SG11201707005RA - Substrate pre-alignment method - Google Patents

Substrate pre-alignment method

Info

Publication number
SG11201707005RA
SG11201707005RA SG11201707005RA SG11201707005RA SG11201707005RA SG 11201707005R A SG11201707005R A SG 11201707005RA SG 11201707005R A SG11201707005R A SG 11201707005RA SG 11201707005R A SG11201707005R A SG 11201707005RA SG 11201707005R A SG11201707005R A SG 11201707005RA
Authority
SG
Singapore
Prior art keywords
alignment method
substrate pre
substrate
alignment
Prior art date
Application number
SG11201707005RA
Inventor
Xiwen Zhou
Weiwang Sun
Cuixia Tian
Jiaozeng Zheng
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201707005RA publication Critical patent/SG11201707005RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
SG11201707005RA 2015-02-28 2016-02-26 Substrate pre-alignment method SG11201707005RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510091986.2A CN105988305B (en) 2015-02-28 2015-02-28 Wafer pre-alignment method
PCT/CN2016/074676 WO2016134671A1 (en) 2015-02-28 2016-02-26 Substrate pre-alignment method

Publications (1)

Publication Number Publication Date
SG11201707005RA true SG11201707005RA (en) 2017-09-28

Family

ID=56787889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707005RA SG11201707005RA (en) 2015-02-28 2016-02-26 Substrate pre-alignment method

Country Status (8)

Country Link
US (1) US10416578B2 (en)
EP (1) EP3264181B1 (en)
JP (1) JP6510665B2 (en)
KR (1) KR102048295B1 (en)
CN (1) CN105988305B (en)
SG (1) SG11201707005RA (en)
TW (1) TWI663680B (en)
WO (1) WO2016134671A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106444303B (en) * 2016-11-25 2018-12-11 武汉理工大学 A kind of sample clamp and application for alignment function in micro-nano device micro-group dress
CN109725506B (en) * 2017-10-31 2020-11-13 上海微电子装备（集团）股份有限公司 Substrate pre-alignment method and device and photoetching machine
CN108899288B (en) * 2018-07-20 2020-11-13 上海华虹宏力半导体制造有限公司 Wafer mark monitoring method and method for judging alignment position of laser marking machine
US10790237B2 (en) * 2018-09-14 2020-09-29 Lam Research Corporation Fiducial-filtering automatic wafer centering process and associated system
CN109633938B (en) * 2018-12-17 2021-11-23 Tcl华星光电技术有限公司 Exposure alignment method
JP7366626B2 (en) * 2019-07-31 2023-10-23 キヤノン株式会社 judgment device

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US20010049589A1 (en) * 1993-01-21 2001-12-06 Nikon Corporation Alignment method and apparatus therefor
JPH07142300A (en) 1993-06-16 1995-06-02 Nikon Corp Position detection equipment
JP3125534B2 (en) * 1993-08-31 2001-01-22 キヤノン株式会社 Exposure apparatus and method of manufacturing semiconductor chip using the same
US6225012B1 (en) * 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
JP3757430B2 (en) 1994-02-22 2006-03-22 株式会社ニコン Substrate positioning apparatus and exposure apparatus
KR100405398B1 (en) * 1995-07-14 2004-03-30 가부시키가이샤 니콘 Alignment method
US6043864A (en) * 1999-03-08 2000-03-28 Taiwan Semiconductor Manufacturing Company Alignment method and apparatus using previous layer calculation data to solve critical alignment problems
JP2000353655A (en) * 1999-06-10 2000-12-19 Nikon Corp Position detecting mark, mark detecting device using the same, and aligner
JP2001267216A (en) * 2000-03-17 2001-09-28 Nikon Corp Method and device for detecting position and method and device for exposure
JP4955874B2 (en) 2001-09-07 2012-06-20 キヤノン株式会社 Alignment apparatus, exposure apparatus, and device manufacturing method
US7268360B2 (en) * 2001-09-20 2007-09-11 Litel Instruments Method and apparatus for self-referenced dynamic step and scan intra-field scanning distortion
EP1341046A3 (en) 2002-03-01 2004-12-15 ASML Netherlands B.V. Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
TW594431B (en) 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
US6664121B2 (en) * 2002-05-20 2003-12-16 Nikon Precision, Inc. Method and apparatus for position measurement of a pattern formed by a lithographic exposure tool
JP3643572B2 (en) * 2002-05-31 2005-04-27 株式会社アドテックエンジニアリング Projection exposure apparatus and alignment apparatus
JP4258828B2 (en) * 2002-06-06 2009-04-30 株式会社安川電機 Wafer pre-alignment apparatus and method
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
JP2004193425A (en) 2002-12-12 2004-07-08 Nikon Corp Movement control method, movement controller, aligner and device manufacturing method
SG119224A1 (en) * 2003-06-26 2006-02-28 Asml Netherlands Bv Calibration method for a lithographic apparatus and device manufacturing method
JP2005116626A (en) 2003-10-03 2005-04-28 Canon Inc Position detector, position detecting method, and exposure system
US7848594B2 (en) * 2004-02-13 2010-12-07 Nikon Corporation Measurement method, transfer characteristic measurement method, adjustment method of exposure apparatus, and device manufacturing method
US20070247640A1 (en) * 2004-03-30 2007-10-25 Nikon Corporation Exposure Apparatus, Exposure Method and Device Manufacturing Method, and Surface Shape Detection Unit
JP3880589B2 (en) * 2004-03-31 2007-02-14 キヤノン株式会社 Position measuring apparatus, exposure apparatus, and device manufacturing method
JP4873242B2 (en) * 2004-06-22 2012-02-08 株式会社ニコン Best focus detection method, exposure method, and exposure apparatus
EP1791169A4 (en) * 2004-08-31 2011-03-02 Nikon Corp Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
US20060061743A1 (en) * 2004-09-22 2006-03-23 Asml Netherlands B.V. Lithographic apparatus, alignment system, and device manufacturing method
JP2006294993A (en) 2005-04-13 2006-10-26 Nikon Corp Method, system and program for measuring position
CN100355055C (en) * 2005-10-28 2007-12-12 清华大学 Method for controlling pre-aligning of silicon wafer
DE102007017630B4 (en) 2006-05-16 2009-08-20 Vistec Semiconductor Systems Gmbh A method of increasing measurement accuracy in determining the coordinates of structures on a substrate
JP2009014919A (en) 2007-07-03 2009-01-22 Dainippon Screen Mfg Co Ltd Displacement detection device and drawing device
JP4944690B2 (en) * 2007-07-09 2012-06-06 キヤノン株式会社 Method for adjusting position detection apparatus, position detection apparatus, exposure apparatus, and device manufacturing method
KR101305948B1 (en) * 2007-12-10 2013-09-12 삼성전자주식회사 Method of aligning a substrate and apparatus for performing the same
CN101216686B (en) * 2008-01-10 2010-08-25 上海微电子装备有限公司 Wafer pre-aligning platform and wafer pre-alignment method using the platform
KR20100107019A (en) 2008-03-31 2010-10-04 후지쯔 가부시끼가이샤 Alignment device for planar element, manufacturing equipment for the same, alignment method for the same, and manufacturing method for the same
CN101727011B (en) * 2008-10-28 2011-08-24 上海华虹Nec电子有限公司 Alignment method of lithography machine
CN101436004B (en) * 2008-12-01 2011-12-21 上海微电子装备有限公司 Method for pre-aligning silicon chip
CN101963766B (en) 2009-07-23 2012-02-01 上海微电子装备有限公司 Mask pre-aligning device and method for photoetching machine
CN101807014A (en) * 2010-03-23 2010-08-18 上海微电子装备有限公司 Method for measuring alignment accuracy of machine vision system
US8587665B2 (en) * 2011-02-15 2013-11-19 DigitalOptics Corporation Europe Limited Fast rotation estimation of objects in sequences of acquired digital images
US20120244459A1 (en) 2011-03-24 2012-09-27 Nanya Technology Corp. Method for evaluating overlay error and mask for the same
CN104025257B (en) 2011-10-24 2017-09-19 株式会社尼康 Lamp optical system, exposure device and assembly manufacture method
KR101414830B1 (en) 2011-11-30 2014-07-03 다이닛뽕스크린 세이조오 가부시키가이샤 Alignment method, transfer method, and transfer apparatus
JP2013145870A (en) * 2011-12-13 2013-07-25 Canon Inc Method for manufacturing device, and substrate
US20130258339A1 (en) * 2012-03-28 2013-10-03 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer alignment mark scheme
CN102662308A (en) * 2012-05-07 2012-09-12 中国科学院光电技术研究所 Automatic aligning image processing method of lithography machine
CN102866604A (en) * 2012-09-17 2013-01-09 上海华力微电子有限公司 Mask plate alignment mark arrangement method
CN103050427A (en) * 2012-12-27 2013-04-17 上海交通大学 Wafer pre-alignment method
CN104111595B (en) * 2013-04-16 2016-08-24 上海微电子装备有限公司 Pre-alignment method for the prealignment device of lithographic equipment
CN104345574B (en) * 2013-08-02 2018-01-26 上海微电子装备（集团）股份有限公司 A kind of pre-aligning system for mask of photo-etching machine based on position sensor
JP6360287B2 (en) 2013-08-13 2018-07-18 キヤノン株式会社 Lithographic apparatus, alignment method, and article manufacturing method
JP6271920B2 (en) * 2013-09-06 2018-01-31 キヤノン株式会社 Measuring device, measuring method, lithography apparatus, and article manufacturing method
JP6386732B2 (en) 2014-01-20 2018-09-05 キヤノン株式会社 Detection apparatus, detection method, and lithography apparatus

Also Published As

Publication number Publication date
CN105988305B (en) 2018-03-02
EP3264181A1 (en) 2018-01-03
KR102048295B1 (en) 2019-11-25
US20180046097A1 (en) 2018-02-15
CN105988305A (en) 2016-10-05
JP2018508039A (en) 2018-03-22
EP3264181B1 (en) 2020-01-15
KR20170121255A (en) 2017-11-01
JP6510665B2 (en) 2019-05-08
TW201707123A (en) 2017-02-16
TWI663680B (en) 2019-06-21
WO2016134671A1 (en) 2016-09-01
US10416578B2 (en) 2019-09-17
EP3264181A4 (en) 2018-11-07

Similar Documents

Publication Publication Date Title
IL250588B (en) Metrology method, target and substrate
SG10201610659YA (en) Etching Method
SG10201604315QA (en) Etching Method
KR102377315B1 (en) Substrate treating apparatus
SG11201702778YA (en) Method for bonding substrates
SG11201705507TA (en) Substrate transfer mechanisms
SG11201706122SA (en) Activation method for silicon substrates
SG10201500801YA (en) Electroplating methods for semiconductor substrates
SG11201707005RA (en) Substrate pre-alignment method
SG10201610489WA (en) Etching method
SG10202009031VA (en) Intra-mould substrate
EP3101160A4 (en) Semiconductor substrate manufacturing method
IL280370A (en) Metrology method, target and substrate
PL3126540T3 (en) Multi-layer substrate and fabrication method
EP3223302A4 (en) Sic substrate treatment method
GB201701519D0 (en) Substrate manufacture
SG11201603148VA (en) Method for bonding substrates
GB201410317D0 (en) Substrate
SG11201801454QA (en) Substrate carrier
EP3341959B8 (en) Substrate transport apparatus
SG10201604313XA (en) Etching Method
GB2561730B (en) Semiconductor substrate
SG11201610011RA (en) Wafer marking method
GB2552508B (en) Substrate
EP3121837A4 (en) Semiconductor substrate evaluation method