Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
  • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
  • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
  • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/54—Contact plating, i.e. electroless electrochemical plating
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
  • G11B5/62—Record carriers characterised by the selection of the material
  • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
  • G11B5/739—Magnetic recording media substrates
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
  • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
  • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating

Definitions

• This application relates to electroless nickel-phosphorous plating baths with reduced ion concentrations and methods for forming electroless nickel-phosphorous coatings on work pieces, such as alkaline zincate coated rigid data storage disks, using the baths.
• Electroless Nickel (EN) plating baths or plating solution designed to provide high phosphorous deposits, are used to produce non-magnetic sublayers for rigid memory disks.
• the deposit should provide a uniform, hard and polishable plated surface to protect an aluminum substrate. Since the deposit serves as a base layer for a sputtered media film, it is desirable that it is free of asperities and microdefects, such as pits and nodules. Furthermore, there is a demand to increase the storage density of a data storage disk, which requires the EN deposit to be more corrosion resistant against corrosive polishing slurries and subsequent acid washing.
• the precipitation of Ni(H 2 P03)2 is greatly affected by the pH of the bath and the chelation system.
• the chelation system is generally optimized to control the free Ni concentration to prevent the precipitation of Ni(H 2 P03)2, as well as to complex any extraneous metal ions introduced from the external environment, such as Zn, Fe and Al.
• precipitation can occur as the ortho concentration and pH of the working bath increase. For example, at an ortho concentration of 100 grams per liter, the onset of precipitation can occur at a pH around 5.0 at optimum chelation.
• Optimum chelation can be the amount of chelation required to complex 100% of the Ni ion.
• the pretreatment cycle requires the application of a dilute alloy zincate, which affords an immersion deposit of Zn and Fe and provides a barrier coating to prevent the aluminum substrate from oxidation.
• the process insures adequate adhesion of the EN film to the substrate.
• the zincate solution is typically highly alkaline, with a pH greater than 14.
• the highly alkaline zincate solution provides a zincate plated surface on the aluminum disk that has a high localized pH.
• Interaction of the EN plating bath with the highly alkaline zincate plated surface of the disk can result in in situ formation of colloids and submicron particles at the interface or diffusion zone of the bath and zincate surface. These colloids and submicron particles can potentially be adsorbed on the plating surface and disrupt uniform EN film growth. This can result in defects, such as micropits and nodules on the plated surface as well as increased deposit porosity of the EN plated film, which can decrease corrosion resistance of the EN plated film.
• disks are arranged on plating mandrels that are closely spaced with average spacing between 6- 10mm.
• the number of disks per load varies, but can range from 0.5-0.9 sq. ft. per gallon of operating EN plating bath.
• This close spacing and high loading not only restricts diffusion of reactants to and from the plating surface, but can also restrict the movement of EN plating solution.
• in situ particles generated at the interface between the substrate and EN plating solution are restricted from moving away from the plating surface, increasing the tendency of the particles/colloids to adsorb and negatively affect the plating film growth.
• additives such as surfactants, can be used to improve this dynamic effect by helping to prevent the adsorption of particulates, the use of these additives can also have a deleterious impact on the plated film.
• orthophosphite anion is generated, and, as the plating progresses, this anion concentration increases.
• Typical orthophosphite levels obtained for hard disk platers can range from 30 grams per liter up to 100 grams per liter.
• Data storage EN plating bath solutions can be controlled by a steady state "bleed and feed” mechanism to keep the concentration of ortho and other by-products at a constant level. This helps to keep the both the deposit properties and plating rate predictable as they change with the accumulation of by-products. This, however, does not resolve the issue of nickel orthophosphite insolubility and furthermore does not preclude the adsorption of in situ generated particles on the plating surface. Moreover, reduction of the bleed and feed orthophosphite or by-product set point of the bath can increase the cost of operation of the bath.
• Defects from increasing orthophosphite concentration in the presence of free nickel ion include higher intrinsic stress in the plated EN film and an increase in deposit porosity, which can lead to poor corrosion resistance of the EN film in strongly acidic media. This is a condition that is highly unfavorable for advanced media production and further exaggerated by increasing pH, which is used to improve the speed of deposition.
• Embodiments described herein relate to an improved electroless nickel- phosphorous plating bath with a reduced ion concentration that deposits an alloy of nickel- phosphorous (NiP) with improved corrosion resistance in acidic media and improved deposit stress.
• the electroless nickel-phosporous bath with reduced ion concentration can provide a uniform electroless nickel-phosporous deposit on highly alkaline zincate coated substrates without the use of additives, which can produce plating defects.
• the electroless nickel-phosphorous plating bath with a reduced ion concentration operates at a reduced specific gravity, providing the additional benefit of prevention of the co-deposition of inert particles into the deposit that can cause plating defects.
• the electroless nickel-phosphorous plating bath can better tolerate the by-product formation of orthophosphite while improving the critical deposit properties, such as smoother surface morphology and reduction of microdefects, during electroless nickel plating of alkaline zincate coated substrates, which are used for high storage density applications.
• the aqueous electroless nickel-phosphorous plating bath for forming an electroless nickel-phosphorous coating on an alkaline zincate coated substrate can include about 1.0 g/1 to less than 5.0 g/1 Ni, about 25 g/1 to about 40 g/1 hypophosphorous reducing agent, and 0 to about 120 g/1 orthophosphite by-products.
• the concentration of Ni in the bath relative to the concentration of orthophosphite is such that Ni(H 2 P0 3 )2 precipitation is inhibited during plating of the alkaline zincate coated substrate at orthophosphite by-product concentrations up to 120 g/1 and bath pH of about 4.4 to about 4.8, which results in smoother surface morphology, reduction of microdefects, and enhanced corrosion resistance of the electroless nickel-phosphorous coating.
• the electroless nickel-phosphorous bath at orthophosphite concentrations of up to about 120 g/1 can provide an electroless nickel-phosphorous deposit on the alkaline zincate coated substrate with an intrinsic stress that is more compressive than an electroless nickel- phosphorous deposit provided using similar electroless nickel-phosphorous baths containing greater than 5.0 g/1 Ni.
• the bath can include at least one organic acid complexing agent.
• the amount of organic acid complexing agent provided in the bath can be substantially less than the amount of organic acid complexing agent employed in the similar electroless nickel-phosphorous baths containing greater than 5.0 g/1 Ni.
• the bath can include about 20 g/1 to about 30 g/1 of the at least one organic acid complexing agent compared to greater than about 40 g/1 to about 60 g/1 of organic acid complexing agent employed in similar electroless nickel-phosphorous baths containing greater than 5.0 g/1 Ni.
• the organic acid complexing agent can include, for example, at least one of malic acid, lactic acid, or succinic acid.
• the bath can consist essentially of water, about 2.0 g/l to about 4 g/l of Ni, about 25 g/l to about 40 g/l hypophosphorous reducing agent, 0 to about 120 g/l orthophosphite by-product, less than about 25 g/l of a combination of organic acid complexing agents selected from the group consisting of malic acid, lactic acid, and succinic acid, about 0.0004 to about 0.0007 g/l stabilizer, and at least one pH adjuster in an amount effective to provide the bath with a pH between about 4.4 and 4.8.
• inventions described herein relate to a method of forming an electroless nickel-phosphorous coating on an alkaline zincate coated substrate, such as a zin- cate coated aluminum disk for data storage.
• the method can include providing an alkaline zincate coated aluminum substrate.
• the alkaline zincate coated aluminum substrate can be provided by plating an aluminum substrate with an alkaline zincate solution.
• a surfaced of the zincate coated substrate is then contacted with an aqueous electroless nickel-phosphorous plating bath.
• the bath includes about 1.0 g/L to less than 5.0 g/l Ni, about 25 g/l to about
• the concentration of Ni in the bath relative to the concentration of orthophosphite is such that Ni(H 2 P0 3 )2 precipitation is inhibited during plating of the zincate coated substrate at orthophosphite by-product concentrations up to 120 g l and bath pH of about 4.4 to about 4.8.
• the electroless nickel-phosphorous bath at an orthophosphite concentration of up to about 120 g/l can provide an electroless nickel-phosphorous deposit on the zincate coated substrate with an intrinsic stress that is more compressive than electroless nickel-phosphorous deposit provided using similar electroless-nickel-phosphorous baths containing greater than
• Fig. 1 illustrates a graph showing maximum pH tolerance at 190°F for 70%, 90%, and 100% chelation of standard EN baths and reduced ion EN baths described herein.
• Fig. 2 illustrates a graph showing pH of a reduced ion bath at which precipitate occurs with NaOH addition in the absence of chelation.
• Fig. 3 illustrates a graph showing deposit weight loss/corrosion rate after exposure to 50% v/v nitric acid for 25 minutes with electroless nickel-phosphorous deposits formed using standard EN baths and reduced ion EN baths described herein.
• Fig. 4 illustrates intrinsic stress profiles of electroless nickel-phosphorous deposits formed using standard EN baths and reduced ion EN baths described herein.
• Fig. 5 illustrates a graph showing effect of increased pH on intrinsic stress profiles of electroless nickel-phosphorous deposits formed using standard EN baths and reduced ion EN baths described herein.
• Fig. 6 illustrates a graph showing boiling stability of standard EN baths and reduced ion EN baths described herein.
• Fig. 7 illustrates a graph showing specific gravity of standard EN baths and reduced ion EN baths described herein.
• Fig. 8 illustrates a plot showing the Ra of electroless nickel-phosphorous deposits formed using standard EN baths and reduced ion EN baths described herein.
• Fig. 9 illustrates a plot showing the Rp of electroless nickel-phosphorous deposits formed using standard EN baths and reduced ion EN baths described herein.
• Embodiments described herein relate to an improved electroless nickel- phosphorous plating bath with a reduced ion concentration that deposits an alloy of nickel- phosphorous (NiP) with improved corrosion resistance in acidic media and improved deposit stress.
• the electroless nickel-phosphorous plating bath with reduced ion concentration can provide a uniform electroless nickel-phosphorous deposit on highly alkaline zincate coated substrates without the use of additives, which can produce plating defects.
• the electroless nickel-phosphorous plating bath with a reduced ion concentration operates at a reduced specific gravity, providing the additional benefit of prevention of the co-deposition of inert particles into the deposit that can cause plating defects.
• the electroless nickel-phosphorous plating bath can better tolerate the by-product formation of orthophosphite while improving the critical deposit properties, such as smoother surface morphology and reduction of microdefects, during electroless nickel plating of alkaline zincate coated substrates, which are used for high storage density applications.
• the electroless nickel-phosphorous plating bath formulations described herein can have a reduced ionic strength and, specifically, a reduced concentration of Ni ions compared to standard electroless nickel baths.
• the electroless nickel- phosphorous plating bath can have a reduction in the concentration of Ni ions to levels ranging from about 1.0 to less than about 5.0 grams per liter, for example, about 2.0 g/1 to about 4.0 g/1 Ni, and, specifically, about 3 g/1 Ni.
• the concentration of Ni in the bath relative to the concentration of orthophosphite is such that Ni(H 2 P0 3 )2 precipitation is inhibited during plating of the alkaline zincate coated substrate at orthophosphite by-product concentrations up to 120 g/1 and bath pH of about 4.4 to about 4.8.
• Ni ions at reduced levels allows the electroless nickel-phosphorous plating bath to employ significantly less complexing agents compared to standard baths having Ni concentrations greater than 5.0 g/1 (e.g., about 6 g/1 or more) and operate with an orthophosphite concentration of up to about 120 g/1 to provide an electroless nickel-phosphorous deposit on the alkaline zincate coated substrate with an intrinsic stress that is more compressive than electroless nickel-phosphorous deposit provided using standard baths having Ni concentrations greater than 5.0 g/1.
• electroless nickel-phosphorous deposit formed from electroless nickel baths that include 1.0 g/1 to less than about 5.0 g/1 Ni, for example, about 2.0 g/1 to about 4.0 g/1 Ni, or about 3 g/1 Ni, showed improved corrosion resistance in acidic media and have a smoother surface morphology and reduction of microdefects compared electroless nickel-phosphorous deposits formed using standard baths having Ni concentrations greater than 5.0 g/1.
• the electroless nickel-phosphorous plating bath used to form the electroless nickel-phosphorous coating includes Ni, a hypophosphorous reducing agent, orthophosphite by-product and optionally at least of one of a complexing agent, chelating agent, stabilizer, and/or pH buffer.
• the nickel can be provided in the bath in the form of a water soluble nickel salt.
• the water-soluble nickel salts can include those, which are soluble in the plating bath and which can yield an aqueous solution of a predetermined concentration.
• the nickel salt can be selected from the group consisting of nickel sulfate, nickel chloride, nickel bromide, nickel iodide, nickel acetate, nickel malate, a nickel hypophosphite and combinations thereof.
• the water-soluble nickel salts may be used alone or as a mixture.
• the hypophosphorous reducing agent used in the bath can include any of a variety of hypophosphorous reducing agents used in known types of the electroless nickel plating baths.
• the hypophosphorous reducing agent is selected from the group consisting of sodium hypophosphite, potassium hypophosphite, ammonium hypophosphite, and combinations thereof.
• the concentration of the hypophosphorous reducing agent in the electroless nickel plating can differ with the respective types of hypophosphorous reducing agent and can be adjusted to vary the concentration of the phosphorous in the electroless nickel- phosphorous coating that is formed using the bath.
• the concentration of the hypophosphorous reducing agent in the electroless nickel-phosphorous plating bath can be about 25 g/L to about 40 g/L, for example, about 30 g/1 to about 35 g/1. In other embodiments, the concentration of the hypophosphorous reducing agent in the electroless nickel- phosphorous plating bath can be about 30 g/L.
• a complexing agent or a mixture of complexing agents may be included in the electroless nickel-phosphorous plating bath.
• Complexing agents as used herein can also include chelating agents.
• the complexing agents and/or chelating agents generally retard the precipitation of nickel ions from the plating solution as insoluble salts, such as phosphites, by forming a more stable nickel complex with the nickel ions and provide for a moderate rate of the reaction of nickel precipitation.
• the complexing agents and/or chelating agents can be included in the plating bath in amounts sufficient to complex the nickel ions present in the bath and to further solu- bilize the hypophosphite degradation products formed during the plating process.
• the amount of complexing agent is substantially less than the amount of complexing agent employed in the similar electroless nickel-phosphorous baths containing greater than 5.0 g/1 nickel ions.
• the complexing agents and/or chelating agents are provided in the electroless nickel-phosphorous plating bath at amounts from 20 g/1 to about 30 g/1.
• a variety of complexing agents used in known electroless nickel plating solutions, may be used.
• Specific examples of the complexing agents may include monocarbox- ylic acids, such as glycolic acid, lactic acid, gluconic acid or propionic acid, dicarboxylic acids, such as malic acid, malonic acid, succinic acid, tartaric acid, oxalic acid or adipic acid, aminocarboxylic acids, such as glycine or alanine, ethylene diamine derivatives, such as ethylenediamine tetraacetate, versenol (N-hydroxyethyl ethylenediamine-N,N',N'-triacetic acid) or quadrol ( ⁇ , ⁇ , ⁇ ', N'-tetrahydroxy ethyl ethylene diamine), phosphnic acids, such as 1- hydroxy ethane- 1, 1 -diphosphonic acid, ethylene diamine tetramethylene phosphonic acid and water-soluble salts thereof.
• Some complexing agents such as acetic acid or succinic, for example, may also act as a pH buffering agent, and the appropriate concentration of such additive components can be optimized for any plating bath after consideration of their dual functionality.
• At least one pH buffer, complexing agent, or chelating agent can be selected from the group consisting of an acetic acid, formic acid, succinic acid, malonic acid, an ammonium salt, lactic acid, malic acid, citric acid, glycine, alanine, glycolic acid, lysine, aspartic acid, ethylene diamine tetraacetic acid (EDTA), and combinations thereof.
• EDTA ethylene diamine tetraacetic acid
• mixtures of 2 or more of the above pH buffers, complexing agents, and/or chelating agents can be used in the electroless nickel plating bath described herein.
• the electroless nickel-phosphorous plating bath can include about 20 g/1 to about 30 g/1 of a combination of organic acid complexing agents select- ed from the group consisting of malic acid, lactic acid, and succinic acid. In other embodiments, the electroless nickel-phosphorous plating bath can include less than about 25 g/1 of a combination of organic acid complexing agents selected from the group consisting of malic acid, lactic acid, and succinic acid.
• the plating bath may also contain, in addition to the above components, additives with various kinds of purposes so long as the properties of the plating bath are not deteriorated.
• the bath can include a stabilizer, such as lead acetate, at a concentration of about 0.0004 g/1 to about 0.0007 g/1.
• stabilizers can also be used besides or in addition to lead acetate including those metal cations that act as catalytic poisons, such as Pb, Bi, Sn, In, salts or compounds thereof and combinations thereof.
• the electroless nickel-phosphorous plating bath can be free of or substantially free of additives, such as surfactants, which can have a negative effect on the corrosion resistance and surface morphology of the electroless nickel-phosphorous deposit.
• additives such as surfactants, which can have a negative effect on the corrosion resistance and surface morphology of the electroless nickel-phosphorous deposit.
• Surfactants including organic compounds from the class of fatty acids and water soluble salts thereof, amino compounds, and sulfates and sulfonates of fatty acids and fatty alcohols are typically employed in electroless nickel plating baths to modify the inherent properties of the plating bath itself or the quality of the nickel deposit.
• These additives can potentially form colloids with other components of the bath, such as free Ni, Zn, Fe, and Al, ions, that can produce plating defects.
• the plating bath described herein can be free of or substantially free of such additives to minimize defects, such as
• the aqueous electroless nickel-phosphorous plating baths can be operated or maintained at a pH of about 4.4 to about 4.8 during electroless nickel-phosphorous plating of an alkaline zincate coated substrate. With this range of pH, the reducing reaction by the hypophosphorous reducing agent is allowed to occur efficiently to prevent decomposition of the hypophosphorous reducing agent as well as to prevent precipitation of nickel
• At least one pH adjustment agent can be used to adjust the pH to the above range.
• the pH of the bath is too high, it can be adjusted by adding, for example, an ac- id.
• the pH of the bath is too low, it can be adjusted by adding, for example, ammonium hydroxide.
• the stability of the operating pH of the plating bath can be controlled by the addition of various buffer compounds such as acetic acid, propionic acid, boric acid, or the like, in amounts up to about 30 g/1 with amounts of from about 2 g/1 to about 30 g/1 being typical.
• buffering compounds such as acetic acid and succinic acid may also function as complexing agents.
• a substrate can be plated with the electroless nickel-phosphorous plating bath to provide an electroless nickel-phosphorous deposit or coating on the substrate.
• the substrate can be an aluminum substrate on which a zincate coating has been deposited using a highly alkaline zincate plating process.
• the aluminum substrate can be an aluminum or aluminum alloy disc used for data storage applications, such as an aluminum hard disk for use in hard drive media.
• the alkaline zincate plating process can employ an alkaline zinc bath or solution having a high pH (e.g., greater than pH 14).
• the alkaline zincate coated aluminum substrate can be plated using the electroless nickel-phosphorous plating bath by contacting the substrate with or immersing the substrate in the plating bath for a duration time effective to form an electroless nickel- phosphorous coating or deposit on the zincate coated surface of the substrate.
• the zincate coated surface on the aluminum disk has a high localized pH than can potentially induce in situ formation of colloids and submicron particles at the interface or diffusion zone of the bath and zincate surface. Such colloids and submicron particles can disrupt uniform electroless nickel-phosphorous film growth and corrosion resistance of the nick-phosphorous film.
• the reduced ion concentration of the electroless nickel-phosporous plating bath is such that the bath has a reduced specific gravity and during plating of the alkaline zincate coated substrate Ni(H 2 P0 3 )2 precipitation is inhibited, thereby preventing co- deposition of inert particles into the electroless nickel-phosphorous deposit, enhancing uniform electroless nickel-phosphorous film growth, reducing microdefects in the electroless nickel-phosphorous film, and improving corrosion resistance of the electroless nickel- phosphorous film.
• the substrate can be cleaned or pre-processed prior to plating.
• the bath can be maintained at a bath temperature about 175°F to about 200°F, e.g., about 188°F to about 194°F.
• the duration of contact of the electroless nickel- phosphorous plating bath with the substrate being plated will determine the thickness of the electroless nickel-phosphorous coating.
• a contact time can range from as little as about one minute to several hours or even several days, for example, about 60 to about 120 minutes.
• the electroless nickel-phosphorous plating bath also may be subjected to a periodic or continuous filtration treatment to reduce the level of contaminants therein. Replenishment of the constituents of the bath may also be performed, in some embodiments, on a periodic or continuous basis to maintain the concentration of constituents, and in particular, the concentration of nickel ions and hypophosphite ions, as well as the pH level within the desired limits.
• the electroless nickel-phosphorous plating bath can be operated at orthophosphite concentrations of up to about 120 g/1 and/or up to 4 MTOs (based on ortho generation per turnover) without a substantial reduction in the electroless nickel-phosphorous deposit properties or in plating bath efficiency.
• the MTO of the plating bath can be between 2.0 and 4.5. Maintaining the MTO within these levels allows for an economic plating performance and consistently reproducible plating results.
• the electroless nickel-phosphorous coated substrate so formed can be removed from the electroless nickel plating bath and rinsed, for example, with deionized water.
• the electroless nickel coating formed on a surface of the substrate using the electroless nickel-phosphorous plating bath can have of relatively uniform thickness and be substantially free of asperites and micro defects, such a pits and nodules.
• the electroless nickel-phosphorous coating can also have an enhanced corrosion resistance and an intrinsic stress that is more compressive than electroless nickel-phosphorous coating provided using standard baths having Ni concentrations greater than 5.0 g/1.
• the electroless nickel-phosphorous coating can have an average thickness in a range from about 1 micron to about 250 microns. In another embodiment, the electroless nickel-phosphorous coating can have an average thickness in a range from about 1 micron to about 100 microns.
• the electroless nickel coating can be a high phosphorous coating having a phosphorous content of about 10 to about 13% phosphorous. Actual thickness of an as plated disk can be about 250 to about 600 micro inches.
• Reduced electroless nickel-phosphorous plating bath and a standard electroless nickel-phosphorous plating bath were prepared with the following formulations. The baths were operated under similar conditions noted below.
• the reduced ion electroless nickel-phosphorous plating bath formulation allowed for a significant reduction in the amount of organic acids needed for complexing to nearly half as compared standard formulations used in the data storage plating industry.
• Ni concentration operates at approximately half the standard concentration of most commercial processes there is a profoundly positive impact on the concentration range of orthophosphite that is tolerated in the system. This process allows for higher levels of by-product formation while improving the corrosion resistance and intrinsic stress of the deposit. It is postulated that the primary reason for the system improvement is the change to the solubility product constant.
• the micro precipitation of Ni orthophosphite does not take place until higher by-product concentrations are reached due the equilibrium shift realized by the lower nickel concentration and further by the fact that the formulation can better tolerate the adverse affect of the pH neutralization that occurs during the introduction of the zincated aluminum into the working bath.
• Fig. 1 illustrates the affect that chelation has on the impact of orthophosphite precipitation at 190°F.
• a titration of a working EN bath containing an orthophosphite concentration of 60 g/L with dilute sodium hydroxide reveals the Reduced Ion formulation can tolerate a pH of close to 13 while the standard formulation can only tolerate a pH of 9.2 before the onset of precipitation.
• Fig. 2 further illustrates the tolerance of the Reduced Ion formulation to pH and precipitation and the impact the reduced nickel concentration alone (no chelation) has on the Nickel orthophosphite precipitation over a range of orthophosphite concentrations at room temperature.
• Fig. 3 illustrates the weight loss results after exposure to 50% Nitric acid corrosion exposure at 74°F for 25 minutes.
• the Reduced Ion deposit produced from a solution with a pH of 4.54 and 60 gpl orthophosphite afforded a 17% improvement in corrosion rate as compared to the standard process. This was reproducible at higher orthophosphite levels (90gpl) at pH 4.68. It is important to note that the plating rate for both processes was controlled at 3.8-4.3 microinches per minute.
• Fig. 4 shows the impact that bath age (ortho level), pH, and formulation have on the resulting deposit stress.
• the Reduced Ion EN deposit afforded a compressive stress, even under the most severe plating condition of pH / ortho respectively 4.72 / 90 gpl.
• Increasing the pH to even higher levels at a 90 gpl ortho concentration has even a greater impact on intrinsic stress.
• Fig. 5 illustrates the improvement at a pH at 4.89.
• Electroless nickel solutions are stabilized with certain additives such as Pb, Bi, and other inhibitors that act as catalytic poisons (such as Sn and In) They are very effective at very low concentrations and generally diffuse non linearly onto or near the plating surface. Concentration ranges from 0.2 ppm up to 2.0 ppm are typical. Even at this range of concentration the deposit performance can be impacted negatively and is a function of the plating process solution dynamics. In the data storage industry, it is favorable to improve the bath stability without the use of additional catalytic poisons, since other key performance factors like micro pitting and surface edge profiles/uniformity are impacted by higher stabilizer levels.
• Fig. 6 shows the performance of the reduced ion chemistry against the standard formulation in a boiling stability evaluation.
• the boiling stability is a standard laboratory test and generally accepted for use to evaluate and predict the ability of an EN formulation to maintain stability under severe plating conditions.
• time to seed out (nucleation of Nickel particles) was comparable for both the Reduced Ion chemistry (RI) and Standard chemistry the time to complete plate out was greatly improved. It is important to note that once seed out occurs the nucleation sites are present for further decomposition and the tolerance for the RI formulation to decompose is far greater than the standard chemistry. Additionally the improvement in bath stability can improve the overall surface smoothness of the EN deposit under more severe operating conditions such as higher temperatures above 194°F.
• FIG. 7 illustrates the reduction in specific gravity of the reduced ion chemistry at three orthophosphite levels (30/60/90 g/L) correlating to bath ages of 1.0/2.5/3.8 MTO. Being able to operate at a low specific gravity may have an impact on particle adsorption and the subsequent encapsulation of particles during the plating operation. The particles may be generated in situ in the electroless nickel plating bath or can be introduced from the external environment.
• the substrates are fixed on a rack system designed to continuously move in the plating bath, mainly to keep the solution velocity fast, keeping the diffusion zone free of any particles as disk spacing on the racks is very close making it difficult for those particles to escape before adsorption.
• the disks are mechanically abrading the plastic racks (usually PVDF, PEEK, PP and PTFE) which introduce small plastic particles into the plating bath. It seems logical to add surfactants to the chemical formulation to prevent the adsorption of these particles, however the surfactant introduction itself can have a negative impact on other critical film properties such as corrosion resistance and micro pitting.
• the corresponding MTO for the Reduced Ion bath to maintain the same specific gravity of the plating solution is significantly higher, giving the disk manufacturer an opportunity to better control costs while improving the quality of the plated EN film.
• Disks produced using the reduced ion formulations have better surface morphology after corrosion testing in acid media than standard formulations.
• disk substrates 95mm / alloy 5586D
• the disks were polished using a Struers Tegramin -30 single sided polisher removing 40 micro inches, then subjected to a Nitric acid solution at 74 degrees for 60 minutes.
• the disk were measured (using a MicroXam 100 profilometer) before and after corrosion testing for Ra and Rp, indicating the degree of surface roughness and the degree of nodular height respectively. The results shown in Figs.

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• Chemically Coating (AREA)

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• 2016
  • 2016-07-14 JP JP2018521482A patent/JP2018523019A/ja active Pending
  • 2016-07-14 WO PCT/US2016/042271 patent/WO2017015054A1/en not_active Ceased
  • 2016-07-14 EP EP16828269.7A patent/EP3325688B1/en active Active
  • 2016-07-14 US US15/745,600 patent/US20180209047A1/en not_active Abandoned
  • 2016-07-14 SG SG10201913013PA patent/SG10201913013PA/en unknown
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