JP2010530630A5 - - Google Patents

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Publication number
JP2010530630A5
JP2010530630A5 JP2010512741A JP2010512741A JP2010530630A5 JP 2010530630 A5 JP2010530630 A5 JP 2010530630A5 JP 2010512741 A JP2010512741 A JP 2010512741A JP 2010512741 A JP2010512741 A JP 2010512741A JP 2010530630 A5 JP2010530630 A5 JP 2010530630A5
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JP
Japan
Prior art keywords
substrate
chips
chip
groove
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010512741A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010530630A (ja
JP5405457B2 (ja
Filing date
Publication date
Priority claimed from FR0704445A external-priority patent/FR2917895B1/fr
Application filed filed Critical
Publication of JP2010530630A publication Critical patent/JP2010530630A/ja
Publication of JP2010530630A5 publication Critical patent/JP2010530630A5/ja
Application granted granted Critical
Publication of JP5405457B2 publication Critical patent/JP5405457B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010512741A 2007-06-21 2008-06-20 フレキシブルな接続によって機械的に相互接続された複数のチップからなるセットを生成する方法 Expired - Fee Related JP5405457B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0704445A FR2917895B1 (fr) 2007-06-21 2007-06-21 Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
FR0704445 2007-06-21
PCT/FR2008/000867 WO2009013409A2 (fr) 2007-06-21 2008-06-20 Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple

Publications (3)

Publication Number Publication Date
JP2010530630A JP2010530630A (ja) 2010-09-09
JP2010530630A5 true JP2010530630A5 (enExample) 2011-07-28
JP5405457B2 JP5405457B2 (ja) 2014-02-05

Family

ID=38663147

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010512746A Active JP5385900B2 (ja) 2007-06-21 2008-06-18 無線周波数チップの組立
JP2010512741A Expired - Fee Related JP5405457B2 (ja) 2007-06-21 2008-06-20 フレキシブルな接続によって機械的に相互接続された複数のチップからなるセットを生成する方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2010512746A Active JP5385900B2 (ja) 2007-06-21 2008-06-18 無線周波数チップの組立

Country Status (9)

Country Link
US (2) US8471773B2 (enExample)
EP (2) EP2158604B1 (enExample)
JP (2) JP5385900B2 (enExample)
CN (2) CN101711430B (enExample)
AT (1) ATE486367T1 (enExample)
DE (1) DE602008003224D1 (enExample)
ES (1) ES2355180T3 (enExample)
FR (1) FR2917895B1 (enExample)
WO (2) WO2009004243A2 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937464B1 (fr) * 2008-10-21 2011-02-25 Commissariat Energie Atomique Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
FR2945151B1 (fr) 2009-04-30 2011-04-29 Commissariat Energie Atomique Procede de fixation d'un composant electronique sur un produit
JP5281965B2 (ja) * 2009-06-23 2013-09-04 日立Ｇｅニュークリア・エナジー株式会社 Ｉｃタグケーブル用芯線、ｉｃタグケーブル、ｉｃタグケーブルの位置検出システム及び検出方法
WO2011143300A1 (en) * 2010-05-12 2011-11-17 Monolithe Semiconductor Inc. Extendable network structure
FR2961947B1 (fr) 2010-06-24 2013-03-15 Commissariat Energie Atomique Incorporation d'elements a puce dans un fil guipe
FR2961949B1 (fr) * 2010-06-24 2012-08-03 Commissariat Energie Atomique Elements a puce assembles sur des fils presentant une amorce de rupture
WO2012071003A1 (en) * 2010-11-22 2012-05-31 Senseair Ab Method for the wafer-level integration of shape memory alloy wires
JP5820696B2 (ja) * 2011-11-07 2015-11-24 新電元工業株式会社 半導体装置の製造方法及び半導体装置の製造用治具
DE102011120250B4 (de) 2011-12-05 2023-05-04 Volkswagen Aktiengesellschaft Telefonantennenkoppelplatte für ein Fahrzeug
FR2986372B1 (fr) 2012-01-31 2014-02-28 Commissariat Energie Atomique Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage
US8927338B1 (en) 2013-06-13 2015-01-06 International Business Machines Corporation Flexible, stretchable electronic devices
US9231327B1 (en) 2013-08-27 2016-01-05 Flextronics Ap, Llc Electronic circuit slidable interconnect
US9674949B1 (en) 2013-08-27 2017-06-06 Flextronics Ap, Llc Method of making stretchable interconnect using magnet wires
US9801277B1 (en) 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US10015880B1 (en) 2013-12-09 2018-07-03 Multek Technologies Ltd. Rip stop on flex and rigid flex circuits
DE102015219190A1 (de) 2015-10-05 2017-04-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines elektronischen Bauelements und elektronisches Bauelement
FR3042203B1 (fr) 2015-10-12 2018-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Incorporation d'elements a puce dans un fil guipe.
EP3440246B1 (en) 2016-04-07 2024-11-27 Adetexs Ltd Improvements relating to textiles incorporating electronic devices
FR3058579B1 (fr) * 2016-11-07 2018-11-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif d'emission reception radiofrequence
FR3062515B1 (fr) 2017-01-30 2019-11-01 Primo1D Procede d'insertion d'un fil dans une rainure d'une puce de semi-conducteur, et equipement pour la mise en œuvre d’un tel procede.
FR3065579B1 (fr) 2017-04-19 2019-05-03 Primo1D Dispositif d'emission reception radiofrequence
FR3065578B1 (fr) 2017-04-19 2019-05-03 Primo1D Procede d'assemblage d'une puce microelectronique sur un element filaire
RO133013B1 (ro) * 2017-06-16 2020-09-30 Promar Textil Industries S.R.L. Etichetă rfid pentru medii agresive cu cuplaj inductiv în buclă dublă
FR3069962B1 (fr) 2017-08-01 2020-09-25 Primo1D Antenne a plaque pour coupler un terminal d’emission-reception a un dispositif rfid
FR3078980B1 (fr) 2018-03-14 2021-06-11 Primo1D Fil guipe compose d’une ame principale et d’au moins un fils de couverture et comprenant au moins un element filaire conducteur relie electriquement a au moins une puce electronique
EP3797407A1 (en) 2018-05-22 2021-03-31 Sensormatic Electronics, LLC Elongate flexible tag
US10438895B1 (en) 2018-06-08 2019-10-08 American Semiconductor, Inc. Flexible micro-module
US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
FR3103630B1 (fr) 2019-11-22 2022-06-03 Primo1D Puce fonctionnelle adaptee pour etre assemblee a des elements filaires, et procede de fabrication d’une telle puce
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11694057B2 (en) * 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
CN111394854B (zh) * 2020-02-26 2022-07-12 东华大学 一种法向模螺旋偶极子电子标签纱的制作方法
EP3923195B1 (fr) * 2020-06-11 2023-08-23 Primo1D Etiquette électronique présentant un caractère souple et déformable
FR3119944B1 (fr) 2021-02-15 2023-02-10 Primo1D Dispositif d'émission-réception radiofréquence utilisant une antenne composée d’un fil textile et d’un ruban conducteur et étiquette électronique associée
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
FR3131253B1 (fr) 2021-12-23 2024-01-05 Primo1D Pneumatique équipée d’un dispositif d'émission-réception radiofréquence
CN118501673A (zh) * 2024-07-18 2024-08-16 宁波吉品科技有限公司 一种基于压电陶瓷的芯片集成测试板

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461247A (ja) * 1990-06-28 1992-02-27 Narumi China Corp クワッド・フラット・パッケージ
DE19908172A1 (de) * 1999-02-25 2000-08-31 Joergen Brosow Aufklebeplombe
NO311317B1 (no) * 1999-04-30 2001-11-12 Thin Film Electronics Asa Apparat omfattende elektroniske og/eller optoelektroniske kretser samt fremgangsmåte til å realisere og/eller integrerekretser av denne art i apparatet
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
JP4433629B2 (ja) * 2001-03-13 2010-03-17 株式会社日立製作所 半導体装置及びその製造方法
GB0108950D0 (en) * 2001-04-10 2001-05-30 Leonard Philip N Personal computer systems
DE10122324A1 (de) * 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
WO2003021679A2 (en) * 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
WO2003060986A2 (en) * 2002-01-11 2003-07-24 The Pennsylvania State University Method of forming a removable support with a sacrificial layers and of transferring devices
US20070069341A1 (en) * 2003-05-28 2007-03-29 Mitsuo Usami Radio recognition semiconductor device and its manufacturing method
JP2005051144A (ja) * 2003-07-31 2005-02-24 Shinko Electric Ind Co Ltd 半導体装置の製造方法
EP1659629B1 (en) * 2003-08-28 2011-05-04 Hitachi, Ltd. Semiconductor device and its manufacturing method
CN1263131C (zh) * 2003-10-08 2006-07-05 复旦大学 射频标签芯片与片外天线阻抗匹配片内自动调节的电路
US7338836B2 (en) * 2003-11-05 2008-03-04 California Institute Of Technology Method for integrating pre-fabricated chip structures into functional electronic systems
JP4291209B2 (ja) * 2004-05-20 2009-07-08 エルピーダメモリ株式会社 半導体装置の製造方法
KR101197046B1 (ko) * 2005-01-26 2012-11-06 삼성디스플레이 주식회사 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치
KR101029215B1 (ko) * 2005-02-16 2011-04-12 가부시키가이샤 히타치세이사쿠쇼 전자 태그용 반도체 장치 및 ｒｆｉｄ 태크
BRPI0607472A2 (pt) * 2005-02-23 2009-09-08 Textilma Ag fio de transponder bem como seu emprego
US20060285480A1 (en) * 2005-06-21 2006-12-21 Janofsky Eric B Wireless local area network communications module and integrated chip package
JP5044984B2 (ja) * 2005-06-29 2012-10-10 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、およびｉｃタグの製造装置、並びに、インターポーザ、インターポーザの製造方法、およびインターポーザの製造装置
US7621043B2 (en) * 2005-11-02 2009-11-24 Checkpoint Systems, Inc. Device for making an in-mold circuit
US20090283891A1 (en) * 2006-04-07 2009-11-19 Koninklijke Philips Electronics N.V. Elastically deformable integrated-circuit device
US8017441B2 (en) * 2006-06-02 2011-09-13 Hiachi, Ltd. Method for manufacturing IC tag inlet
US8237622B2 (en) * 2006-12-28 2012-08-07 Philtech Inc. Base sheet
US8154456B2 (en) * 2008-05-22 2012-04-10 Philtech Inc. RF powder-containing base

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