JP7387326B2 - 無電解めっきの前処理方法及び無電解めっきの前処理液 - Google Patents
無電解めっきの前処理方法及び無電解めっきの前処理液 Download PDFInfo
- Publication number
- JP7387326B2 JP7387326B2 JP2019142711A JP2019142711A JP7387326B2 JP 7387326 B2 JP7387326 B2 JP 7387326B2 JP 2019142711 A JP2019142711 A JP 2019142711A JP 2019142711 A JP2019142711 A JP 2019142711A JP 7387326 B2 JP7387326 B2 JP 7387326B2
- Authority
- JP
- Japan
- Prior art keywords
- catalyst
- electroless plating
- anionic surfactant
- pretreatment
- acid treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007772 electroless plating Methods 0.000 title claims description 74
- 238000002203 pretreatment Methods 0.000 title claims description 37
- 239000003054 catalyst Substances 0.000 claims description 129
- 239000003945 anionic surfactant Substances 0.000 claims description 81
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 54
- 238000010306 acid treatment Methods 0.000 claims description 53
- 239000007788 liquid Substances 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 45
- 229910052763 palladium Inorganic materials 0.000 claims description 33
- -1 polyoxyethylene Polymers 0.000 claims description 22
- 230000009467 reduction Effects 0.000 claims description 19
- 150000001450 anions Chemical class 0.000 claims description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 16
- 239000004094 surface-active agent Substances 0.000 claims description 13
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 8
- 229910019142 PO4 Inorganic materials 0.000 claims description 7
- 150000007942 carboxylates Chemical class 0.000 claims description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229920000058 polyacrylate Polymers 0.000 claims description 6
- 230000001476 alcoholic effect Effects 0.000 claims description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 4
- 239000010452 phosphate Substances 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 230000008569 process Effects 0.000 description 53
- 230000000052 comparative effect Effects 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 238000001179 sorption measurement Methods 0.000 description 20
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 238000006722 reduction reaction Methods 0.000 description 17
- 230000003746 surface roughness Effects 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000000243 solution Substances 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 7
- 238000011946 reduction process Methods 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 150000003871 sulfonates Chemical class 0.000 description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 150000002940 palladium Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 229920000142 Sodium polycarboxylate Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000010531 catalytic reduction reaction Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- HIEHAIZHJZLEPQ-UHFFFAOYSA-M sodium;naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 HIEHAIZHJZLEPQ-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000944 sulfenic acid group Chemical group 0.000 description 1
- 125000000626 sulfinic acid group Chemical group 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
- B01J23/44—Palladium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明の一実施形態に係る無電解めっきの前処理方法は、図1に示すように、少なくとも、クリーナー工程S10、ソフトエッチング工程S20及び/又は酸処理工程S30、触媒付与工程S40及び触媒還元工程S50を有し、基板上に無電解めっきを行う前処理方法である。
次に本発明の他の実施形態に係る無電解めっきの前処理液について説明する。発明の他の実施形態に係る無電解めっきの前処理液は、上記無電解めっきの前処理方法に用いられるものである。そして、ソフトエッチング液及び/又は酸処理液に、親水基の部分がアニオンに電離するアニオン界面活性剤が添加されていることを特徴とする。
実施例1では、日立化成株式会社製MCL-E-67の銅箔をエッチアウト(銅箔を除去溶解)した樹脂基板を用い、表面粗さはRa=1.3μmであった。なお、表面粗さはBRUKER社製のContour GT-Xで測定した。また、無電解めっきの前処理方法として、図2の実施例1に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、触媒付与工程、触媒還元工程とした。
実施例2では、上記アニオン界面活性剤を、アルキルジフェニルエーテルジスルホン酸ナトリウムとした。それ以外は実施例1と同様とした。
実施例3では、上記アニオン界面活性剤を、アルキルナフタレンスルホン酸ナトリウムとした。それ以外は実施例1と同様とした。
実施例4では、上記アニオン界面活性剤を、アルキルアリルスルホン酸ナトリウムとした。それ以外は実施例1と同様とした。
実施例5では、上記アニオン界面活性剤を、ナフタレンスルホン酸ホルマリン縮合物ナトリウムとした。それ以外は実施例1と同様とした。
実施例6では、上記アニオン界面活性剤を、ラウリル硫酸ナトリウムとした。それ以外は実施例1と同様とした。
実施例7では、上記アニオン界面活性剤を、ポリオキシエチレンアルキレンエーテル硫酸アンモニウムとした。それ以外は実施例1と同様とした。
実施例8では、上記アニオン界面活性剤を、ポリオキシエチレンアルキルエーテルリン酸カリウムとした。それ以外は実施例1と同様とした。
実施例9では、上記アニオン界面活性剤を、ポリアクリル酸ナトリウムとした。それ以外は実施例1と同様とした。
比較例1では、図2の比較例1に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、触媒付与工程、触媒還元工程とした。ソフトエッチング工程、酸処理工程、に用いられる処理液にアニオン界面活性剤を添加しなかった。それ以外は実施例1と同様とした。
比較例2では、図2の比較例2に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、プレディップ工程、触媒付与工程、触媒還元工程とした。それ以外は比較例1と同様とした。
タイプI:クリーナー工程→酸処理工程(アニオン界面活性剤を添加)→ソフトエッチング工程→酸処理工程→触媒付与工程→触媒還元工程。
タイプII:クリーナー工程→ソフトエッチング工程(アニオン界面活性剤を添加)→酸処理工程→触媒付与工程→触媒還元工程。
タイプIII:クリーナー工程→ソフトエッチング工程→酸処理工程(アニオン界面活性剤を添加)→触媒付与工程→触媒還元工程。
タイプIV:クリーナー工程→ソフトエッチング工程→酸処理工程→触媒付与工程→触媒還元工程。アニオン界面活性剤は無添加。
タイプV:クリーナー工程→ソフトエッチング工程→酸処理工程→プレディップ工程→触媒付与工程→触媒還元工程。アニオン界面活性剤は無添加。
下記に実施例10~13の条件を示す。
実施例10では、図2の実施例10に示すように、クリーナー工程、酸処理工程(1回目)、ソフトエッチング工程、酸処理工程(2回目)、触媒付与工程、触媒還元工程とした(タイプI)。そして、1回目の酸処理工程に上記アニオン界面活性剤を添加した。また、上記アニオン界面活性剤を、アルキルジフェニルエーテルジスルホン酸ナトリウムとした。また、上記アニオン界面活性剤の濃度を0.5g/Lとした。それ以外は実施例1と同様とした。
実施例11では、図2の実施例11に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、触媒付与工程、触媒還元工程とした(タイプII)。そして、ソフトエッチング工程に上記アニオン界面活性剤を添加した。それ以外は実施例10と同様とした。
実施例12では、図2の実施例12に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、触媒付与工程、触媒還元工程とした。そして、ソフトエッチング工程に上記アニオン界面活性剤を添加した(タイプII)。また、ソフトエッチング工程に用いられる処理液は、過酸化水素及び硫酸とした。それ以外は実施例10と同様とした。
実施例13では、図2の実施例13に示すように、クリーナー工程、ソフトエッチング工程、酸処理工程、触媒付与工程、触媒還元工程とした(タイプIII)。そして、酸処理工程に上記アニオン界面活性剤を添加した。それ以外は実施例10と同様とした。
実施例14では、基板として、味の素ファインテクノ株式会社製ABF GX92Rの全面樹脂基板を用い、デスミア処理後の表面粗さはRa=0.3μmであった。また、上記アニオン界面活性剤を、アルキルジフェニルエーテルジスルホン酸ナトリウムとした。また、上記アニオン界面活性剤の濃度を0.5g/Lとした。その他は、実施例1と同様とした。
比較例3では、酸処理工程にアニオン界面活性剤を添加しなかった。その他は、実施例14と同様とした。
実施例15では、基板として、味の素ファインテクノ株式会社製ABF GXT31R2の全面樹脂基板を用い、デスミア処理後の表面粗さはRa=0.3μmであった。その他は、実施例14と同様とした。
比較例4では、酸処理工程にアニオン界面活性剤を添加しなかった。その他は、実施例15と同様とした。
実施例16では、基板として、味の素ファインテクノ株式会社製ABF GY50Rの全面樹脂基板を用い、デスミア処理後の表面粗さはRa=0.1μmであった。その他は、実施例14と同様とした。
比較例5では、酸処理工程にアニオン界面活性剤を添加しなかった。その他は、実施例16と同様とした。
比較例6では、酸処理工程にアニオン界面活性剤を添加しなかった。また、触媒付与工程の前にプレディップ工程を追加した。その他は、実施例16と同様とした。
実施例17では、基板として、三菱ガス化学株式会社製CCL-HL832NSの銅箔をエッチアウト(銅箔を除去溶解)した樹脂基板を用い、表面粗さはRa=1.0μmであった。その他は、実施例14と同様とした。
比較例7では、酸処理工程にアニオン界面活性剤を添加しなかった。その他は、実施例17と同様とした。
比較例8では、酸処理工程にアニオン界面活性剤を添加しなかった。また、触媒付与工程の前にプレディップ工程を追加した。その他は、実施例17と同様とした。
Claims (8)
- 少なくとも、クリーナー工程、ソフトエッチング工程及び/又は酸処理工程、触媒付与工程及び触媒還元工程を有し、基板上に無電解めっきを行う無電解めっきの前処理方法であって、
前記ソフトエッチング工程及び/又は酸処理工程で用いられる前処理液(芳香族炭化水素を含有するアルコール溶液を除く)に、界面活性剤として、親水基の部分がアニオンに電離するアニオン界面活性剤のみを添加し、
前記触媒付与工程では触媒としてイオン性の触媒のみを前記基板上に付与し、前記触媒還元工程では前記イオン性の触媒を還元して、前記基板上に触媒の吸着量を増加させ、
前記アニオン界面活性剤の濃度は、0.15g/L超10g/L未満であることを特徴とする無電解めっきの前処理方法。 - プレディップ工程を含まないことを特徴とする請求項1に記載の無電解めっきの前処理方法。
- 前記アニオン界面活性剤は、カルボン酸塩、スルホン酸塩、ポリオキシエチレンアルキルエーテルリン酸塩、ポリアクリル酸塩のいずれか1以上であることを特徴とする請求項1又は2に記載の無電解めっきの前処理方法。
- 前記アニオン界面活性剤は、アルキルジフェニルエーテルジスルホン酸塩であることを特徴とする請求項1~3のいずれか1項に記載の無電解めっきの前処理方法。
- 前記触媒はパラジウムであることを特徴とする請求項1~4のいずれか1項に記載の無電解めっきの前処理方法。
- 請求項1~5のいずれか1項に記載の無電解めっきのソフトエッチング工程及び/又は酸処理工程で用いられる無電解めっきの前処理液であって、
前記ソフトエッチング工程及び/又は酸処理工程で用いられる前記前処理液(芳香族炭化水素を含有するアルコール溶液を除く)に、界面活性剤として、親水基の部分がアニオンに電離するアニオン界面活性剤のみが添加されており、前記アニオン界面活性剤の濃度は、0.15g/L超10g/L未満であることを特徴とする無電解めっきの前処理液。 - 前記アニオン界面活性剤は、カルボン酸塩、スルホン酸塩、ポリオキシエチレンアルキルエーテルリン酸塩、ポリアクリル酸塩のいずれか1以上であることを特徴とする請求項6に記載の無電解めっきの前処理液。
- 前記アニオン界面活性剤は、アルキルジフェニルエーテルジスルホン酸塩であることを特徴とする請求項6又は7に記載の無電解めっきの前処理液。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019142711A JP7387326B2 (ja) | 2019-08-02 | 2019-08-02 | 無電解めっきの前処理方法及び無電解めっきの前処理液 |
PCT/JP2020/021966 WO2021024599A1 (ja) | 2019-08-02 | 2020-06-03 | 無電解めっきの前処理方法及び無電解めっきの前処理液 |
KR1020227001294A KR20220038341A (ko) | 2019-08-02 | 2020-06-03 | 무전해 도금의 전처리 방법 및 무전해 도금의 전처리액 |
US17/631,837 US20220275516A1 (en) | 2019-08-02 | 2020-06-03 | Pretreatment Method for Electroless Plating, and Pretreatment Solution for Electroless Plating |
CN202080055178.XA CN114207185A (zh) | 2019-08-02 | 2020-06-03 | 化学镀的预处理方法和化学镀的预处理液 |
TW109119609A TW202106927A (zh) | 2019-08-02 | 2020-06-11 | 無電鍍敷的前處理方法及無電鍍敷的前處理液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019142711A JP7387326B2 (ja) | 2019-08-02 | 2019-08-02 | 無電解めっきの前処理方法及び無電解めっきの前処理液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021025077A JP2021025077A (ja) | 2021-02-22 |
JP7387326B2 true JP7387326B2 (ja) | 2023-11-28 |
Family
ID=74502585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019142711A Active JP7387326B2 (ja) | 2019-08-02 | 2019-08-02 | 無電解めっきの前処理方法及び無電解めっきの前処理液 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220275516A1 (ja) |
JP (1) | JP7387326B2 (ja) |
KR (1) | KR20220038341A (ja) |
CN (1) | CN114207185A (ja) |
TW (1) | TW202106927A (ja) |
WO (1) | WO2021024599A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012130910A (ja) | 2010-12-14 | 2012-07-12 | Rohm & Haas Electronic Materials Llc | めっき触媒及び方法 |
JP2014019947A (ja) | 2012-07-16 | 2014-02-03 | Samsung Electro-Mechanics Co Ltd | 金属層がめっきされた絶縁基材及びそのめっき方法、並びにこれを用いた透明電極 |
JP2018009232A (ja) | 2016-07-15 | 2018-01-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解めっき用前処理液 |
CN110042372A (zh) | 2019-05-07 | 2019-07-23 | 广东东硕科技有限公司 | 磺酸基芳香化合物的新应用 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0238578A (ja) * | 1988-07-27 | 1990-02-07 | Kizai Kk | ポリフェニレンエーテル/ポリアミドアロイ樹脂成形品の表面処理方法 |
JPH0390582A (ja) * | 1989-09-01 | 1991-04-16 | Okuno Seiyaku Kogyo Kk | 固形ワックスへのめっき処理方法 |
JP4290621B2 (ja) | 2004-09-01 | 2009-07-08 | 日本メクトロン株式会社 | 多層フレキシブルプリント基板の無電解銅メッキ方法 |
JP5571938B2 (ja) * | 2009-11-17 | 2014-08-13 | 日本パーカライジング株式会社 | 銅材料の下地処理方法および下地処理被膜付き銅材料 |
JP5648232B1 (ja) | 2013-06-21 | 2015-01-07 | Dic株式会社 | 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法 |
US9183991B2 (en) * | 2013-09-16 | 2015-11-10 | Avx Corporation | Electro-polymerized coating for a wet electrolytic capacitor |
JP6814028B2 (ja) * | 2016-11-17 | 2021-01-13 | 上村工業株式会社 | プリント配線基板の製造方法 |
-
2019
- 2019-08-02 JP JP2019142711A patent/JP7387326B2/ja active Active
-
2020
- 2020-06-03 KR KR1020227001294A patent/KR20220038341A/ko unknown
- 2020-06-03 US US17/631,837 patent/US20220275516A1/en active Pending
- 2020-06-03 WO PCT/JP2020/021966 patent/WO2021024599A1/ja active Application Filing
- 2020-06-03 CN CN202080055178.XA patent/CN114207185A/zh active Pending
- 2020-06-11 TW TW109119609A patent/TW202106927A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012130910A (ja) | 2010-12-14 | 2012-07-12 | Rohm & Haas Electronic Materials Llc | めっき触媒及び方法 |
JP2014019947A (ja) | 2012-07-16 | 2014-02-03 | Samsung Electro-Mechanics Co Ltd | 金属層がめっきされた絶縁基材及びそのめっき方法、並びにこれを用いた透明電極 |
JP2018009232A (ja) | 2016-07-15 | 2018-01-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解めっき用前処理液 |
CN110042372A (zh) | 2019-05-07 | 2019-07-23 | 广东东硕科技有限公司 | 磺酸基芳香化合物的新应用 |
Also Published As
Publication number | Publication date |
---|---|
CN114207185A (zh) | 2022-03-18 |
US20220275516A1 (en) | 2022-09-01 |
JP2021025077A (ja) | 2021-02-22 |
KR20220038341A (ko) | 2022-03-28 |
TW202106927A (zh) | 2021-02-16 |
WO2021024599A1 (ja) | 2021-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101717495B1 (ko) | 촉매 부여 용액 및 이것을 사용한 무전해 도금 방법 및 다이렉트 플레이팅 방법 | |
JP2014019947A (ja) | 金属層がめっきされた絶縁基材及びそのめっき方法、並びにこれを用いた透明電極 | |
TWI482877B (zh) | 鍍覆催化劑及方法 | |
CN101457360B (zh) | 一种有机酸型粗化液 | |
TWI629374B (zh) | 無電極電鍍的方法 | |
JP2009530502A (ja) | ポリイミド基板及びそれを使用するプリント基板の製造方法 | |
JP2011162806A (ja) | 無電解めっきを行うための前処理液 | |
KR20140068271A (ko) | 구리의 마이크로 에칭제 및 그 보급액, 및 배선 기판의 제조 방법 | |
TW201823511A (zh) | 印刷配線基板之製造方法 | |
CN1222636C (zh) | 化学镀镍的预处理溶液及预处理方法 | |
JPH07197266A (ja) | 酸化銅(i)コロイドの金属化によるダイレクトプレーティング方法 | |
KR100759452B1 (ko) | 니켈 패턴이 형성된 질화알루미늄 기판의 제조방법 | |
JP7387326B2 (ja) | 無電解めっきの前処理方法及び無電解めっきの前処理液 | |
EP3334853A1 (en) | Electroless silver plating bath and method of using the same | |
CN109642323B (zh) | 化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法 | |
JP5843249B2 (ja) | 無電解パラジウムめっき又は無電解パラジウム合金めっきの前処理用活性化液 | |
EP2610365B1 (en) | Electroless plating method | |
KR20140019174A (ko) | 인쇄회로기판의 제조방법 | |
WO2014123104A1 (ja) | 無電解めっき方法、及びセラミック基板 | |
CN103556134A (zh) | 非电解镀镍的预处理方法 | |
CN109082651B (zh) | 一种用于化学镀的预处理组合物 | |
JP4059133B2 (ja) | 無電解ニッケル−金めっき方法 | |
CN109989078A (zh) | 一种铝基材上电镀铜前处理的Ag活化方法及电镀铜的方法 | |
US20040067312A1 (en) | Method for forming thin film and catalyzed treatment solution used therefor | |
JP2017186635A (ja) | 無電解銅メッキ方法及び当該方法を用いたプリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220721 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230404 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230529 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230704 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20230906 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20230925 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231114 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231115 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7387326 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |