SG10201504060TA - Metallization of the wafer edge for optimized electroplating performance on resistive substrates - Google Patents
Metallization of the wafer edge for optimized electroplating performance on resistive substratesInfo
- Publication number
- SG10201504060TA SG10201504060TA SG10201504060TA SG10201504060TA SG10201504060TA SG 10201504060T A SG10201504060T A SG 10201504060TA SG 10201504060T A SG10201504060T A SG 10201504060TA SG 10201504060T A SG10201504060T A SG 10201504060TA SG 10201504060T A SG10201504060T A SG 10201504060TA
- Authority
- SG
- Singapore
- Prior art keywords
- metallization
- wafer edge
- resistive substrates
- electroplating performance
- optimized
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000001465 metallisation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
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- H01L23/528—Geometry or layout of the interconnection structure
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
- H01L23/53266—Additional layers associated with refractory-metal layers, e.g. adhesion, barrier, cladding layers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Geometry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
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US14/294,006 US9368340B2 (en) | 2014-06-02 | 2014-06-02 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates |
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SG10201504060TA true SG10201504060TA (en) | 2016-01-28 |
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SG10201504060TA SG10201504060TA (en) | 2014-06-02 | 2015-05-22 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates |
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US (3) | US9368340B2 (en) |
KR (1) | KR102383389B1 (en) |
CN (2) | CN105132979B (en) |
SG (1) | SG10201504060TA (en) |
TW (1) | TWI654337B (en) |
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KR102584513B1 (en) * | 2020-12-31 | 2023-10-06 | 세메스 주식회사 | Substrate type senseor for measuring of horizontal of a substrate support member provided on the atmosphere in which temperature changes are accompanied by and method for measuring horizontal of substrate support member using thereof |
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2014
- 2014-06-02 US US14/294,006 patent/US9368340B2/en active Active
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2015
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2016
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2017
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US9368340B2 (en) | 2016-06-14 |
KR20150138826A (en) | 2015-12-10 |
TWI654337B (en) | 2019-03-21 |
CN108396351A (en) | 2018-08-14 |
TW201608057A (en) | 2016-03-01 |
US20160254222A1 (en) | 2016-09-01 |
US10079207B2 (en) | 2018-09-18 |
US20150348772A1 (en) | 2015-12-03 |
US9761524B2 (en) | 2017-09-12 |
KR102383389B1 (en) | 2022-04-05 |
CN105132979B (en) | 2018-05-08 |
US20170330831A1 (en) | 2017-11-16 |
CN105132979A (en) | 2015-12-09 |
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