CN220116660U - Wafer coating equipment - Google Patents
Wafer coating equipment Download PDFInfo
- Publication number
- CN220116660U CN220116660U CN202321381132.4U CN202321381132U CN220116660U CN 220116660 U CN220116660 U CN 220116660U CN 202321381132 U CN202321381132 U CN 202321381132U CN 220116660 U CN220116660 U CN 220116660U
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- wafer
- fixedly connected
- case
- sliding
- machine case
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- 239000011248 coating agent Substances 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 title claims abstract description 27
- 239000000428 dust Substances 0.000 claims abstract description 39
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000002146 bilateral effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims 5
- 239000012535 impurity Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 54
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000007888 film coating Substances 0.000 description 4
- 238000009501 film coating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses wafer coating equipment which comprises a machine case, a rotating column, clamping plates and ash removing components, wherein the rotating column is vertically and rotatably connected in the machine case, a plurality of sliding grooves are uniformly formed in the circumference of the outer surface of the rotating column, sliding rods are fixedly connected in the sliding grooves, sliding blocks are connected on the sliding rods in a sliding manner, the sliding blocks are vertically and symmetrically arranged, the clamping plates are fixedly connected with the corresponding sliding blocks, the ash removing components are arranged in the machine case and are positioned at the right rear side of the rotating column, and reactors are fixedly arranged on the left inner side wall and the right inner side wall of the machine case; the utility model has the beneficial effects that the uniform coating of the two surfaces of the wafer is convenient to realize; and meanwhile, the dust removal assembly is convenient for the wafer to absorb and clean dust and impurities stained on the surface of the wafer before coating, so that the coating efficiency is higher, and the use is more convenient.
Description
Technical Field
The utility model relates to wafer coating equipment, in particular to wafer coating equipment which is convenient for cleaning dust stained on the surface of a wafer before coating.
Background
With the development of the semiconductor industry, wafers are used as basic materials for manufacturing semiconductor chips, and a skilled person can manufacture various circuit elements by processing the wafers, so the processing and manufacturing of the wafers have been the core field of research. The wafer is used as an optical substrate material, and a film is coated on the wafer to become a basic requirement for improving the optical performance of the wafer.
The utility model provides a wafer coating equipment of patent of publication number CN214797372U, relate to semiconductor manufacturing equipment technical field, including quick-witted case, mounting panel and fixed block, the equal fixedly connected with rack in both sides face of loop bar, the both sides face of fixed block is all rotationally connected with the gear through the pivot, the one end fixedly connected with clamp block that the gear was kept away from to the dwang, the upper end fixedly connected with extension spring of connecting rod, the one end fixedly connected with adapter sleeve that the fixed block was kept away from to the connecting rod, the surface transmission of action wheel is connected with the drive belt. According to the utility model, the clamping or loosening of the wafer is realized by arranging the connecting rod, the loop bar, the tension spring, the fixed block, the rack, the gear, the rotating rod and the clamping block, so that the clamping of the wafer is quicker, the working efficiency can be improved to a certain extent, and the clamping mechanism and the wafer can be driven to slowly rotate by arranging the driving wheel, the driving belt, the driven wheel, the connecting rod and the connecting sleeve, so that the wafer coating film is more uniform, and the production quality is ensured.
According to the scheme, when the wafer is coated in the use process, the wafer needs to be moved to the inside of the case, however, dust and impurities outside the wafer can be stained on the surface of the wafer in the process of moving the wafer, so that uneven films formed on the surface of the wafer are formed in the process of coating, the coating failure is caused, and the coating efficiency is reduced.
Therefore, there is a need to provide a wafer coating apparatus to solve the above technical problems.
Disclosure of Invention
In order to solve the problems, the utility model provides wafer coating equipment, which is realized by the following technical scheme.
The utility model provides a wafer coating equipment, includes quick-witted case, rotation post, grip block and deashing subassembly, the vertical rotation of rotation post is connected at the quick-witted incasement, and rotates the surface circumference of post and evenly offered a plurality of spouts, each equal fixedly connected with slide bar in the spout, sliding connection has the slider on the slide bar, and the slider bilateral symmetry sets up, grip block and the slider fixed connection who corresponds, the deashing subassembly sets up at the quick-witted incasement and is located the positive rear side of rotation post, equal fixed mounting has the reactor on the inside wall about the quick-witted case, and the front side left wall rotation of machine case is connected with sealing door, the bottom four corners department fixedly connected with four sets of rubber slipmats of machine case.
Preferably, the outer surface of the rotating column is fixedly connected with a toothed ring at one end of the top, a rotating motor is fixedly arranged at the top of the case, the head part of an output shaft of the rotating motor penetrates into the case and is fixedly connected with a gear, and the gear is meshed with the toothed ring.
Preferably, springs are sleeved on the sliding rods on the side, away from the sliding blocks, of each sliding block, one end of each spring is fixedly connected with one side of each sliding groove, and the other end of each spring is fixedly connected with each sliding block.
Preferably, an arc-shaped groove is formed in the opposite side of the clamping plate, and an anti-slip layer is coated in the arc-shaped groove.
Preferably, the ash removal subassembly includes lifter plate and dust absorption pipe, the left side of quick-witted incasement rotates and is connected with the lead screw, and the right side fixedly connected with gag lever post of quick-witted incasement, lifter plate's left side end and lead screw threaded connection, lifter plate's right side end and gag lever post sliding connection, dust absorption pipe fixed connection is at lifter plate's front side and bilateral symmetry setting, dust absorption hole has been seted up to dust absorption pipe's opposite one side, and fixed intercommunication has the connecting pipe between two dust absorption pipes.
Preferably, the top of the case is fixedly provided with a lifting motor, the head of an output shaft of the lifting motor penetrates into the case and is fixedly connected with the top end of the screw rod, the top of the case is fixedly provided with a dust collector, and a telescopic pipe is fixedly communicated between an air suction inlet of the dust collector and one of the dust collection pipes.
The beneficial effects of the utility model are as follows:
(1) This wafer coating equipment, when using, place the wafer between two grip blocks to be convenient for carry out the centre gripping fixed to the wafer under the effect of spring, afterwards start rotating electrical machines, drive the rotation post and rotate under the cooperation of gear and ring gear, thereby drive each wafer and slowly rotate, thereby be convenient for realize carrying out even coating film to the both sides of wafer simultaneously, compare and can only carry out the efficiency of one side coating film higher in prior art, it is more convenient to use.
(2) This wafer coating equipment, the deashing subassembly through setting up is convenient for the wafer before carrying out the coating film, absorbs the clearance with dust and the impurity that its surface was infected with to the uneven membrane that leads to its surface to form when having solved its surface dust and impurity and leading to the coating film, leads to its coating film failure, reduces the problem of coating film efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the present utility model, the drawings that are needed in the description of the specific embodiments will be briefly described below, it being obvious that the drawings in the following description are only some examples of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1: is a structural schematic diagram of the prior art;
fig. 2: the integral structure schematic diagram of the utility model;
fig. 3: the front side cross-sectional view of the utility model;
fig. 4: the right side cross-sectional view of the utility model;
fig. 5: the internal structure of the case is schematically shown.
The reference numerals are as follows:
1. a chassis; 11. a reactor; 12. sealing the door; 13. a rubber anti-slip pad; 14. a rotating motor; 15. a gear;
2. rotating the column; 21. a chute; 22. a slide bar; 23. a slide block; 24. a toothed ring; 25. a spring;
3. a clamping plate; 31. an arc-shaped groove;
4. an ash removal component; 41. a lifting plate; 42. a dust collection pipe; 43. a screw rod; 44. a limit rod; 45. a connecting pipe; 46. a lifting motor; 47. a dust collector; 48. and (5) a telescopic pipe.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 2-5, the present utility model provides the following embodiments:
example 1
The utility model provides a wafer coating equipment, including quick-witted case 1, the pivoted post 2, grip block 3 and deashing subassembly 4, the vertical pivoted connection of pivoted post 2 is in quick-witted case 1, and a plurality of spouts 21 have evenly been seted up to the surface circumference of pivoted post 2, equal fixedly connected with slide bar 22 in each spout 21, sliding connection has slider 23 on the slide bar 22, and slider 23 up-and-down symmetry sets up, grip block 3 and the slider 23 fixed connection who corresponds, deashing subassembly 4 sets up in quick-witted case 1 and is located the positive rear side of pivoted post 2, equal fixed mounting has reactor 11 on the inside wall about quick-witted case 1, the front side left wall rotation of machine case 1 is connected with sealing door 12, the bottom four corners department fixedly connected with four sets of rubber slipmats 13 of quick-witted case 1. The stability of the device in the use process is conveniently increased through the arranged rubber anti-slip pad 13.
Further, one end of the outer surface of the rotating column 2, which is positioned at the top, is fixedly connected with a toothed ring 24, the top of the machine case 1 is fixedly provided with a rotating motor 14, and the head of an output shaft of the rotating motor 14 penetrates into the machine case 1 and is fixedly connected with a gear 15, and the gear 15 is meshed with the toothed ring 24. The rotating column 2 is conveniently driven to rotate by the arranged rotating motor 14, the gear 15 and the toothed ring 24, so that a plurality of wafers are more uniform in film coating.
Further, springs 25 are respectively sleeved on the sliding rods 22 on the sides, far away from the sliding blocks 23, of the sliding rods, one ends of the springs 25 are fixedly connected with one sides of the sliding grooves 21, and the other ends of the springs 25 are fixedly connected with the sliding blocks 23. The purpose of clamping and fixing the wafer by the two clamping plates 3 is conveniently achieved through the arranged springs 25.
Further, an arc groove 31 is formed on the opposite side of the clamping plate 3, and an anti-slip layer is coated in the arc groove 31. The arc-shaped groove 31 is convenient for increasing the contact area between the clamping plate 3 and the wafer, and the clamping plate is matched with the coated anti-slip layer to increase the fixing effect on the wafer.
The specific implementation manner of the embodiment is as follows:
when in use, a wafer is placed between the two clamping plates 3, the wafer is clamped and fixed conveniently under the action of the springs 25, then the rotating motor 14 is started, the rotating column 2 is driven to rotate under the cooperation of the gears 15 and the toothed rings 24, and each wafer is driven to slowly rotate, so that the two sides of the wafer are uniformly coated simultaneously, and the device is higher in efficiency and more convenient to use compared with the prior art that only one side of the wafer can be coated.
Example two
The difference from the first embodiment is that the following is included:
the ash removal subassembly 4 includes lifter plate 41 and dust absorption pipe 42, and the left side in the quick-witted case 1 rotates and is connected with lead screw 43, and the right side fixedly connected with gag lever post 44 in the quick-witted case 1, and lifter plate 41's left side end and lead screw 43 threaded connection, lifter plate 41's right side end and gag lever post 44 sliding connection, dust absorption pipe 42 fixed connection are at lifter plate 41's front side and bilateral symmetry setting, and dust absorption hole has been seted up to dust absorption pipe 42's opposite side, and fixed intercommunication has connecting pipe 45 between two dust absorption pipes 42. The lifting plate 41 can be conveniently and better reciprocated up and down by the limiting rod 44.
Further, a lifting motor 46 is fixedly installed at the top of the chassis 1, the head of an output shaft of the lifting motor 46 penetrates into the chassis 1 and is fixedly connected with the top end of the screw rod 43, a dust collector 47 is fixedly installed at the top of the chassis 1, and a telescopic pipe 48 is fixedly communicated between an air suction inlet of the dust collector 47 and one of the dust collection pipes 42.
In this embodiment:
when the wafer clamping and fixing are finished and before film coating, starting a rotating motor 14, driving one wafer to be positioned between two dust collection pipes 42 by the rotating motor 14, then starting a lifting motor 46 to rotate, driving a lifting plate 41 to reciprocate up and down by the lifting motor 46, meanwhile starting a dust collector 47, cleaning two sides of the wafer by the dust collector 47 through a telescopic pipe 48, a connecting pipe 45 and dust collection holes, controlling the lifting plate 41 to move to the top in a case 1 through the lifting motor 46 after the cleaning of one wafer is finished, then rotating the rotating motor 14, driving the next wafer to move between the two dust collection pipes 42, and repeating the operations to finish the cleaning of a plurality of wafers; the ash removal assembly 4 is convenient for the wafer to absorb and clean dust and impurities stained on the surface of the wafer before the wafer is coated, so that the problems that the film formed on the surface of the wafer is uneven, the film coating is failed and the film coating efficiency is reduced due to the uneven film formed on the surface of the wafer when the wafer is coated due to the dust and the impurities stained on the surface of the wafer are solved.
The preferred embodiments of the utility model disclosed above are intended only to assist in the explanation of the utility model. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and the full scope and equivalents thereof.
Claims (6)
1. The wafer coating equipment is characterized in that: including quick-witted case (1), pivoted post (2), grip block (3) and deashing subassembly (4), pivoted post (2) vertical rotation is connected in quick-witted case (1), and pivoted post (2)'s surface circumference evenly has offered a plurality of spouts (21), each equal fixedly connected with slide bar (22) in spout (21), sliding connection has slider (23) on slide bar (22), and slider (23) bilateral symmetry sets up, grip block (3) and slider (23) fixed connection who corresponds, deashing subassembly (4) set up in quick-witted case (1) and are located the positive rear side of pivoted post (2), equal fixed mounting has reactor (11) on the inside wall about quick-witted case (1), and the front side left wall rotation of machine case (1) is connected with sealing door (12), and the bottom four corners department fixedly connected with four sets of rubber slipmats (13) of machine case (1).
2. The wafer plating apparatus according to claim 1, wherein: the outer surface of the rotating column (2) is fixedly connected with a toothed ring (24) at one end of the top, a rotating motor (14) is fixedly arranged at the top of the machine case (1), the head of an output shaft of the rotating motor (14) penetrates into the machine case (1) and is fixedly connected with a gear (15), and the gear (15) is meshed with the toothed ring (24).
3. The wafer plating apparatus according to claim 1, wherein: the sliding rod (22) on one side far away from the sliding block (23) is sleeved with springs (25), one end of each spring (25) is fixedly connected with one side of the sliding groove (21), and the other end of each spring (25) is fixedly connected with the sliding block (23).
4. The wafer plating apparatus according to claim 1, wherein: an arc-shaped groove (31) is formed in the opposite side of the clamping plate (3), and an anti-slip layer is coated in the arc-shaped groove (31).
5. The wafer plating apparatus according to claim 1, wherein: the ash removal subassembly (4) is including lifter plate (41) and dust absorption pipe (42), the left side rotation in quick-witted case (1) is connected with lead screw (43), right side fixedly connected with gag lever post (44) in machine case (1), the left side end and the lead screw (43) threaded connection of lifter plate (41), the right side end and gag lever post (44) sliding connection of lifter plate (41), dust absorption pipe (42) fixed connection is at the front side of lifter plate (41) and bilateral symmetry sets up, dust absorption hole has been seted up to the opposite one side of dust absorption pipe (42), and fixed intercommunication has connecting pipe (45) between two dust absorption pipes (42).
6. The wafer plating apparatus according to claim 5, wherein: the top of the case (1) is fixedly provided with a lifting motor (46), the head of an output shaft of the lifting motor (46) penetrates into the case (1) and is fixedly connected with the top end of the screw rod (43), the top of the case (1) is fixedly provided with a dust collector (47), and a telescopic pipe (48) is fixedly communicated between an air suction inlet of the dust collector (47) and one of the dust collection pipes (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321381132.4U CN220116660U (en) | 2023-06-01 | 2023-06-01 | Wafer coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321381132.4U CN220116660U (en) | 2023-06-01 | 2023-06-01 | Wafer coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220116660U true CN220116660U (en) | 2023-12-01 |
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ID=88914142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321381132.4U Active CN220116660U (en) | 2023-06-01 | 2023-06-01 | Wafer coating equipment |
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| Country | Link |
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| CN (1) | CN220116660U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117555099A (en) * | 2024-01-12 | 2024-02-13 | 扬州紫王优卫科技有限公司 | Optical filter coating device |
-
2023
- 2023-06-01 CN CN202321381132.4U patent/CN220116660U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117555099A (en) * | 2024-01-12 | 2024-02-13 | 扬州紫王优卫科技有限公司 | Optical filter coating device |
| CN117555099B (en) * | 2024-01-12 | 2024-03-26 | 扬州紫王优卫科技有限公司 | Optical filter coating device |
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