JP2006523964A5 - - Google Patents

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Publication number
JP2006523964A5
JP2006523964A5 JP2006513085A JP2006513085A JP2006523964A5 JP 2006523964 A5 JP2006523964 A5 JP 2006523964A5 JP 2006513085 A JP2006513085 A JP 2006513085A JP 2006513085 A JP2006513085 A JP 2006513085A JP 2006523964 A5 JP2006523964 A5 JP 2006523964A5
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Japan
Prior art keywords
conductive layer
conductive
thinned
active surface
opposite
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JP2006513085A
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Japanese (ja)
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JP5042623B2 (ja
JP2006523964A (ja
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Priority claimed from US10/418,790 external-priority patent/US6921975B2/en
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Publication of JP5042623B2 publication Critical patent/JP5042623B2/ja
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JP2006513085A 2003-04-18 2004-04-06 半導体デバイス Expired - Lifetime JP5042623B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/418,790 US6921975B2 (en) 2003-04-18 2003-04-18 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
US10/418,790 2003-04-18
PCT/US2004/011871 WO2004095514A2 (en) 2003-04-18 2004-04-06 Circuit device with at least partial packaging and method for forming

Publications (3)

Publication Number Publication Date
JP2006523964A JP2006523964A (ja) 2006-10-19
JP2006523964A5 true JP2006523964A5 (enExample) 2010-10-21
JP5042623B2 JP5042623B2 (ja) 2012-10-03

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JP2006513085A Expired - Lifetime JP5042623B2 (ja) 2003-04-18 2004-04-06 半導体デバイス

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US (3) US6921975B2 (enExample)
EP (1) EP1618606A4 (enExample)
JP (1) JP5042623B2 (enExample)
KR (3) KR101215283B1 (enExample)
CN (1) CN100413065C (enExample)
WO (1) WO2004095514A2 (enExample)

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