JP2011054797A5 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2011054797A5
JP2011054797A5 JP2009202987A JP2009202987A JP2011054797A5 JP 2011054797 A5 JP2011054797 A5 JP 2011054797A5 JP 2009202987 A JP2009202987 A JP 2009202987A JP 2009202987 A JP2009202987 A JP 2009202987A JP 2011054797 A5 JP2011054797 A5 JP 2011054797A5
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JP
Japan
Prior art keywords
leads
thickness
base film
semiconductor device
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009202987A
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English (en)
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JP2011054797A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009202987A priority Critical patent/JP2011054797A/ja
Priority claimed from JP2009202987A external-priority patent/JP2011054797A/ja
Priority to US12/873,854 priority patent/US20110049514A1/en
Priority to CN2010102732472A priority patent/CN102005429A/zh
Publication of JP2011054797A publication Critical patent/JP2011054797A/ja
Publication of JP2011054797A5 publication Critical patent/JP2011054797A5/ja
Pending legal-status Critical Current

Links

Claims (1)

  1. ベースフィルムと、
    前記ベースフィルム上に搭載された半導体チップと、
    前記ベースフィルム上に形成され、前記半導体チップと電気的に接続された複数のリードと
    を備え、
    前記複数のリードの各々は、外部に露出した外部端子部を有し、
    前記各リードの前記外部端子部は、
    厚さが第１厚さである第１部分と、
    厚さが前記第１厚さよりも小さい第２厚さである第２部分と
    を含み、
    前記複数のリードのうち隣り合うリード間で、前記第１部分と前記第２部分とは互いに対向するように位置している
    半導体装置。
JP2009202987A 2009-09-02 2009-09-02 Ｔｃｐ型半導体装置 Pending JP2011054797A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009202987A JP2011054797A (ja) 2009-09-02 2009-09-02 Ｔｃｐ型半導体装置
US12/873,854 US20110049514A1 (en) 2009-09-02 2010-09-01 Tcp type semiconductor device
CN2010102732472A CN102005429A (zh) 2009-09-02 2010-09-02 Tcp型半导体器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009202987A JP2011054797A (ja) 2009-09-02 2009-09-02 Ｔｃｐ型半導体装置

Publications (2)

Publication Number Publication Date
JP2011054797A JP2011054797A (ja) 2011-03-17
JP2011054797A5 true JP2011054797A5 (ja) 2012-04-05

Family

ID=43623499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009202987A Pending JP2011054797A (ja) 2009-09-02 2009-09-02 Ｔｃｐ型半導体装置

Country Status (3)

Country Link
US (1) US20110049514A1 (ja)
JP (1) JP2011054797A (ja)
CN (1) CN102005429A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120009702A (ko) * 2010-07-20 2012-02-02 삼성전자주식회사 필름 회로 기판의 제조 방법 및 칩 패키지의 제조 방법
KR102051122B1 (ko) 2013-06-18 2019-12-02 삼성전자주식회사 표시 장치
CN111584456A (zh) * 2020-05-08 2020-08-25 武汉华星光电半导体显示技术有限公司 覆晶薄膜
KR20210152628A (ko) * 2020-06-08 2021-12-16 삼성디스플레이 주식회사 칩 온 필름, 표시 장치, 칩 온 필름의 제조 방법, 및 칩 온 필름의 제조 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750381A (ja) * 1993-08-09 1995-02-21 Hitachi Ltd 半導体装置およびその実装構造
JPH0894668A (ja) * 1994-09-28 1996-04-12 Nitto Denko Corp プローブ
JP3492919B2 (ja) * 1998-07-31 2004-02-03 京セラ株式会社 半導体素子の実装構造体
JP2003332380A (ja) * 2002-03-06 2003-11-21 Seiko Epson Corp 電子デバイス及びその製造方法並びに電子機器
JP2006214737A (ja) * 2005-02-01 2006-08-17 Sanyo Epson Imaging Devices Corp プローブ、検査装置および電気光学装置の製造方法
JP2006228761A (ja) * 2005-02-15 2006-08-31 Matsushita Electric Ind Co Ltd Ｔａｂテープおよびｔａｂテープの製造方法
JP2006269605A (ja) * 2005-03-23 2006-10-05 Shinko Electric Ind Co Ltd フレキシブル回路基板及びその製造方法
JP2010123910A (ja) * 2008-10-21 2010-06-03 Renesas Electronics Corp Ｔｃｐ型半導体装置及びそのテスト方法

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