TWI623653B - 電鍍掛架及避免掛架金屬化之電鍍掛架處理 - Google Patents

電鍍掛架及避免掛架金屬化之電鍍掛架處理 Download PDF

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Publication number
TWI623653B
TWI623653B TW104101271A TW104101271A TWI623653B TW I623653 B TWI623653 B TW I623653B TW 104101271 A TW104101271 A TW 104101271A TW 104101271 A TW104101271 A TW 104101271A TW I623653 B TWI623653 B TW I623653B
Authority
TW
Taiwan
Prior art keywords
ether acetate
aqueous solution
rack
metallization
zinc
Prior art date
Application number
TW104101271A
Other languages
English (en)
Chinese (zh)
Other versions
TW201534768A (zh
Inventor
羅德里克Ｄ 赫德曼
羅山Ｖ 查帕內里
艾莉森 西斯洛普
Original Assignee
麥克達米德尖端股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 麥克達米德尖端股份有限公司 filed Critical 麥克達米德尖端股份有限公司
Publication of TW201534768A publication Critical patent/TW201534768A/zh
Application granted granted Critical
Publication of TWI623653B publication Critical patent/TWI623653B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
TW104101271A 2014-02-19 2015-01-15 電鍍掛架及避免掛架金屬化之電鍍掛架處理 TWI623653B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/184,011 2014-02-19
US14/184,011 US20150233011A1 (en) 2014-02-19 2014-02-19 Treatment for Electroplating Racks to Avoid Rack Metallization

Publications (2)

Publication Number Publication Date
TW201534768A TW201534768A (zh) 2015-09-16
TWI623653B true TWI623653B (zh) 2018-05-11

Family

ID=53797590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101271A TWI623653B (zh) 2014-02-19 2015-01-15 電鍍掛架及避免掛架金屬化之電鍍掛架處理

Country Status (8)

Country Link
US (1) US20150233011A1 (es)
EP (1) EP3108039A4 (es)
JP (1) JP2017511843A (es)
CN (1) CN106103811A (es)
CA (1) CA2939316A1 (es)
MX (1) MX2016010851A (es)
TW (1) TWI623653B (es)
WO (1) WO2015126544A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9809899B2 (en) * 2014-08-07 2017-11-07 Macdermid Acumen, Inc. Treatment for electroplating racks to avoid rack metallization
US9506150B2 (en) * 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
FR3027923B1 (fr) * 2014-11-04 2023-04-28 Pegastech Procede de metallisation de pieces plastiques
JP6648885B2 (ja) * 2015-09-08 2020-02-14 奥野製薬工業株式会社 めっき用治具の皮膜形成用組成物、めっき用治具及びめっき処理方法
EP3228729A1 (en) 2016-04-04 2017-10-11 COVENTYA S.p.A. Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath
FR3074808B1 (fr) 2017-12-13 2020-05-29 Maxence RENAUD Outillage de galvanoplastie
GB2587662A (en) * 2019-10-04 2021-04-07 Macdermid Inc Prevention of unwanted plating on rack coatings for electrodeposition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3619243A (en) * 1970-02-17 1971-11-09 Enthone No rerack metal plating of electrically nonconductive articles
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US5817388A (en) * 1996-11-08 1998-10-06 Carl M. Rodia & Associates Multi-component dye compositions for optical recording media
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939056A (en) * 1973-10-19 1976-02-17 Sony Corporation Coated plating rack
AU8113175A (en) * 1974-07-11 1976-11-18 Kollmorgen Corp Process for the formation of real images and products produced thereby
WO2007029545A1 (ja) * 2005-09-02 2007-03-15 Ebara-Udylite Co., Ltd. 触媒付与増強剤
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
US8980460B2 (en) * 2012-02-07 2015-03-17 Battelle Memorial Institute Methods and electrolytes for electrodeposition of smooth films
US20140178770A1 (en) * 2012-02-07 2014-06-26 Battelle Memorial Institute Electrolytes for dendrite-free energy storage devices having high coulombic effciency

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3619243A (en) * 1970-02-17 1971-11-09 Enthone No rerack metal plating of electrically nonconductive articles
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US5817388A (en) * 1996-11-08 1998-10-06 Carl M. Rodia & Associates Multi-component dye compositions for optical recording media
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic

Also Published As

Publication number Publication date
CA2939316A1 (en) 2015-08-27
EP3108039A1 (en) 2016-12-28
US20150233011A1 (en) 2015-08-20
CN106103811A (zh) 2016-11-09
WO2015126544A1 (en) 2015-08-27
TW201534768A (zh) 2015-09-16
JP2017511843A (ja) 2017-04-27
EP3108039A4 (en) 2017-10-18
MX2016010851A (es) 2016-11-17

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