JP2017505385A5 - - Google Patents

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Publication number
JP2017505385A5
JP2017505385A5 JP2016561982A JP2016561982A JP2017505385A5 JP 2017505385 A5 JP2017505385 A5 JP 2017505385A5 JP 2016561982 A JP2016561982 A JP 2016561982A JP 2016561982 A JP2016561982 A JP 2016561982A JP 2017505385 A5 JP2017505385 A5 JP 2017505385A5
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JP
Japan
Prior art keywords
surface treatment
copper foil
complexing agent
metal
ammonium compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016561982A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017505385A (ja
Filing date
Publication date
Priority claimed from KR1020130166914A external-priority patent/KR20150077943A/ko
Application filed filed Critical
Publication of JP2017505385A publication Critical patent/JP2017505385A/ja
Publication of JP2017505385A5 publication Critical patent/JP2017505385A5/ja
Pending legal-status Critical Current

Links

JP2016561982A 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池 Pending JP2017505385A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130166914A KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지
KR10-2013-0166914 2013-12-30
PCT/KR2014/012941 WO2015102322A1 (ko) 2013-12-30 2014-12-26 동박, 이를 포함하는 전기부품 및 전지

Publications (2)

Publication Number Publication Date
JP2017505385A JP2017505385A (ja) 2017-02-16
JP2017505385A5 true JP2017505385A5 (enExample) 2017-09-07

Family

ID=53493612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016561982A Pending JP2017505385A (ja) 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池

Country Status (4)

Country Link
JP (1) JP2017505385A (enExample)
KR (1) KR20150077943A (enExample)
CN (1) CN105873759A (enExample)
WO (1) WO2015102322A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002530A (zh) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 一种提高铜箔高温防氧化性能的表面处理工艺

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP4672907B2 (ja) * 2001-06-04 2011-04-20 Jx日鉱日石金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP3973197B2 (ja) * 2001-12-20 2007-09-12 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
AU2003302288A1 (en) * 2002-11-27 2004-06-18 Mitsui Mining And Smelting Co., Ltd. Negative electrode collector for nonaqueous electrolyte secondary battery and method for manufacturing same
US6852427B1 (en) * 2003-09-02 2005-02-08 Olin Corporation Chromium-free antitarnish adhesion promoting treatment composition
KR100603428B1 (ko) * 2004-04-01 2006-07-20 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
KR100604964B1 (ko) * 2004-04-02 2006-07-26 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
KR100633790B1 (ko) * 2004-06-02 2006-10-16 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법과 그 동박및 이를 사용하여 제조된 복합재료
JP4994634B2 (ja) * 2004-11-11 2012-08-08 パナソニック株式会社 リチウムイオン二次電池用負極、その製造方法、およびそれを用いたリチウムイオン二次電池
JP2009117706A (ja) * 2007-11-08 2009-05-28 Hitachi Cable Ltd フレキシブルプリント配線板用銅箔及びその製造方法、並びにフレキシブルプリント配線板
EP2290132A1 (en) * 2008-06-17 2011-03-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit board and copper clad laminate plate for printed circuit board
KR101168613B1 (ko) * 2009-12-21 2012-07-30 엘에스엠트론 주식회사 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
KR20160138321A (ko) * 2011-06-30 2016-12-02 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지

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