JP5385900B2 - 無線周波数チップの組立 - Google Patents
無線周波数チップの組立 Download PDFInfo
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- JP5385900B2 JP5385900B2 JP2010512746A JP2010512746A JP5385900B2 JP 5385900 B2 JP5385900 B2 JP 5385900B2 JP 2010512746 A JP2010512746 A JP 2010512746A JP 2010512746 A JP2010512746 A JP 2010512746A JP 5385900 B2 JP5385900 B2 JP 5385900B2
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- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 18
- 238000004377 microelectronic Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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Description
アンテナを備えない無線周波数トランシーバチップを作製し、
送信/受信周波数に応じて選択される2つの隣り合うチップ間の長さを夫々有する少なくとも2本の導電性ケーブル要素によって、前記チップを直列に接続し、
前記チップの直列接続では、各導電性ケーブル要素が、前記チップの少なくとも1つの端子に電気的に接続し、一続きの前記チップを機械的に少なくとも一時的に維持し、
前記無線周波数トランシーバ装置のアンテナである2本の撚線をチップ毎に形成するために、直列接続された一続きの前記チップを一定間隔で切断することを特徴とする方法を提供する。
無線周波数トランシーバ回路を集積するマイクロ電子チップと、
少なくとも2本のアンテナの撚線とを備えることを特徴とする無線周波数トランシーバ装置を提供する。
Claims (14)
- 無線周波数帯域のための送受信装置を製造する方法において、
無線周波数帯域のための集積された送受信回路を備えており、アンテナを備えない電子チップを作製し、
前記電子チップを直列に接続し、
前記電子チップの直列接続では、送信/受信周波数に応じて選択された長さを夫々有する少なくとも2本の導電性ケーブル要素によって、各電子チップの一側を、該電子チップに隣り合う1つの電子チップの一側、又は該電子チップ及び該電子チップに隣り合う1つの電子チップ間の1つの中間要素の一側に接続し、各導電性ケーブル要素は、前記電子チップの少なくとも1つの端子に電気的に接続し、一続きの前記電子チップを機械的に少なくとも一時的に維持し、
前記送受信装置のアンテナである撚線を電子チップ毎に形成するために、直列接続された一続きの前記電子チップを一定間隔で切断することを特徴とする方法。 - 前記導電性ケーブル要素は夫々、切断前に、3以上の前記電子チップを接続することを特徴とする請求項1に記載の方法。
- 2本の前記導電性ケーブル要素は、前記電子チップの両側に、第1の方向の夫々の側端の近傍に配置されることを特徴とする請求項1又は2に記載の方法。
- 前記中間要素は、前記導電性ケーブル要素と接続される少なくとも1つの導電部を支持し、電子チップ毎にループアンテナを形成すべく切断されることを特徴とする請求項1乃至3のいずれかに記載の方法。
- 前記切断後に、前記電子チップのアンテナである2本の撚線が、前記電子チップの両側に延びていることを特徴とする請求項1乃至3のいずれかに記載の方法。
- 前記電子チップは、前記導電性ケーブル要素によって接続される前に、支持ストリップに配置されることを特徴とする請求項1乃至5のいずれかに記載の方法。
- ケーブル接続要素が、直列接続された一続きの電子チップを切断した後、一続きの送受信装置を形成するために、直列接続された一続きの電子チップを切断する前に、異なる電子チップに接続されることを特徴とする請求項1乃至6のいずれかに記載の方法。
- 前記撚線は、前記ケーブル接続要素に巻きつけられることを特徴とする請求項7に記載の方法。
- 各電子チップは、前記導電性ケーブル要素を収容するための領域を少なくとも1つ含むことを特徴とする請求項1乃至8のいずれかに記載の方法。
- 無線周波数帯域のための送受信装置において、
無線周波数帯域のための集積された送受信回路を備えている電子チップと、
請求項1乃至9のいずれかに記載の方法によって得られた少なくとも2本のアンテナである撚線と
を備えることを特徴とする送受信装置。 - 一続きの無線周波数帯域のための送受信装置において、
無線周波数帯域のための集積された送受信回路を有し、互いに接続された複数の電子チップを備えており、
各電子チップの一側は、該電子チップのアンテナ接続パッドに接続された少なくとも2本の導電性ケーブル要素によって、該電子チップに隣り合う1つの電子チップの一側、又は該電子チップ及び該電子チップに隣り合う1つの電子チップ間の1つの中間要素の一側に接続されており、
2つの隣り合う電子チップ間、又は電子チップと中間要素との間の前記導電性ケーブル要素の夫々の長さは、送信/受信周波数に応じて選択されていることを特徴とする一続きの送受信装置。 - 2つの隣り合う電子チップ間の前記導電性ケーブル要素の夫々の長さより長い追加のケーブル接続要素が、前記電子チップ間の前記導電性ケーブル要素の切断後に、前記電子チップを接続していることを特徴とする請求項11に記載の一続きの送受信装置。
- 請求項1乃至9のいずれかに記載の方法により得られることを特徴とする請求項11又は12に記載の一続きの送受信装置。
- 請求項11乃至13のいずれかに記載の一続きの前記送受信装置を備えることを特徴とするパイプ。
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FR0704445A FR2917895B1 (fr) | 2007-06-21 | 2007-06-21 | Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple |
FR0704445 | 2007-06-21 | ||
PCT/FR2008/051079 WO2009004243A2 (fr) | 2007-06-21 | 2008-06-18 | Assemblage de puces radiofrequence |
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CN101711430A (zh) | 2010-05-19 |
WO2009004243A4 (fr) | 2009-07-23 |
EP2158605A2 (fr) | 2010-03-03 |
US8471773B2 (en) | 2013-06-25 |
US8258011B2 (en) | 2012-09-04 |
US20100136746A1 (en) | 2010-06-03 |
DE602008003224D1 (de) | 2010-12-09 |
CN101681887B (zh) | 2011-08-10 |
CN101681887A (zh) | 2010-03-24 |
WO2009013409A3 (fr) | 2009-05-22 |
EP2158605B1 (fr) | 2010-10-27 |
EP2158604B1 (fr) | 2016-10-19 |
WO2009004243A3 (fr) | 2009-05-14 |
WO2009013409A2 (fr) | 2009-01-29 |
ATE486367T1 (de) | 2010-11-15 |
FR2917895A1 (fr) | 2008-12-26 |
ES2355180T3 (es) | 2011-03-23 |
WO2009004243A2 (fr) | 2009-01-08 |
CN101711430B (zh) | 2013-10-16 |
US20100245182A1 (en) | 2010-09-30 |
FR2917895B1 (fr) | 2010-04-09 |
JP2010530584A (ja) | 2010-09-09 |
JP5405457B2 (ja) | 2014-02-05 |
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