JP2007525836A5 - - Google Patents
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- JP2007525836A5 JP2007525836A5 JP2006552706A JP2006552706A JP2007525836A5 JP 2007525836 A5 JP2007525836 A5 JP 2007525836A5 JP 2006552706 A JP2006552706 A JP 2006552706A JP 2006552706 A JP2006552706 A JP 2006552706A JP 2007525836 A5 JP2007525836 A5 JP 2007525836A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- inhibiting compound
- corrosion inhibiting
- cleaning
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000203 mixture Substances 0.000 claims 23
- 150000001875 compounds Chemical class 0.000 claims 14
- 238000005260 corrosion Methods 0.000 claims 14
- 230000007797 corrosion Effects 0.000 claims 14
- 230000002401 inhibitory effect Effects 0.000 claims 14
- 238000000034 method Methods 0.000 claims 12
- 238000004140 cleaning Methods 0.000 claims 8
- 239000004094 surface-active agent Substances 0.000 claims 8
- 239000002738 chelating agent Substances 0.000 claims 7
- 239000012459 cleaning agent Substances 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 claims 5
- 235000012141 vanillin Nutrition 0.000 claims 5
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 claims 5
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 claims 5
- 239000002280 amphoteric surfactant Substances 0.000 claims 4
- 125000000129 anionic group Chemical group 0.000 claims 4
- 239000003945 anionic surfactant Substances 0.000 claims 4
- 125000002091 cationic group Chemical group 0.000 claims 4
- 239000003093 cationic surfactant Substances 0.000 claims 4
- 239000003085 diluting agent Substances 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000002736 nonionic surfactant Substances 0.000 claims 4
- 239000002888 zwitterionic surfactant Substances 0.000 claims 4
- ADVGKWPZRIDURE-UHFFFAOYSA-N 2'-Hydroxyacetanilide Chemical compound CC(=O)NC1=CC=CC=C1O ADVGKWPZRIDURE-UHFFFAOYSA-N 0.000 claims 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 claims 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims 2
- 229940102253 isopropanolamine Drugs 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- QAIPRVGONGVQAS-DUXPYHPUSA-N trans-caffeic acid Chemical compound OC(=O)\C=C\C1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-DUXPYHPUSA-N 0.000 claims 2
- ACEAELOMUCBPJP-UHFFFAOYSA-N (E)-3,4,5-trihydroxycinnamic acid Natural products OC(=O)C=CC1=CC(O)=C(O)C(O)=C1 ACEAELOMUCBPJP-UHFFFAOYSA-N 0.000 claims 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims 1
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 claims 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims 1
- FQXRXTUXSODUFZ-UHFFFAOYSA-N 1h-imidazol-2-ylmethanethiol Chemical compound SCC1=NC=CN1 FQXRXTUXSODUFZ-UHFFFAOYSA-N 0.000 claims 1
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 claims 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims 1
- 239000001263 FEMA 3042 Substances 0.000 claims 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 claims 1
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- OUCXYSRPMBQONT-UHFFFAOYSA-N acetamide;phenol Chemical compound CC(N)=O.OC1=CC=CC=C1 OUCXYSRPMBQONT-UHFFFAOYSA-N 0.000 claims 1
- 239000000908 ammonium hydroxide Substances 0.000 claims 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims 1
- 235000004883 caffeic acid Nutrition 0.000 claims 1
- 229940074360 caffeic acid Drugs 0.000 claims 1
- 235000013985 cinnamic acid Nutrition 0.000 claims 1
- 229930016911 cinnamic acid Natural products 0.000 claims 1
- QAIPRVGONGVQAS-UHFFFAOYSA-N cis-caffeic acid Natural products OC(=O)C=CC1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 claims 1
- 235000018417 cysteine Nutrition 0.000 claims 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 claims 1
- 239000000174 gluconic acid Substances 0.000 claims 1
- 235000012208 gluconic acid Nutrition 0.000 claims 1
- 239000008103 glucose Substances 0.000 claims 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 claims 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 claims 1
- YQUVCSBJEUQKSH-UHFFFAOYSA-N protochatechuic acid Natural products OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 235000015523 tannic acid Nutrition 0.000 claims 1
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 claims 1
- 229940033123 tannic acid Drugs 0.000 claims 1
- 229920002258 tannic acid Polymers 0.000 claims 1
- 229940035024 thioglycerol Drugs 0.000 claims 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 claims 1
- 229940103494 thiosalicylic acid Drugs 0.000 claims 1
- 150000003852 triazoles Chemical class 0.000 claims 1
- WKOLLVMJNQIZCI-UHFFFAOYSA-N vanillic acid Chemical compound COC1=CC(C(O)=O)=CC=C1O WKOLLVMJNQIZCI-UHFFFAOYSA-N 0.000 claims 1
- TUUBOHWZSQXCSW-UHFFFAOYSA-N vanillic acid Natural products COC1=CC(O)=CC(C(O)=O)=C1 TUUBOHWZSQXCSW-UHFFFAOYSA-N 0.000 claims 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54427204P | 2004-02-12 | 2004-02-12 | |
| US10/956,273 US7435712B2 (en) | 2004-02-12 | 2004-10-01 | Alkaline chemistry for post-CMP cleaning |
| PCT/IB2005/000081 WO2005085408A1 (en) | 2004-02-12 | 2005-01-12 | Improved alkaline chemistry for post-cmp cleaning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007525836A JP2007525836A (ja) | 2007-09-06 |
| JP2007525836A5 true JP2007525836A5 (enExample) | 2008-02-28 |
| JP4550838B2 JP4550838B2 (ja) | 2010-09-22 |
Family
ID=34841165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006552706A Expired - Fee Related JP4550838B2 (ja) | 2004-02-12 | 2005-01-12 | 化学機械平坦化の後洗浄用の改良されたアルカリ化学製品 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7435712B2 (enExample) |
| EP (1) | EP1720965B1 (enExample) |
| JP (1) | JP4550838B2 (enExample) |
| KR (1) | KR101087916B1 (enExample) |
| CN (1) | CN1906287A (enExample) |
| AT (1) | ATE432974T1 (enExample) |
| DE (1) | DE602005014746D1 (enExample) |
| WO (1) | WO2005085408A1 (enExample) |
Families Citing this family (57)
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|---|---|---|---|---|
| US7435712B2 (en) | 2004-02-12 | 2008-10-14 | Air Liquide America, L.P. | Alkaline chemistry for post-CMP cleaning |
| US7498295B2 (en) * | 2004-02-12 | 2009-03-03 | Air Liquide Electronics U.S. Lp | Alkaline chemistry for post-CMP cleaning comprising tetra alkyl ammonium hydroxide |
| US7087564B2 (en) * | 2004-03-05 | 2006-08-08 | Air Liquide America, L.P. | Acidic chemistry for post-CMP cleaning |
| CA2575885A1 (en) * | 2004-08-03 | 2006-02-16 | Chemetall Gmbh | Method for protecting a metal surface by means of a corrosion-inhibiting coating |
| US20060116313A1 (en) * | 2004-11-30 | 2006-06-01 | Denise Geitz | Compositions comprising tannic acid as corrosion inhibitor |
| US7923423B2 (en) * | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
| TWI393178B (zh) * | 2005-01-27 | 2013-04-11 | Advanced Tech Materials | 半導體基板處理用之組成物 |
| US20090288688A1 (en) * | 2005-03-11 | 2009-11-26 | Ron Rulkens | Non-corrosive chemical rinse system |
| US7879782B2 (en) | 2005-10-13 | 2011-02-01 | Air Products And Chemicals, Inc. | Aqueous cleaning composition and method for using same |
| US7534753B2 (en) * | 2006-01-12 | 2009-05-19 | Air Products And Chemicals, Inc. | pH buffered aqueous cleaning composition and method for removing photoresist residue |
| US20070225186A1 (en) * | 2006-03-27 | 2007-09-27 | Matthew Fisher | Alkaline solutions for post CMP cleaning processes |
| US20070232511A1 (en) * | 2006-03-28 | 2007-10-04 | Matthew Fisher | Cleaning solutions including preservative compounds for post CMP cleaning processes |
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| KR101132303B1 (ko) * | 2009-02-16 | 2012-04-05 | 주식회사 하이닉스반도체 | 반도체 소자의 구리배선 형성방법 |
| WO2011000758A1 (en) | 2009-06-30 | 2011-01-06 | Basf Se | Aqueous alkaline cleaning compositions and methods of their use |
| JP5646882B2 (ja) | 2009-09-30 | 2014-12-24 | 富士フイルム株式会社 | 洗浄組成物、洗浄方法、及び半導体装置の製造方法 |
| CN103003405B (zh) | 2010-07-19 | 2016-04-13 | 巴斯夫欧洲公司 | 含水碱性清洁组合物及其应用方法 |
| CN101908503A (zh) * | 2010-07-21 | 2010-12-08 | 河北工业大学 | 超大规模集成电路多层铜布线化学机械抛光后的洁净方法 |
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| US20160060584A1 (en) | 2013-04-10 | 2016-03-03 | Wako Pure Chemical Industries, Ltd. | Cleaning agent for metal wiring substrate, and method for cleaning semiconductor substrate |
| JP6203525B2 (ja) * | 2013-04-19 | 2017-09-27 | 関東化學株式会社 | 洗浄液組成物 |
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| TWI636131B (zh) | 2014-05-20 | 2018-09-21 | 日商Ｊｓｒ股份有限公司 | 清洗用組成物及清洗方法 |
| KR102326028B1 (ko) | 2015-01-26 | 2021-11-16 | 삼성디스플레이 주식회사 | 반도체 및 디스플레이 제조공정용 세정제 조성물 |
| US10319605B2 (en) | 2016-05-10 | 2019-06-11 | Jsr Corporation | Semiconductor treatment composition and treatment method |
| CN106854461A (zh) * | 2016-12-11 | 2017-06-16 | 周益铭 | 一种高渗透快速注水井除垢剂的制备方法 |
| CN108998267A (zh) * | 2018-08-29 | 2018-12-14 | 李少伟 | 一种半导体器件防蚀剂清洗剂及制备方法 |
| US20220041931A1 (en) * | 2018-12-18 | 2022-02-10 | Tokuyama Corporation | Silicon Etching Liquid |
| CN109988676A (zh) * | 2019-04-24 | 2019-07-09 | 上海新阳半导体材料股份有限公司 | 一种清洗液、其制备方法和应用 |
| CN109988675A (zh) * | 2019-04-24 | 2019-07-09 | 上海新阳半导体材料股份有限公司 | 长效型化学机械抛光后清洗液、其制备方法和应用 |
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| JP7365427B2 (ja) | 2019-11-22 | 2023-10-19 | 富士フイルム株式会社 | 洗浄液、洗浄方法 |
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| CN117946812A (zh) * | 2022-10-18 | 2024-04-30 | 安集微电子科技（上海）股份有限公司 | 一种清洗组合物 |
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-
2004
- 2004-10-01 US US10/956,273 patent/US7435712B2/en not_active Expired - Lifetime
-
2005
- 2005-01-12 WO PCT/IB2005/000081 patent/WO2005085408A1/en not_active Ceased
- 2005-01-12 JP JP2006552706A patent/JP4550838B2/ja not_active Expired - Fee Related
- 2005-01-12 CN CNA2005800019365A patent/CN1906287A/zh active Pending
- 2005-01-12 DE DE602005014746T patent/DE602005014746D1/de not_active Expired - Lifetime
- 2005-01-12 AT AT05702248T patent/ATE432974T1/de not_active IP Right Cessation
- 2005-01-12 KR KR1020067013345A patent/KR101087916B1/ko not_active Expired - Fee Related
- 2005-01-12 EP EP05702248A patent/EP1720965B1/en not_active Expired - Lifetime
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