical plates 341 to position the movable blocks 34, after the positioning blocks are turned over, the transverse plates 342 move from the outer side of the silicon carbide wafer 90 below the edge of the silicon carbide wafer 90, the positions of the silicon carbide wafer 90 are staggered, and at the moment, the sucker positioning pieces 2 are rotated, so that the whole silicon carbide wafer positioning device can be taken out. After removal, the movable block 34 is manually moved so as to overcome the attraction force of the third magnetic attraction structure and is restored to the upper position by the elastic member 35.

In this embodiment, the L-shaped movable block 34 is used to facilitate placement of the silicon carbide wafer 90, and has a simple structure and convenient use. When the silicon carbide wafer positioning device is taken out, the silicon carbide wafer 90 is not in contact with the movable block 34 due to the overturning of the movable block 34, so that the silicon carbide wafer 90 is not damaged during taking out.

In this embodiment, the elastic member 35 is a spring, one end of the elastic member is fixedly connected with the fixed block 33, the other end of the elastic member is bent to be tubular, and the elastic member is rotatably connected with the vertical plate 341 through the turnover shaft 23, so that the turnover shaft 23 can be used as a rotation center when the movable block 34 is turned over, thereby facilitating the turning over of the movable block 34.

The movable groove is arranged on the fixed block 33, the movable block 34 moves in the movable groove, the bottom surface of the movable groove forms a sliding surface 331, and the movable block 34 can be accommodated and limited by the movable groove, so that the moving stability of the movable block is ensured.

In summary, although the present utility model has been described in terms of the preferred embodiments, the above-mentioned embodiments are not intended to limit the utility model, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the utility model, so that the scope of the utility model is defined by the appended claims.

Claims (10)

1. A silicon carbide wafer positioning device is used for positioning a silicon carbide wafer on a sucker of a spin coater and is characterized by comprising a base and a sucker positioning piece;

the base is ring-shaped and is used for encircling the periphery of the sucker, the base is provided with more than three wafer positioning pieces, and the wafer positioning pieces are distributed on the base along the circumferential direction of the base; each wafer positioning piece is provided with a wafer positioning part used for abutting against the circumferential surface of the silicon carbide wafer, and the wafer positioning parts are positioned on the inner side of the ring of the base;

the sucking disc locating pieces are more than three and are distributed on the base along the circumferential direction of the base; the sucker positioning piece is rod-shaped and is provided with an axially opposite hinging end and a positioning end, the positioning end is used for abutting the circumferential surface of the sucker, and the hinging end is rotationally connected to the base so that the positioning end moves between a first position and a second position; when the positioning end is positioned at the first position, the positioning end is abutted against the circumferential surface of the sucker, and when the positioning end is positioned at the second position, the positioning end is positioned between the base and the wafer positioning part.

2. The silicon carbide wafer positioning device of claim 1, wherein the number of wafer positioning members and the number of chuck positioning members are the same and are arranged in a one-to-one correspondence, and the wafer positioning portion is located above the chuck positioning member when the positioning end is located at the first position, and a gap between a lower edge of the wafer positioning portion and the chuck positioning member is less than 0.1mm.

3. The silicon carbide wafer positioning device of claim 1, wherein the wafer positioning portion is in the shape of a circular arc that mates with the circumferential surface of the silicon carbide wafer.

4. The silicon carbide wafer positioning device of claim 1, further comprising a first stop structure for stopping the positioning end in the first position; the first limiting structure comprises a first limiting plate and a first magnetic attraction structure arranged between the first limiting plate and the sucker positioning piece, and the first limiting plate is fixed on the wafer positioning piece; when the positioning end moves to a first position, the sucker positioning piece is abutted with the first limiting plate, and the sucker positioning piece and the first limiting plate are adsorbed through the first magnetic structure.

5. The silicon carbide wafer positioning device of claim 1, further comprising a second stop structure for stopping the positioning end in a second position; the second limiting structure comprises a second limiting plate and a second magnetic attraction structure arranged between the second limiting plate and the sucker positioning piece, and the second limiting plate is fixed on the base; when the positioning end moves to the second position, the sucker positioning piece is abutted with the second limiting plate, and the sucker positioning piece and the second limiting plate are adsorbed by the second magnetic structure.

6. The silicon carbide wafer positioning device of claim 1, wherein the inner side of the base is provided with a limit groove, the limit groove is annular arranged along the circumferential direction of the base, and the hinge end is positioned in the limit groove; when the positioning end is located at the second position, the positioning end is located in the limiting groove.

7. The silicon carbide wafer positioning device of claim 1, wherein the hinged end is rotatably coupled to the base by a shaft; the hinge end is fixedly connected with the rotating shaft, and the top end of the rotating shaft protrudes out of the top surface of the base and is connected with a handle.

8. The silicon carbide wafer positioning device of claim 1, further comprising a linkage mechanism comprising a linkage ring and a plurality of linkage rods; the linkage ring is concentrically arranged with the base and is rotationally connected around the center of the base and the base; one end of each linkage rod is hinged to the linkage ring, the other end of each linkage rod is hinged to the middle position of the sucker locating piece, and the linkage rods are hinged to the locating rods in one-to-one correspondence.

9. The silicon carbide wafer positioning device of claim 8, wherein two linkage handles are provided on the linkage ring, two linkage grooves are provided on the base, and the linkage grooves are arc-shaped along the circumferential direction of the base; the two linkage handles penetrate through the two linkage grooves respectively and protrude upwards from the top surface of the base; two fixing rods are fixed on the top surface of the base; when the linkage ring rotates relative to the base, the linkage handle moves in the linkage groove along the circumferential direction of the base and moves close to or away from the fixed rod.

10. The silicon carbide wafer positioning device according to claim 1, wherein the wafer positioning member comprises a fixed block and a movable block, one end of the fixed block is connected with the base, the other end of the fixed block is provided with a sliding surface and an adsorption surface, the sliding surface is vertically arranged, the adsorption surface is obliquely arranged below the sliding surface, the top end of the adsorption surface is connected with the sliding surface, and the bottom end of the adsorption surface is close to the base relative to the sliding surface; the movable block comprises a vertical plate and a transverse plate, and the vertical plate and the transverse plate are connected into an L shape; the wafer positioning part is arranged on one side of the vertical plate, which faces the transverse plate, and one side of the vertical plate, which faces away from the transverse plate, is vertically connected with the sliding surface in a sliding manner, the movable block is provided with a higher position and a lower position on a vertical sliding track, an elastic piece is arranged between the movable block and the fixed block, and the elastic piece is used for providing elasticity to enable the movable block to move towards the higher position;

the adsorption surface with be provided with the third magnetism between the riser and inhale the structure, works as the movable block removes to lower position department, the magnetic force of third magnetism inhale the structure makes the movable block upset, the adsorption surface with the riser is connected, the diaphragm orientation the fixed block removes and dislocation mutually in vertical with the carborundum wafer.