CN105873759A - 铜箔、包含该铜箔的电气部件以及电池 - Google Patents

铜箔、包含该铜箔的电气部件以及电池 Download PDF

Info

Publication number
CN105873759A
CN105873759A CN201480071796.8A CN201480071796A CN105873759A CN 105873759 A CN105873759 A CN 105873759A CN 201480071796 A CN201480071796 A CN 201480071796A CN 105873759 A CN105873759 A CN 105873759A
Authority
CN
China
Prior art keywords
copper foil
copper
surface treatment
layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480071796.8A
Other languages
English (en)
Chinese (zh)
Inventor
范元辰
崔恩实
宋基德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Materials Co Ltd
Original Assignee
Iljin Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Materials Co Ltd filed Critical Iljin Materials Co Ltd
Publication of CN105873759A publication Critical patent/CN105873759A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201480071796.8A 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池 Pending CN105873759A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130166914A KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지
KR10-2013-0166914 2013-12-30
PCT/KR2014/012941 WO2015102322A1 (ko) 2013-12-30 2014-12-26 동박, 이를 포함하는 전기부품 및 전지

Publications (1)

Publication Number Publication Date
CN105873759A true CN105873759A (zh) 2016-08-17

Family

ID=53493612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480071796.8A Pending CN105873759A (zh) 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池

Country Status (4)

Country Link
JP (1) JP2017505385A (enExample)
KR (1) KR20150077943A (enExample)
CN (1) CN105873759A (enExample)
WO (1) WO2015102322A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002530A (zh) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 一种提高铜箔高温防氧化性能的表面处理工艺

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
CN1466517A (zh) * 2000-09-22 2004-01-07 �źӵ�·ͭ����ʽ���� 高密度超微细电路板用铜箔
CN1496304A (zh) * 2001-12-20 2004-05-12 三井金属k业株式会社 带承载箔的电解铜箔及其制造方法和使用该电解铜箔的包铜层压板
JP2005290541A (ja) * 2004-04-01 2005-10-20 Iljin Copper Foil Co Ltd 電磁波遮蔽用黒化表面処理銅箔の製造方法
CN1761086A (zh) * 2004-11-11 2006-04-19 松下电器产业株式会社 用于锂离子二次电池的负极、其制造方法以及包含所述负极的锂离子二次电池
CN1953868A (zh) * 2003-09-02 2007-04-25 奥林公司 无铬的防晦暗粘合促进处理组合物
CN101981230A (zh) * 2008-06-17 2011-02-23 Jx日矿日石金属株式会社 印刷电路板用铜箔及印刷电路板用包铜层压板
KR20110071434A (ko) * 2009-12-21 2011-06-29 엘에스엠트론 주식회사 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672907B2 (ja) * 2001-06-04 2011-04-20 Ｊｘ日鉱日石金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
AU2003302288A1 (en) * 2002-11-27 2004-06-18 Mitsui Mining And Smelting Co., Ltd. Negative electrode collector for nonaqueous electrolyte secondary battery and method for manufacturing same
KR100604964B1 (ko) * 2004-04-02 2006-07-26 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
KR100633790B1 (ko) * 2004-06-02 2006-10-16 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법과 그 동박및 이를 사용하여 제조된 복합재료
JP2009117706A (ja) * 2007-11-08 2009-05-28 Hitachi Cable Ltd フレキシブルプリント配線板用銅箔及びその製造方法、並びにフレキシブルプリント配線板
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
KR20160138321A (ko) * 2011-06-30 2016-12-02 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
CN1466517A (zh) * 2000-09-22 2004-01-07 �źӵ�·ͭ����ʽ���� 高密度超微细电路板用铜箔
CN1496304A (zh) * 2001-12-20 2004-05-12 三井金属k业株式会社 带承载箔的电解铜箔及其制造方法和使用该电解铜箔的包铜层压板
CN1953868A (zh) * 2003-09-02 2007-04-25 奥林公司 无铬的防晦暗粘合促进处理组合物
JP2005290541A (ja) * 2004-04-01 2005-10-20 Iljin Copper Foil Co Ltd 電磁波遮蔽用黒化表面処理銅箔の製造方法
CN1761086A (zh) * 2004-11-11 2006-04-19 松下电器产业株式会社 用于锂离子二次电池的负极、其制造方法以及包含所述负极的锂离子二次电池
CN101981230A (zh) * 2008-06-17 2011-02-23 Jx日矿日石金属株式会社 印刷电路板用铜箔及印刷电路板用包铜层压板
KR20110071434A (ko) * 2009-12-21 2011-06-29 엘에스엠트론 주식회사 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판

Also Published As

Publication number Publication date
JP2017505385A (ja) 2017-02-16
WO2015102322A1 (ko) 2015-07-09
KR20150077943A (ko) 2015-07-08

Similar Documents

Publication Publication Date Title
JP7546482B2 (ja) 表面処理銅箔、銅張積層板及びプリント配線板
JP5634103B2 (ja) 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
CN112969824B (zh) 表面处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
JP5885054B2 (ja) 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
CN115413301B (zh) 粗糙化处理铜箔、覆铜层叠板及印刷电路板
CN100376125C (zh) 经表面处理的铜箔及其制备方法
US20100282500A1 (en) Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
US20140057123A1 (en) Copper foil for printed circuit
US20080261020A1 (en) Adhesive layer for resin and a method of producing a laminate including the adhesive layer
KR20100035646A (ko) 금속 표면 조화층을 갖는 금속층 적층체 및 그 제조 방법
CN106103082A (zh) 带有载体箔的铜箔、覆铜层压板及印刷线路板
KR101695236B1 (ko) 동박, 이를 포함하는 전기부품 및 전지
JP5406905B2 (ja) 高剥離強度と環境にやさしい微細な粒状表面からなるプリント回路基板用銅箔の製造方法。
US20130189538A1 (en) Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board
KR100654737B1 (ko) 미세회로기판용 표면처리동박의 제조방법 및 그 동박
CN102711393A (zh) 一种印刷电路基板用表面细晶粒铜箔的制造方法
TW201942422A (zh) 表面處理銅箔、覆銅層積板、及印刷配線板的製造方法
EP2590487A1 (en) Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
JP2717910B2 (ja) 印刷回路用銅箔及びその製造方法
JP6090693B2 (ja) 表面処理銅箔及び当該表面処理銅箔を用いたプリント配線板
CN105873759A (zh) 铜箔、包含该铜箔的电气部件以及电池
US9115441B2 (en) Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
TWI805902B (zh) 表面處理銅箔、覆銅積層板及印刷線路板
TWI415742B (zh) A method for manufacturing fine grain copper foil with high peel strength and environmental protection for printed circuit board tool
CN111757607B (zh) 表面处理铜箔、覆铜层叠板及印制布线板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160817