JP5201897B2 - 無電解銅めっき液及び無電解銅めっき方法 - Google Patents

無電解銅めっき液及び無電解銅めっき方法 Download PDF

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JP5201897B2
JP5201897B2 JP2007181256A JP2007181256A JP5201897B2 JP 5201897 B2 JP5201897 B2 JP 5201897B2 JP 2007181256 A JP2007181256 A JP 2007181256A JP 2007181256 A JP2007181256 A JP 2007181256A JP 5201897 B2 JP5201897 B2 JP 5201897B2
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copper plating
film
plating solution
electroless copper
copper
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JP2009019225A5 (enExample
JP2009019225A (ja
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桂 今藤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2007181256A 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法 Active JP5201897B2 (ja)

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JP2007181256A JP5201897B2 (ja) 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法

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JP2007181256A JP5201897B2 (ja) 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法

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JP2009019225A JP2009019225A (ja) 2009-01-29
JP2009019225A5 JP2009019225A5 (enExample) 2010-06-17
JP5201897B2 true JP5201897B2 (ja) 2013-06-05

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076549A1 (ko) * 2013-11-22 2015-05-28 한국생산기술연구원 무전해 구리 도금액 조성물 및 이를 이용한 무전해 구리 도금방법
JP6270681B2 (ja) 2014-09-29 2018-01-31 学校法人 関西大学 配線構造体の製造方法、銅置換めっき液および配線構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01129977A (ja) * 1987-11-13 1989-05-23 Hitachi Ltd 銅めっき液
JP3052515B2 (ja) * 1991-11-28 2000-06-12 上村工業株式会社 無電解銅めっき浴及びめっき方法
JP3332668B2 (ja) * 1994-07-14 2002-10-07 松下電器産業株式会社 半導体装置の配線形成に用いる無電解めっき浴及び半導体装置の配線形成方法
JP2002180259A (ja) * 2000-12-12 2002-06-26 Shipley Co Llc めっき液における金属析出促進化合物および該化合物を含むめっき液
JP2002363762A (ja) * 2001-06-07 2002-12-18 Naoki Toriyama 無電解めっき液及び無電解めっき方法
JP5188683B2 (ja) * 2006-06-12 2013-04-24 パナソニック株式会社 接点部品または電池部品用材料と、それを用いた電池

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