CN104136658B - 无电镀镍浴 - Google Patents

无电镀镍浴 Download PDF

Info

Publication number
CN104136658B
CN104136658B CN201380007827.9A CN201380007827A CN104136658B CN 104136658 B CN104136658 B CN 104136658B CN 201380007827 A CN201380007827 A CN 201380007827A CN 104136658 B CN104136658 B CN 104136658B
Authority
CN
China
Prior art keywords
acid
electroless nickel
nickel
nickel plating
plating baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380007827.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN104136658A (zh
Inventor
C.C.费尔斯
B.迪尔布施
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN104136658A publication Critical patent/CN104136658A/zh
Application granted granted Critical
Publication of CN104136658B publication Critical patent/CN104136658B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201380007827.9A 2012-02-01 2013-01-31 无电镀镍浴 Active CN104136658B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12153540.5 2012-02-01
EP12153540 2012-02-01
PCT/EP2013/051889 WO2013113810A2 (en) 2012-02-01 2013-01-31 Electroless nickel plating bath

Publications (2)

Publication Number Publication Date
CN104136658A CN104136658A (zh) 2014-11-05
CN104136658B true CN104136658B (zh) 2016-10-26

Family

ID=47624100

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380007827.9A Active CN104136658B (zh) 2012-02-01 2013-01-31 无电镀镍浴

Country Status (9)

Country Link
US (1) US9399820B2 (enExample)
EP (1) EP2809825B1 (enExample)
JP (1) JP6180441B2 (enExample)
KR (1) KR102138387B1 (enExample)
CN (1) CN104136658B (enExample)
BR (1) BR112014018768B1 (enExample)
CA (1) CA2860596C (enExample)
ES (1) ES2688876T3 (enExample)
WO (1) WO2013113810A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2639300T3 (es) 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
KR102513653B1 (ko) 2015-03-20 2023-03-23 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 실리콘 기판의 활성화 방법
CN104975311A (zh) * 2015-07-01 2015-10-14 张志梁 一种钢铁基体上直接无氰酸性镀铜镀液及工艺
EP3190208B1 (en) 2016-01-06 2018-09-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys
JP6645881B2 (ja) * 2016-03-18 2020-02-14 上村工業株式会社 銅めっき液及び銅めっき方法
TWI713737B (zh) 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
CN107385481A (zh) * 2017-07-26 2017-11-24 苏州鑫旷新材料科技有限公司 一种无氰电镀金液
KR102250500B1 (ko) * 2019-03-18 2021-05-12 (주)엠에스씨 자동차 lds 전장 부품용 무전해 중성-중온 니켈도금액
CN111733404A (zh) * 2020-08-10 2020-10-02 广州皓悦新材料科技有限公司 一种化学镀镍镀液及其制备方法
US11505867B1 (en) 2021-06-14 2022-11-22 Consolidated Nuclear Security, LLC Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore
JP7215705B1 (ja) * 2021-06-24 2023-01-31 奥野製薬工業株式会社 めっき皮膜及びめっき皮膜の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005082883A (ja) * 2003-09-11 2005-03-31 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
CN101705615A (zh) * 2009-11-03 2010-05-12 上海大学 镀镍镀铜芳香族聚酰胺导电纤维的制备方法
CN101760731A (zh) * 2008-12-23 2010-06-30 三星电机株式会社 无电镍电镀溶液组合物、柔性印刷电路板及其制造方法
CN102021613A (zh) * 2009-09-17 2011-04-20 肖特太阳能控股公司 电解质组合物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US5503877A (en) 1989-11-17 1996-04-02 Atotech Deutschalnd Gmbh Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate
CA2119050C (en) 1993-03-18 1999-11-23 Nayan H. Joshi Self accelerating and replenishing non-formaldehyde immersion coating method and composition
JPH0913175A (ja) * 1995-04-24 1997-01-14 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴
JP2001342453A (ja) * 2000-06-01 2001-12-14 Mitsubishi Rayon Co Ltd キレート剤組成物
JP2002348680A (ja) 2001-05-22 2002-12-04 Sharp Corp 金属膜パターンおよびその製造方法
DE102004047423C5 (de) * 2004-09-28 2011-04-21 AHC-Oberflächentechnik GmbH & Co. OHG Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung
JP4705776B2 (ja) * 2004-12-17 2011-06-22 日本カニゼン株式会社 リン酸塩被膜を有する無電解ニッケルめっき膜の形成方法およびその形成膜
WO2006102182A2 (en) * 2005-03-18 2006-09-28 Applied Materials, Inc. Process for electroless copper deposition
PT1988192E (pt) * 2007-05-03 2013-01-24 Atotech Deutschland Gmbh Processo para aplicação de um revestimento metálico a um substrato não condutor
JP6082595B2 (ja) * 2009-12-17 2017-02-15 ビーワイディー カンパニー リミテッド 表面金属化の方法、プラスチック製品を調製する方法、およびそのような方法から製造されたプラスチック製品
CN102286735A (zh) * 2010-06-19 2011-12-21 比亚迪股份有限公司 一种化学镀镍溶液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005082883A (ja) * 2003-09-11 2005-03-31 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
CN101760731A (zh) * 2008-12-23 2010-06-30 三星电机株式会社 无电镍电镀溶液组合物、柔性印刷电路板及其制造方法
CN102021613A (zh) * 2009-09-17 2011-04-20 肖特太阳能控股公司 电解质组合物
CN101705615A (zh) * 2009-11-03 2010-05-12 上海大学 镀镍镀铜芳香族聚酰胺导电纤维的制备方法

Also Published As

Publication number Publication date
BR112014018768B1 (pt) 2021-04-06
EP2809825B1 (en) 2018-07-18
WO2013113810A2 (en) 2013-08-08
JP2015509146A (ja) 2015-03-26
CA2860596A1 (en) 2013-08-08
WO2013113810A3 (en) 2014-07-10
US20150159274A1 (en) 2015-06-11
EP2809825A2 (en) 2014-12-10
KR102138387B1 (ko) 2020-07-28
US9399820B2 (en) 2016-07-26
BR112014018768A8 (pt) 2017-07-11
ES2688876T3 (es) 2018-11-07
BR112014018768A2 (enExample) 2017-06-20
JP6180441B2 (ja) 2017-08-16
KR20140119712A (ko) 2014-10-10
CN104136658A (zh) 2014-11-05
CA2860596C (en) 2020-08-18

Similar Documents

Publication Publication Date Title
CN104136658B (zh) 无电镀镍浴
US10377947B2 (en) Composition and process for metallizing nonconductive plastic surfaces
WO1998033959A1 (en) Method for electroplating nonconductive material
JP2015509146A5 (enExample)
EP3030688A1 (en) Electroless nickel plating solution and method
BR112019015198B1 (pt) Método para eletroliticamente passivar uma camada mais externa de cromo ou camada mais externa de liga de cromo para aumentar a resistência à corrosão da mesma
US8152914B2 (en) Process for applying a metal coating to a non-conductive substrate
JP2005336614A (ja) プラスチック表面をめっきするための方法
BR112015001113B1 (pt) método de formação de um revestimento de níquel autocatalítico preto de um substrato
JP6990240B2 (ja) 金属基板へのスズ層の被覆方法、および、ニッケル／リン合金下層と、前記方法による前記スズ層と、を備えた構造の使用
US20120160697A1 (en) Process for applying a metal coating to a non-conductive substrate
JP6150822B2 (ja) 非導電性プラスチック表面の金属化方法
TW201617478A (zh) 用於減少銅及銅合金電路之光學反射率之方法
TW201615628A (zh) 用於電沉積含金之層之組合物及方法
JP6035540B2 (ja) 導電性皮膜形成浴
JP2015537122A (ja) 非導電性プラスチック表面の金属化方法
CN108517516B (zh) 一种化学镀银液及其制备方法
CN106460180B (zh) 高磷无电镍
JP2001152353A (ja) 非導電性プラスチックへの電気めっき方法
RU2382831C1 (ru) Способ нанесения покрытия из золота и его сплавов на металлические детали и композиции ингредиентов для осуществления способа
JP2013091841A (ja) 無電解ニッケルめっき処理方法および無電解ニッケルめっき材
CA1169304A (en) Preparing substrate surface for electroless plating
WO2025098869A1 (en) An aqueous basic deposition composition for the electroless deposition of a metal on a surface of a substrate
DE102006005684A1 (de) Verbessertes Verfahren zur Direktmetallisierung von nicht-leitenden Substraten
JPS60190589A (ja) 銀めつき前処理液

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant