WO2007029545A1 - 触媒付与増強剤 - Google Patents
触媒付与増強剤 Download PDFInfo
- Publication number
- WO2007029545A1 WO2007029545A1 PCT/JP2006/316890 JP2006316890W WO2007029545A1 WO 2007029545 A1 WO2007029545 A1 WO 2007029545A1 JP 2006316890 W JP2006316890 W JP 2006316890W WO 2007029545 A1 WO2007029545 A1 WO 2007029545A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- catalyst
- enhancer
- palladium
- conductive
- tin
- Prior art date
Links
- 239000003054 catalyst Substances 0.000 title claims abstract description 83
- 239000003795 chemical substances by application Substances 0.000 title abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000012811 non-conductive material Substances 0.000 claims abstract description 20
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims abstract description 14
- 125000001302 tertiary amino group Chemical group 0.000 claims abstract description 13
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- 239000004480 active ingredient Substances 0.000 claims abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 44
- 239000003623 enhancer Substances 0.000 claims description 36
- 150000001875 compounds Chemical class 0.000 claims description 22
- 229910052763 palladium Inorganic materials 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 239000004431 polycarbonate resin Substances 0.000 claims description 3
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 18
- 238000000576 coating method Methods 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 238000001556 precipitation Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 11
- 230000003750 conditioning effect Effects 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 238000004065 wastewater treatment Methods 0.000 description 7
- 229920002873 Polyethylenimine Polymers 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000000872 buffer Substances 0.000 description 3
- 239000007853 buffer solution Substances 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910002677 Pd–Sn Inorganic materials 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- -1 primary amine compound Chemical class 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Definitions
- the present invention relates to a catalyst imparting enhancer, and more particularly, to a catalyst imparting enhancer that is particularly advantageously used as a conditioner in direct plating that directly attaches to a non-conductive material such as plastic. It relates to the agent.
- PdZSn colloidal catalyst a palladium Z tin colloid catalyst
- PCZABS resin the material strength of the covering of direct plating ABS resin based alloy polymer represented by PCZABS resin (hereinafter referred to as “PCZABS resin”) obtained by blending polycarbonate resin with ABS resin
- PCZABS resin PCZABS resin
- a conditioning treatment is required before the catalyst application treatment in order to increase the concentration of the catalyst and enhance the adsorption of the catalyst.
- unnecessary metal deposition plating
- it is essential to replace the jig when plating is performed, and the plating in the in-rack system is required. Virtually impossible.
- Patent Document 1 Japanese Patent Laid-Open No. 5-148692
- Patent Document 2 JP-A-6-10197
- the present inventor uses a substance having various forms of an amino group as a conditioner, so that the rack can be obtained even when the catalyst concentration is high. Amount of catalyst adsorbed on cured polysalt vinyl sol as a coating material The present inventors have found that only the amount of catalyst adsorbed on a plastic such as PCZABS to be plated can be increased without increasing the amount.
- the present invention is a catalyst imparting enhancer comprising, as an active ingredient, a polymer compound containing primary, secondary, and tertiary amino groups.
- the present invention provides a first grade non-conductive material prior to the application of palladium Z tin colloid catalyst.
- Palladium Z applied for the conductive treatment of non-conductive materials characterized by being treated with a catalyst imparting enhancer comprising a polymer compound containing secondary and tertiary amino groups as an active ingredient
- a catalyst imparting enhancer comprising a polymer compound containing secondary and tertiary amino groups as an active ingredient
- the non-conductive material is processed before the PdZSn colloid catalyst application, thereby increasing the amount of colloidal catalyst adsorbed on the insulating coating of the jig. Only the amount of catalyst adsorption on the conductor material can be increased.
- the catalyst imparting enhancer of the present invention is used for so-called conditioning treatment, which is performed prior to the PdZSn colloid catalyst application after etching the non-conductive material, and in particular, a Pd / Sn colloid catalyst. It is preferably used for direct plating (a method in which electroplating is performed immediately after reducing Pd of the adsorbed PdZSn colloidal catalyst) that requires a large amount of adsorption.
- a polymer compound containing primary, secondary and tertiary amino groups (hereinafter referred to as "a compound having various amino groups"), which is an active ingredient of the catalyst imparting enhancer of the present invention, It is a polymer compound that has a deviation in the structure of primary amino group, secondary amino group and tertiary amino group.
- This compound having a variety of amino groups is, for example, a compound (polyethyleneimine) obtained by ring-opening polymerization of high-purity ethyleneimine in the presence of an acid catalyst.
- This is a completely linear polymer and has a branched structure including primary amine, secondary amine and tertiary amine, and is a highly water-soluble reactive polymer with extremely high cation density. .
- the molecular weight of this compound is preferably 250 to 10,000 S, and the ratio of primary amino group, secondary amino group and tertiary amino group in one molecule (by 13 C-NMR) is, for example,
- the primary amino group 1 preferably has a secondary amino group of about 0.7 to 2 and the tertiary amino group of about 0.4 to 1.2.
- the above-mentioned multi-amino group-containing compounds are, for example, from Nippon Shokubai Co., Ltd. Epomin SP-003, SP-006, SP-012, SP-018, SP-200, SP-103, SP — It can be used because it is marketed under a trade name of 110 etc.!
- the catalyst imparting enhancer of the present invention only needs to contain the above-mentioned various amino group-carrying compounds as active ingredients.
- the multi-amino group-carrying compound is dissolved in an aqueous solvent such as water.
- the concentration of the compound having a variety of amino groups in the catalyst imparting enhancer of the present invention is not particularly limited, but is, for example, about 50 to 500 mg ZL, preferably 100 to 300 mg ZL at the time of use. It can be used at a high concentration of 500 mgZL or more, for example, 2 to 5 gZL, and the performance is not particularly deteriorated. However, it is not economical, and it causes a problem that the burden of wastewater treatment increases. It ’s not good.
- the catalyst imparting enhancer of the present invention is preferably used under alkaline conditions.
- the specific pH is 9 to 13, preferably 10 to 12.
- a compound having a variety of amino groups is used at a high concentration, the ability to naturally reach such a pH range.
- this compound is used at a low concentration, the above pH range is used.
- the buffer used to maintain the pH when the multi-amino group-containing compound is at a low concentration can maintain the fluctuation in pH within the target range due to the acid introduced in the process before the conditioner.
- a buffer solution formulated with a combination of borax and sodium hydroxide or a formulation using phosphate or phthalic acid it is economical to use a buffer solution and to reduce the concentration of the various amino group-carrying compounds, and it is preferable because the load of wastewater treatment is greatly reduced. Furthermore, it is also preferable to add a reducing agent such as hydrazine in advance to the catalyst imparting enhancer in order to suppress the influence of chromic acid that may bring in the etching process power as the previous process. Ma In order to obtain the same effect, a reduction process may be provided after the etching process.
- the catalyst imparting enhancer of the present invention described above is used as follows. That is, a non-conductive material (covered material) that has been etched by a conventionally known method is sufficiently washed and then immersed in the catalyst imparting enhancer of the present invention for conditioning treatment.
- This conditioning treatment is also performed according to conventionally known conditions.
- the treatment temperature is 10 to 60 ° C, preferably 20 to 30 ° C
- the treatment time is 0.5 to 5 ° C. Minutes, preferably 1 to 2 minutes.
- the non-conductive material conditioned with the catalyst imparting enhancer of the present invention is subjected to a PdZSn colloid catalyst imparting treatment by a conventional method, and further subjected to a Pd reduction treatment, and then plated. It is attached to processing.
- This plating process may be direct plating with direct electrical plating, or a conventional method in which electrical plating is performed after electroless plating is performed. However, this method is more effective when direct plating is used. The effect of the invention is great.
- the primary and secondary amino groups possessed by the catalyst suppress the adsorption of the Pd—Sn catalyst onto the cured polyvinyl chloride vinyl sol coating.
- non-conductive materials such as ABS resin and PCZABS resin can be conditioned to selectively increase the adsorption of Pd-Sn catalyst.
- the amount of catalyst adsorbed on the non-conductive material can be brought into the target range, and thus is necessary for ordinary electroless plating. Even when using PdZSn colloidal catalyst at a concentration 4 to 6 times higher than that of It is possible to perform good plating on a non-conductive material without causing precipitation.
- the conditioning effect of polyethyleneimine (PEI; SP-006 (manufactured by Nippon Shokubai Co., Ltd.)), a compound containing various amino groups according to the present invention, is adsorbed with radium.
- the amount, the presence or absence of deposition on the rack, the plating property and the wastewater treatment property were tested.
- EDA ethyleneamine
- TET triethylenetetramine
- DEEA amine compound jetylethanolamine
- cation AB quaternary ammonium polymer surfactant
- Table 1 shows the direct plating process and conditions
- Table 2 shows the results of each test. Even when the reduction treatment step is omitted, a result almost equivalent to this is obtained.
- Copper strike coverage is 70% or more and less than 100%
- Copper strike coverage power 0% or more, less than 70%
- Copper removal rate is 80% or more
- Copper removal rate is 50% or more and less than 80%
- the influence of pH in the catalyst enhancer of the present invention was examined as follows. That is, the pH of the catalyst enhancer containing 200 mg / L of PEI of Example 1 was adjusted to 9.86 and 11.1 using borax-sodium hydroxide sodium buffer.
- Example 4 For door handles similar to those used in Example 1, the PEI concentration could be changed or When using a catalyst imparting enhancer with other components added thereto, the tackiness by direct plating was tested. The treatment process was also performed according to Example 1. The results are shown in Table 4.
- a PdZSn colloid between an etched non-conductive material such as ABS resin or PCZABS resin and a cured salt vinyl resin coating that is a coating material for a jig It became possible to give selectivity to the catalyst adsorption.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007534342A JP4919961B2 (ja) | 2005-09-02 | 2006-08-28 | 触媒付与増強剤 |
CN2006800318357A CN101253286B (zh) | 2005-09-02 | 2006-08-28 | 催化剂施加用增强剂 |
US12/065,447 US20090277798A1 (en) | 2005-09-02 | 2006-08-28 | Catalyst attachment-enhancing agent |
KR1020087005916A KR101344815B1 (ko) | 2005-09-02 | 2008-03-11 | 촉매 부여 증강제 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-254872 | 2005-09-02 | ||
JP2005254872 | 2005-09-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007029545A1 true WO2007029545A1 (ja) | 2007-03-15 |
Family
ID=37835666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/316890 WO2007029545A1 (ja) | 2005-09-02 | 2006-08-28 | 触媒付与増強剤 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090277798A1 (ja) |
JP (1) | JP4919961B2 (ja) |
KR (1) | KR101344815B1 (ja) |
CN (1) | CN101253286B (ja) |
WO (1) | WO2007029545A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013253324A (ja) * | 2013-08-22 | 2013-12-19 | Kakihara Kogyo Kk | オゾン水処理を用いた樹脂めっき処理方法 |
JP2017511843A (ja) * | 2014-02-19 | 2017-04-27 | マクダーミッド アキューメン インコーポレーテッド | ラックのメタライゼーションを防止するための電気めっき用ラックの処理 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6465292A (en) * | 1987-07-10 | 1989-03-10 | Shipley Co | Electroplating method |
JP2003277941A (ja) * | 2002-03-26 | 2003-10-02 | Omura Toryo Kk | 無電解めっき方法、および前処理剤 |
JP2004526869A (ja) * | 2001-05-18 | 2004-09-02 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 非導電基板の直接電解金属被膜 |
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JPS58181882A (ja) * | 1982-04-14 | 1983-10-24 | Toyo Soda Mfg Co Ltd | 陽イオン交換膜の表面に金属を固着せしめる方法 |
ZA834786B (en) * | 1982-07-01 | 1984-08-29 | Kollmorgen Tech Corp | Method for electroplating non-metallic surfaces |
US4895739A (en) * | 1988-02-08 | 1990-01-23 | Shipley Company Inc. | Pretreatment for electroplating process |
JPH10183362A (ja) * | 1996-12-25 | 1998-07-14 | Idemitsu Petrochem Co Ltd | メッキ成形体の製造方法 |
JP3342852B2 (ja) * | 1999-08-11 | 2002-11-11 | 荏原ユージライト株式会社 | 触媒化処理の前処理方法およびこれに用いる付き回り改善剤 |
AU2001269509A1 (en) * | 2000-07-17 | 2002-01-30 | Mandom Corporation | Pretreatment agents for acidic hair dyes |
JP4640583B2 (ja) * | 2005-03-11 | 2011-03-02 | 日立化成工業株式会社 | 無電解めっき用前処理液、およびこれを用いた無電解めっき方法 |
JP4377852B2 (ja) * | 2005-06-13 | 2009-12-02 | 荏原ユージライト株式会社 | ダイレクトプレーティング用治具 |
-
2006
- 2006-08-28 JP JP2007534342A patent/JP4919961B2/ja not_active Expired - Fee Related
- 2006-08-28 WO PCT/JP2006/316890 patent/WO2007029545A1/ja active Application Filing
- 2006-08-28 US US12/065,447 patent/US20090277798A1/en not_active Abandoned
- 2006-08-28 CN CN2006800318357A patent/CN101253286B/zh not_active Expired - Fee Related
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2008
- 2008-03-11 KR KR1020087005916A patent/KR101344815B1/ko active IP Right Grant
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JPS6465292A (en) * | 1987-07-10 | 1989-03-10 | Shipley Co | Electroplating method |
JP2004526869A (ja) * | 2001-05-18 | 2004-09-02 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 非導電基板の直接電解金属被膜 |
JP2003277941A (ja) * | 2002-03-26 | 2003-10-02 | Omura Toryo Kk | 無電解めっき方法、および前処理剤 |
Cited By (2)
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JP2013253324A (ja) * | 2013-08-22 | 2013-12-19 | Kakihara Kogyo Kk | オゾン水処理を用いた樹脂めっき処理方法 |
JP2017511843A (ja) * | 2014-02-19 | 2017-04-27 | マクダーミッド アキューメン インコーポレーテッド | ラックのメタライゼーションを防止するための電気めっき用ラックの処理 |
Also Published As
Publication number | Publication date |
---|---|
CN101253286B (zh) | 2011-03-30 |
KR20080039983A (ko) | 2008-05-07 |
US20090277798A1 (en) | 2009-11-12 |
JPWO2007029545A1 (ja) | 2009-03-19 |
JP4919961B2 (ja) | 2012-04-18 |
CN101253286A (zh) | 2008-08-27 |
KR101344815B1 (ko) | 2013-12-26 |
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