JP2015509146A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015509146A5 JP2015509146A5 JP2014555202A JP2014555202A JP2015509146A5 JP 2015509146 A5 JP2015509146 A5 JP 2015509146A5 JP 2014555202 A JP2014555202 A JP 2014555202A JP 2014555202 A JP2014555202 A JP 2014555202A JP 2015509146 A5 JP2015509146 A5 JP 2015509146A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- plating bath
- electroless nickel
- range
- nickel plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12153540.5 | 2012-02-01 | ||
| EP12153540 | 2012-02-01 | ||
| PCT/EP2013/051889 WO2013113810A2 (en) | 2012-02-01 | 2013-01-31 | Electroless nickel plating bath |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015509146A JP2015509146A (ja) | 2015-03-26 |
| JP2015509146A5 true JP2015509146A5 (enExample) | 2016-03-24 |
| JP6180441B2 JP6180441B2 (ja) | 2017-08-16 |
Family
ID=47624100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014555202A Active JP6180441B2 (ja) | 2012-02-01 | 2013-01-31 | 無電解ニッケルめっき浴 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9399820B2 (enExample) |
| EP (1) | EP2809825B1 (enExample) |
| JP (1) | JP6180441B2 (enExample) |
| KR (1) | KR102138387B1 (enExample) |
| CN (1) | CN104136658B (enExample) |
| BR (1) | BR112014018768B1 (enExample) |
| CA (1) | CA2860596C (enExample) |
| ES (1) | ES2688876T3 (enExample) |
| WO (1) | WO2013113810A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2639300T3 (es) | 2014-12-16 | 2017-10-26 | Atotech Deutschland Gmbh | Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas |
| KR102513653B1 (ko) | 2015-03-20 | 2023-03-23 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 실리콘 기판의 활성화 방법 |
| CN104975311A (zh) * | 2015-07-01 | 2015-10-14 | 张志梁 | 一种钢铁基体上直接无氰酸性镀铜镀液及工艺 |
| EP3190208B1 (en) | 2016-01-06 | 2018-09-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
| JP6645881B2 (ja) * | 2016-03-18 | 2020-02-14 | 上村工業株式会社 | 銅めっき液及び銅めっき方法 |
| TWI713737B (zh) | 2016-05-04 | 2020-12-21 | 德商德國艾托特克公司 | 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法 |
| CN107385481A (zh) * | 2017-07-26 | 2017-11-24 | 苏州鑫旷新材料科技有限公司 | 一种无氰电镀金液 |
| KR102250500B1 (ko) * | 2019-03-18 | 2021-05-12 | (주)엠에스씨 | 자동차 lds 전장 부품용 무전해 중성-중온 니켈도금액 |
| CN111733404A (zh) * | 2020-08-10 | 2020-10-02 | 广州皓悦新材料科技有限公司 | 一种化学镀镍镀液及其制备方法 |
| US11505867B1 (en) | 2021-06-14 | 2022-11-22 | Consolidated Nuclear Security, LLC | Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore |
| JP7215705B1 (ja) * | 2021-06-24 | 2023-01-31 | 奥野製薬工業株式会社 | めっき皮膜及びめっき皮膜の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2762723A (en) | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
| US5503877A (en) | 1989-11-17 | 1996-04-02 | Atotech Deutschalnd Gmbh | Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate |
| CA2119050C (en) | 1993-03-18 | 1999-11-23 | Nayan H. Joshi | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| JPH0913175A (ja) * | 1995-04-24 | 1997-01-14 | Nitto Chem Ind Co Ltd | ジアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴 |
| JP2001342453A (ja) * | 2000-06-01 | 2001-12-14 | Mitsubishi Rayon Co Ltd | キレート剤組成物 |
| JP2002348680A (ja) | 2001-05-22 | 2002-12-04 | Sharp Corp | 金属膜パターンおよびその製造方法 |
| JP3800213B2 (ja) * | 2003-09-11 | 2006-07-26 | 奥野製薬工業株式会社 | 無電解ニッケルめっき液 |
| DE102004047423C5 (de) * | 2004-09-28 | 2011-04-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung |
| JP4705776B2 (ja) * | 2004-12-17 | 2011-06-22 | 日本カニゼン株式会社 | リン酸塩被膜を有する無電解ニッケルめっき膜の形成方法およびその形成膜 |
| WO2006102182A2 (en) * | 2005-03-18 | 2006-09-28 | Applied Materials, Inc. | Process for electroless copper deposition |
| PT1988192E (pt) * | 2007-05-03 | 2013-01-24 | Atotech Deutschland Gmbh | Processo para aplicação de um revestimento metálico a um substrato não condutor |
| KR101058635B1 (ko) * | 2008-12-23 | 2011-08-22 | 와이엠티 주식회사 | 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법 |
| DE102009029558A1 (de) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | Elektrolytzusammensetzung |
| CN101705615B (zh) * | 2009-11-03 | 2011-11-23 | 上海大学 | 镀镍镀铜芳香族聚酰胺导电纤维的制备方法 |
| JP6082595B2 (ja) * | 2009-12-17 | 2017-02-15 | ビーワイディー カンパニー リミテッド | 表面金属化の方法、プラスチック製品を調製する方法、およびそのような方法から製造されたプラスチック製品 |
| CN102286735A (zh) * | 2010-06-19 | 2011-12-21 | 比亚迪股份有限公司 | 一种化学镀镍溶液 |
-
2013
- 2013-01-31 JP JP2014555202A patent/JP6180441B2/ja active Active
- 2013-01-31 EP EP13701660.6A patent/EP2809825B1/en active Active
- 2013-01-31 ES ES13701660.6T patent/ES2688876T3/es active Active
- 2013-01-31 CA CA2860596A patent/CA2860596C/en active Active
- 2013-01-31 US US14/368,589 patent/US9399820B2/en active Active
- 2013-01-31 WO PCT/EP2013/051889 patent/WO2013113810A2/en not_active Ceased
- 2013-01-31 KR KR1020147021204A patent/KR102138387B1/ko active Active
- 2013-01-31 BR BR112014018768-1A patent/BR112014018768B1/pt active IP Right Grant
- 2013-01-31 CN CN201380007827.9A patent/CN104136658B/zh active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015509146A5 (enExample) | ||
| JP6180441B2 (ja) | 無電解ニッケルめっき浴 | |
| KR101930585B1 (ko) | 니켈층들의 무전해 성막을 위한 도금욕 | |
| JP6298530B2 (ja) | 無電解ニッケルめっき液、及び無電解ニッケルめっき方法 | |
| JP6620103B2 (ja) | パラジウムめっき液及びそれを用いて得られたパラジウム皮膜 | |
| US9551073B2 (en) | Method for depositing a first metallic layer onto non-conductive polymers | |
| TWI728217B (zh) | 錫電鍍浴液及於基板之表面上沉積錫或錫合金之方法 | |
| US20140076798A1 (en) | Tribologically Loadable Mixed Noble Metal/Metal Layers | |
| JP6676620B2 (ja) | 銅回路、銅合金回路、およびタッチスクリーンデバイスの光反射率の低減方法 | |
| TWI540223B (zh) | 用於錫及錫合金沈積之自催化電鍍浴組合物 | |
| TWI593687B (zh) | 用於在鎳表面上形成有機塗層的方法 | |
| MX2016006412A (es) | Composicion acuosa de recubrimiento por inmersion que comprende bismuto disuelto, para sustratos conductores de electricidad. | |
| JP2017535674A (ja) | ニッケル層の無電解析出のためのめっき浴および方法 | |
| CN105051254B (zh) | 供无电电镀的铜表面活化的方法 | |
| JP2018070907A (ja) | ニッケルめっき液 | |
| JP6277407B2 (ja) | 金属めっき皮膜の製造方法及びセンシタイジング液の製造方法 | |
| CN106460180B (zh) | 高磷无电镍 | |
| JPH06104902B2 (ja) | 無電解銅ニッケル合金めっき方法 | |
| JP2017505385A5 (enExample) | ||
| US20120114870A1 (en) | Manufacturing method of noble metal plating layer | |
| JP2007056346A5 (enExample) | ||
| JP2005139512A (ja) | 無電解Ｐｄ−Ａｇ合金めっき | |
| CN104294336A (zh) | 一种铝合金镀前表面预处理液的配制方法 |