PT1988192E - Processo para aplicação de um revestimento metálico a um substrato não condutor - Google Patents

Processo para aplicação de um revestimento metálico a um substrato não condutor

Info

Publication number
PT1988192E
PT1988192E PT70089503T PT07008950T PT1988192E PT 1988192 E PT1988192 E PT 1988192E PT 70089503 T PT70089503 T PT 70089503T PT 07008950 T PT07008950 T PT 07008950T PT 1988192 E PT1988192 E PT 1988192E
Authority
PT
Portugal
Prior art keywords
applying
conductive substrate
metal coating
coating
metal
Prior art date
Application number
PT70089503T
Other languages
English (en)
Inventor
Sigrid Schadow
Brigitte Dyrbusch
Carl Christian Fels
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PT1988192E publication Critical patent/PT1988192E/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PT70089503T 2007-05-03 2007-05-03 Processo para aplicação de um revestimento metálico a um substrato não condutor PT1988192E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07008950A EP1988192B1 (en) 2007-05-03 2007-05-03 Process for applying a metal coating to a non-conductive substrate

Publications (1)

Publication Number Publication Date
PT1988192E true PT1988192E (pt) 2013-01-24

Family

ID=38468848

Family Applications (1)

Application Number Title Priority Date Filing Date
PT70089503T PT1988192E (pt) 2007-05-03 2007-05-03 Processo para aplicação de um revestimento metálico a um substrato não condutor

Country Status (10)

Country Link
US (1) US8152914B2 (pt)
EP (1) EP1988192B1 (pt)
JP (1) JP5279815B2 (pt)
KR (3) KR101579191B1 (pt)
CN (1) CN101675186B (pt)
BR (1) BRPI0810798B1 (pt)
ES (1) ES2395736T3 (pt)
PL (1) PL1988192T3 (pt)
PT (1) PT1988192E (pt)
WO (1) WO2008135179A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2305856A1 (en) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2581469B1 (en) * 2011-10-10 2015-04-15 Enthone, Inc. Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates
CN104136658B (zh) * 2012-02-01 2016-10-26 安美特德国有限公司 无电镀镍浴
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
CN104916820B (zh) * 2015-05-12 2017-05-10 北京理工大学 一种新型锂离子电池用导电材料掺杂硅基负极材料及制备方法
EP3296428B1 (en) * 2016-09-16 2019-05-15 ATOTECH Deutschland GmbH Method for depositing a metal or metal alloy on a surface
KR20220143007A (ko) * 2020-02-19 2022-10-24 닛산 가가쿠 가부시키가이샤 고분자 및 금속미립자를 포함하는 무전해 도금 하지제
CN111778496B (zh) * 2020-07-14 2022-04-19 赤壁市聚茂新材料科技有限公司 锡合金活化铜层镀镍的活化剂和镀镍方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
AT331943B (de) 1973-11-05 1976-08-25 Erz & Stahl Ges M B H Losungsmittel fur lacke
US5007990A (en) 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
US4810333A (en) 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
AU622650B2 (en) 1988-03-03 1992-04-16 Blasberg-Oberflachentechnik Gmbh New through-hole plated printed circuit board and process for manufacturing same
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
RU1819556C (ru) * 1990-01-15 1993-06-07 Институт физиологии и биохимии растений АН МССР Состав дл регулировани роста и развити плодовых деревьев
US5213841A (en) 1990-05-15 1993-05-25 Shipley Company Inc. Metal accelerator
DE4024552A1 (de) * 1990-08-02 1992-02-06 Henkel Kgaa Derivat der aminobernsteinsaeure als komplexierungsmittel
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
EP1054081B1 (en) * 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
DE19510855C2 (de) 1995-03-17 1998-04-30 Atotech Deutschland Gmbh Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
JPH08325742A (ja) * 1995-05-31 1996-12-10 Nitto Chem Ind Co Ltd モノアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
JPH08296049A (ja) * 1995-04-24 1996-11-12 Nitto Chem Ind Co Ltd モノアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
JP3208410B2 (ja) * 1997-04-07 2001-09-10 奥野製薬工業株式会社 非導電性プラスチック成形品への電気めっき方法
JP2000144439A (ja) * 1998-10-30 2000-05-26 Kizai Kk 不導体素材へのめっき処理方法とそのための無電解処理液組成物
DE19850359A1 (de) 1998-11-02 2000-05-04 Bayer Ag Verfahren zur Herstellung von Asparaginsäurederivaten
US6870026B1 (en) * 1999-09-17 2005-03-22 Lidochem, Inc. Chelation compositions
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ES2622411T3 (es) * 2005-06-10 2017-07-06 Enthone, Inc. Procedimiento para la metalización directa de sustratos no conductores
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung

Also Published As

Publication number Publication date
BRPI0810798B1 (pt) 2020-03-24
KR20150063593A (ko) 2015-06-09
KR20150038717A (ko) 2015-04-08
US8152914B2 (en) 2012-04-10
CN101675186B (zh) 2012-03-07
PL1988192T3 (pl) 2013-04-30
EP1988192A1 (en) 2008-11-05
BRPI0810798A2 (pt) 2014-10-29
JP2010526205A (ja) 2010-07-29
JP5279815B2 (ja) 2013-09-04
KR20100017608A (ko) 2010-02-16
EP1988192B1 (en) 2012-12-05
US20100119713A1 (en) 2010-05-13
WO2008135179A1 (en) 2008-11-13
ES2395736T3 (es) 2013-02-14
KR101579191B1 (ko) 2015-12-21
CN101675186A (zh) 2010-03-17

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