PT1988192E - Processo para aplicação de um revestimento metálico a um substrato não condutor - Google Patents
Processo para aplicação de um revestimento metálico a um substrato não condutorInfo
- Publication number
- PT1988192E PT1988192E PT70089503T PT07008950T PT1988192E PT 1988192 E PT1988192 E PT 1988192E PT 70089503 T PT70089503 T PT 70089503T PT 07008950 T PT07008950 T PT 07008950T PT 1988192 E PT1988192 E PT 1988192E
- Authority
- PT
- Portugal
- Prior art keywords
- applying
- conductive substrate
- metal coating
- coating
- metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07008950A EP1988192B1 (en) | 2007-05-03 | 2007-05-03 | Process for applying a metal coating to a non-conductive substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
PT1988192E true PT1988192E (pt) | 2013-01-24 |
Family
ID=38468848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT70089503T PT1988192E (pt) | 2007-05-03 | 2007-05-03 | Processo para aplicação de um revestimento metálico a um substrato não condutor |
Country Status (10)
Country | Link |
---|---|
US (1) | US8152914B2 (pt) |
EP (1) | EP1988192B1 (pt) |
JP (1) | JP5279815B2 (pt) |
KR (3) | KR101579191B1 (pt) |
CN (1) | CN101675186B (pt) |
BR (1) | BRPI0810798B1 (pt) |
ES (1) | ES2395736T3 (pt) |
PL (1) | PL1988192T3 (pt) |
PT (1) | PT1988192E (pt) |
WO (1) | WO2008135179A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2305856A1 (en) * | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
EP2581469B1 (en) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
CN104136658B (zh) * | 2012-02-01 | 2016-10-26 | 安美特德国有限公司 | 无电镀镍浴 |
EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
CN104916820B (zh) * | 2015-05-12 | 2017-05-10 | 北京理工大学 | 一种新型锂离子电池用导电材料掺杂硅基负极材料及制备方法 |
EP3296428B1 (en) * | 2016-09-16 | 2019-05-15 | ATOTECH Deutschland GmbH | Method for depositing a metal or metal alloy on a surface |
KR20220143007A (ko) * | 2020-02-19 | 2022-10-24 | 닛산 가가쿠 가부시키가이샤 | 고분자 및 금속미립자를 포함하는 무전해 도금 하지제 |
CN111778496B (zh) * | 2020-07-14 | 2022-04-19 | 赤壁市聚茂新材料科技有限公司 | 锡合金活化铜层镀镍的活化剂和镀镍方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3682671A (en) | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3984290A (en) | 1973-10-01 | 1976-10-05 | Georgy Avenirovich Kitaev | Method of forming intralayer junctions in a multilayer structure |
AT331943B (de) | 1973-11-05 | 1976-08-25 | Erz & Stahl Ges M B H | Losungsmittel fur lacke |
US5007990A (en) | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
US4810333A (en) | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
AU622650B2 (en) | 1988-03-03 | 1992-04-16 | Blasberg-Oberflachentechnik Gmbh | New through-hole plated printed circuit board and process for manufacturing same |
US4919768A (en) | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
RU1819556C (ru) * | 1990-01-15 | 1993-06-07 | Институт физиологии и биохимии растений АН МССР | Состав дл регулировани роста и развити плодовых деревьев |
US5213841A (en) | 1990-05-15 | 1993-05-25 | Shipley Company Inc. | Metal accelerator |
DE4024552A1 (de) * | 1990-08-02 | 1992-02-06 | Henkel Kgaa | Derivat der aminobernsteinsaeure als komplexierungsmittel |
US5376248A (en) * | 1991-10-15 | 1994-12-27 | Enthone-Omi, Inc. | Direct metallization process |
EP1054081B1 (en) * | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
DE19510855C2 (de) | 1995-03-17 | 1998-04-30 | Atotech Deutschland Gmbh | Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien |
JPH08325742A (ja) * | 1995-05-31 | 1996-12-10 | Nitto Chem Ind Co Ltd | モノアミン型生分解性キレート剤を用いた無電解Cuメッキ浴 |
JPH08296049A (ja) * | 1995-04-24 | 1996-11-12 | Nitto Chem Ind Co Ltd | モノアミン型生分解性キレート剤を用いた無電解Niメッキ浴 |
US5910340A (en) * | 1995-10-23 | 1999-06-08 | C. Uyemura & Co., Ltd. | Electroless nickel plating solution and method |
JP3208410B2 (ja) * | 1997-04-07 | 2001-09-10 | 奥野製薬工業株式会社 | 非導電性プラスチック成形品への電気めっき方法 |
JP2000144439A (ja) * | 1998-10-30 | 2000-05-26 | Kizai Kk | 不導体素材へのめっき処理方法とそのための無電解処理液組成物 |
DE19850359A1 (de) | 1998-11-02 | 2000-05-04 | Bayer Ag | Verfahren zur Herstellung von Asparaginsäurederivaten |
US6870026B1 (en) * | 1999-09-17 | 2005-03-22 | Lidochem, Inc. | Chelation compositions |
US7166688B1 (en) | 2000-07-08 | 2007-01-23 | Lidochem, Inc. | Chelation compositions |
JP4843164B2 (ja) * | 2001-08-21 | 2011-12-21 | 日本リーロナール有限会社 | 銅−樹脂複合材料の形成方法 |
EP1306465B1 (en) * | 2001-10-24 | 2011-03-16 | Rohm and Haas Electronic Materials LLC | Stabilizers for electroless plating solutions and methods of use thereof |
EP1513009A1 (de) | 2003-08-29 | 2005-03-09 | AgfaPhoto GmbH | Photochemikalien-Gebinde |
ES2622411T3 (es) * | 2005-06-10 | 2017-07-06 | Enthone, Inc. | Procedimiento para la metalización directa de sustratos no conductores |
DE102009029558A1 (de) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | Elektrolytzusammensetzung |
-
2007
- 2007-05-03 ES ES07008950T patent/ES2395736T3/es active Active
- 2007-05-03 PT PT70089503T patent/PT1988192E/pt unknown
- 2007-05-03 EP EP07008950A patent/EP1988192B1/en active Active
- 2007-05-03 PL PL07008950T patent/PL1988192T3/pl unknown
-
2008
- 2008-04-24 BR BRPI0810798-0A patent/BRPI0810798B1/pt active IP Right Grant
- 2008-04-24 KR KR1020097025285A patent/KR101579191B1/ko active IP Right Grant
- 2008-04-24 JP JP2010504553A patent/JP5279815B2/ja active Active
- 2008-04-24 KR KR1020157013086A patent/KR20150063593A/ko not_active Application Discontinuation
- 2008-04-24 US US12/451,191 patent/US8152914B2/en active Active
- 2008-04-24 CN CN2008800145982A patent/CN101675186B/zh active Active
- 2008-04-24 KR KR20157007162A patent/KR20150038717A/ko not_active Application Discontinuation
- 2008-04-24 WO PCT/EP2008/003345 patent/WO2008135179A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
BRPI0810798B1 (pt) | 2020-03-24 |
KR20150063593A (ko) | 2015-06-09 |
KR20150038717A (ko) | 2015-04-08 |
US8152914B2 (en) | 2012-04-10 |
CN101675186B (zh) | 2012-03-07 |
PL1988192T3 (pl) | 2013-04-30 |
EP1988192A1 (en) | 2008-11-05 |
BRPI0810798A2 (pt) | 2014-10-29 |
JP2010526205A (ja) | 2010-07-29 |
JP5279815B2 (ja) | 2013-09-04 |
KR20100017608A (ko) | 2010-02-16 |
EP1988192B1 (en) | 2012-12-05 |
US20100119713A1 (en) | 2010-05-13 |
WO2008135179A1 (en) | 2008-11-13 |
ES2395736T3 (es) | 2013-02-14 |
KR101579191B1 (ko) | 2015-12-21 |
CN101675186A (zh) | 2010-03-17 |
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