PL1979511T3 - Sposób powlekania powierzchni substratu - Google Patents

Sposób powlekania powierzchni substratu

Info

Publication number
PL1979511T3
PL1979511T3 PL07703047T PL07703047T PL1979511T3 PL 1979511 T3 PL1979511 T3 PL 1979511T3 PL 07703047 T PL07703047 T PL 07703047T PL 07703047 T PL07703047 T PL 07703047T PL 1979511 T3 PL1979511 T3 PL 1979511T3
Authority
PL
Poland
Prior art keywords
substrate surfaces
coating substrate
coating
substrate
Prior art date
Application number
PL07703047T
Other languages
English (en)
Inventor
Helmut Horsthemke
Franz-Josef Stark
Original Assignee
Macdermid Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Enthone Inc filed Critical Macdermid Enthone Inc
Publication of PL1979511T3 publication Critical patent/PL1979511T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
PL07703047T 2006-02-02 2007-01-26 Sposób powlekania powierzchni substratu PL1979511T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06002099A EP1816237A1 (de) 2006-02-02 2006-02-02 Verfahren und Vorrichtung zur Beschichtung von Substratoberflächen
EP07703047.6A EP1979511B1 (de) 2006-02-02 2007-01-26 Verfahren zur beschichtung von substratoberflächen
PCT/EP2007/000658 WO2007088008A2 (de) 2006-02-02 2007-01-26 Verfahren und vorrichtung zur beschichtung von substratoberflächen

Publications (1)

Publication Number Publication Date
PL1979511T3 true PL1979511T3 (pl) 2019-05-31

Family

ID=36576014

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07703047T PL1979511T3 (pl) 2006-02-02 2007-01-26 Sposób powlekania powierzchni substratu

Country Status (8)

Country Link
US (1) US20090324804A1 (pl)
EP (2) EP1816237A1 (pl)
JP (1) JP5695295B2 (pl)
KR (1) KR101466995B1 (pl)
CN (1) CN101437986B (pl)
ES (1) ES2706874T3 (pl)
PL (1) PL1979511T3 (pl)
WO (1) WO2007088008A2 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101635661B1 (ko) * 2009-07-03 2016-07-01 엔쏜 인코포레이티드 베타-아미노산 함유 전해질 및 금속 층 침착 방법
US20130087463A1 (en) * 2011-10-05 2013-04-11 Globalfoundries Inc. Method and System for Metal Deposition in Semiconductor Processing
KR101502795B1 (ko) * 2012-03-15 2015-03-13 김종호 포물선의 전체 또는 일부의 굴절경로를 갖는 진주광택 안료 입자 및 이의 제조방법
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
DE102018008312A1 (de) 2018-10-22 2020-04-23 RIAG Oberflächentechnik AG Verfahren zur Beschichtung von Substratoberflächen, Vorrichtung mit Beschichtungsbad, Dichtemesseinrichtung, Entnahmeeinrichtung, Zugabeeinrichtungen und Steuerung
CN113755937B (zh) * 2021-09-09 2022-12-09 中国航发南方工业有限公司 电镀铂槽液的维护方法
CN114351231B (zh) * 2022-01-04 2022-11-25 深圳技术大学 电解液中金属离子浓度的测量和监控的设备和方法

Family Cites Families (25)

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US3035898A (en) * 1957-12-30 1962-05-22 Int Minerals & Chem Corp Method for preparing potassium phosphates
US3243362A (en) * 1963-05-02 1966-03-29 Aluminum Co Of America Method of anodizing aluminum
US3637473A (en) * 1969-07-03 1972-01-25 Engelhard Min & Chem Method for electroplating gold
US3765436A (en) * 1970-08-22 1973-10-16 Volkswagenwerk Ag Control device for two metallic salt components in electroplating baths
CH610597A5 (en) * 1972-06-29 1979-04-30 Siemens Ag Process for electroless nickel plating of surfaces comprising metals, metal alloys, plastics and ceramics
JPS5324897B2 (pl) * 1972-09-27 1978-07-24
AT322940B (de) * 1972-10-31 1975-06-10 Siemens Ag Bäder zum stromlosen vernickeln von metall, kunststoff und keramik
US4152164A (en) * 1976-04-26 1979-05-01 Michael Gulla Electroless nickel plating
DE2744426C3 (de) * 1977-10-03 1980-07-03 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum stromlosen Vernickeln von Oberflächen aus Metallen, Kunststoff und Keramik
JPS5952700B2 (ja) * 1979-11-14 1984-12-21 上村工業株式会社 無電解めつき制御方法及びその装置
US4353933A (en) * 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
EP0100203A1 (en) * 1982-07-23 1984-02-08 Brent Chemicals International Plc Apparatus and method for electroless plating
JPS5941488A (ja) * 1982-09-01 1984-03-07 Sumitomo Metal Ind Ltd 鉄系電気メツキ浴濃度の自動制御方法
JPS60106970A (ja) * 1983-11-15 1985-06-12 C Uyemura & Co Ltd 表面処理液の自動管理方法及びそれに用いる装置
FR2657791B1 (fr) * 1990-02-02 1994-04-01 Rhone Poulenc Chimie Compose chimique contenant des alcalins ou des alcalino-terreux catalyseur en contenant et procede de solvolyse utilisant ledit catalyseur.
JPH05112897A (ja) * 1991-10-21 1993-05-07 Kansai Paint Co Ltd 電着塗料の組成分析方法及び装置並びに組成管理方法及び装置
JP3241227B2 (ja) * 1995-02-14 2001-12-25 株式会社東芝 メッキ液自動管理装置
DE19600857A1 (de) * 1996-01-12 1997-07-17 Atotech Deutschland Gmbh Verfahren zur Dosierung von Prozeßbädern
JP3627081B2 (ja) * 1996-06-07 2005-03-09 Ｊｆｅスチール株式会社 連続電気めっき設備におけるめっき液濃度推定方法
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
JP2001049448A (ja) * 1999-08-09 2001-02-20 C Uyemura & Co Ltd 無電解ニッケルめっき方法
FR2801062B1 (fr) * 1999-11-12 2001-12-28 Lorraine Laminage Installation et procede de dissolution electrolytique par oxydation d'un metal
EP1243673A1 (de) * 2001-03-24 2002-09-25 Enthone Inc. Wartung eines Elektrolyten
DE10246453A1 (de) * 2002-10-04 2004-04-15 Enthone Inc., West Haven Verfahren zur stromlosen Abscheidung von Nickel
CN1293237C (zh) * 2004-06-21 2007-01-03 乐清市帕特尼触头有限公司 电触头材料生产方法

Also Published As

Publication number Publication date
ES2706874T3 (es) 2019-04-01
US20090324804A1 (en) 2009-12-31
WO2007088008A3 (de) 2008-04-17
EP1979511A2 (de) 2008-10-15
KR20080093451A (ko) 2008-10-21
EP1979511B1 (de) 2018-10-31
JP5695295B2 (ja) 2015-04-01
EP1816237A1 (de) 2007-08-08
KR101466995B1 (ko) 2014-12-01
CN101437986B (zh) 2013-12-11
JP2009525404A (ja) 2009-07-09
CN101437986A (zh) 2009-05-20
WO2007088008A2 (de) 2007-08-09

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