JP2018523019A - 低減されたイオン濃度を有する無電解ニッケル−リンめっき浴および使用方法 - Google Patents

低減されたイオン濃度を有する無電解ニッケル−リンめっき浴および使用方法 Download PDF

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JP2018523019A
JP2018523019A JP2018521482A JP2018521482A JP2018523019A JP 2018523019 A JP2018523019 A JP 2018523019A JP 2018521482 A JP2018521482 A JP 2018521482A JP 2018521482 A JP2018521482 A JP 2018521482A JP 2018523019 A JP2018523019 A JP 2018523019A
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Prior art keywords
bath
acid
electroless nickel
concentration
orthophosphorous
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English (en)
Japanese (ja)
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JP2018523019A5 (enExample
Inventor
ルッフィーニ，アラン，ジェイ
ジェイ ウォフシック、マシュー
ジェイ ウォフシック、マシュー
ラプランテ，ジーン
ミスティー，ニレッシュ
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コベントヤ，インコーポレイテッド
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Publication of JP2018523019A publication Critical patent/JP2018523019A/ja
Publication of JP2018523019A5 publication Critical patent/JP2018523019A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739—Magnetic recording media substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
JP2018521482A 2015-07-17 2016-07-14 低減されたイオン濃度を有する無電解ニッケル−リンめっき浴および使用方法 Pending JP2018523019A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562193728P 2015-07-17 2015-07-17
US62/193,728 2015-07-17
PCT/US2016/042271 WO2017015054A1 (en) 2015-07-17 2016-07-14 Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use

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Publication Number Publication Date
JP2018523019A true JP2018523019A (ja) 2018-08-16
JP2018523019A5 JP2018523019A5 (enExample) 2019-08-22

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JP2018521482A Pending JP2018523019A (ja) 2015-07-17 2016-07-14 低減されたイオン濃度を有する無電解ニッケル−リンめっき浴および使用方法

Country Status (6)

Country Link
US (1) US20180209047A1 (enExample)
EP (1) EP3325688B1 (enExample)
JP (1) JP2018523019A (enExample)
MY (1) MY185286A (enExample)
SG (1) SG10201913013PA (enExample)
WO (1) WO2017015054A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022254923A1 (ja) * 2021-06-03 2022-12-08 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7560093B2 (ja) * 2020-06-03 2024-10-02 奥野製薬工業株式会社 無電解ニッケル－リンめっき浴
WO2023101770A1 (en) * 2021-11-30 2023-06-08 Coventya, Inc. Electroless antipathogenic coating
CN114438481B (zh) * 2022-01-24 2023-07-07 四川轻化工大学 非晶态镍磷合金镀层及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01201484A (ja) * 1987-10-06 1989-08-14 Hitachi Ltd 化学ニッケルめっき液及びその使用方法
JP2000503354A (ja) * 1996-11-14 2000-03-21 アトテク ドイツェラント ゲーエムベーハー 無電解ニッケルめっき浴からのオルト亜燐酸塩イオンの除去
US6524642B1 (en) * 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
JP2012505970A (ja) * 2008-10-16 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 金属めっき添加剤並びに基板のめっき方法およびこの方法により得られる製品
JP2012505964A (ja) * 2008-10-17 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 接合可能なウェハ表面のための応力が低減されたＮｉ−Ｐ／Ｐｄ積層
JP2017535674A (ja) * 2014-11-26 2017-11-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ ニッケル層の無電解析出のためのめっき浴および方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU65309A1 (enExample) 1972-05-08 1973-11-23
US4511614A (en) * 1983-10-31 1985-04-16 Ball Corporation Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same
WO2014123535A1 (en) 2013-02-08 2014-08-14 OMG Electronic Chemicals, Inc. Methods for metallizing an aluminum paste

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01201484A (ja) * 1987-10-06 1989-08-14 Hitachi Ltd 化学ニッケルめっき液及びその使用方法
JP2000503354A (ja) * 1996-11-14 2000-03-21 アトテク ドイツェラント ゲーエムベーハー 無電解ニッケルめっき浴からのオルト亜燐酸塩イオンの除去
US6524642B1 (en) * 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
JP2012505970A (ja) * 2008-10-16 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 金属めっき添加剤並びに基板のめっき方法およびこの方法により得られる製品
JP2012505964A (ja) * 2008-10-17 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 接合可能なウェハ表面のための応力が低減されたＮｉ−Ｐ／Ｐｄ積層
JP2017535674A (ja) * 2014-11-26 2017-11-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ ニッケル層の無電解析出のためのめっき浴および方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022254923A1 (ja) * 2021-06-03 2022-12-08 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法
JP2022185929A (ja) * 2021-06-03 2022-12-15 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法
JP7730667B2 (ja) 2021-06-03 2025-08-28 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法

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Publication number Publication date
US20180209047A1 (en) 2018-07-26
EP3325688A1 (en) 2018-05-30
SG10201913013PA (en) 2020-03-30
EP3325688B1 (en) 2021-02-24
MY185286A (en) 2021-04-30
WO2017015054A1 (en) 2017-01-26
EP3325688A4 (en) 2019-02-13

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