JP2013168599A5 - - Google Patents

Download PDF

Info

Publication number
JP2013168599A5
JP2013168599A5 JP2012032367A JP2012032367A JP2013168599A5 JP 2013168599 A5 JP2013168599 A5 JP 2013168599A5 JP 2012032367 A JP2012032367 A JP 2012032367A JP 2012032367 A JP2012032367 A JP 2012032367A JP 2013168599 A5 JP2013168599 A5 JP 2013168599A5
Authority
JP
Japan
Prior art keywords
semiconductor light
light emitting
phosphor sheet
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012032367A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013168599A (ja
JP5953797B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012032367A priority Critical patent/JP5953797B2/ja
Priority claimed from JP2012032367A external-priority patent/JP5953797B2/ja
Publication of JP2013168599A publication Critical patent/JP2013168599A/ja
Publication of JP2013168599A5 publication Critical patent/JP2013168599A5/ja
Application granted granted Critical
Publication of JP5953797B2 publication Critical patent/JP5953797B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012032367A 2012-02-17 2012-02-17 半導体発光装置の製造方法 Expired - Fee Related JP5953797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013168599A JP2013168599A (ja) 2013-08-29
JP2013168599A5 true JP2013168599A5 (enExample) 2015-03-26
JP5953797B2 JP5953797B2 (ja) 2016-07-20

Family

ID=49178767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012032367A Expired - Fee Related JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP5953797B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061024A (ja) * 2013-09-20 2015-03-30 パナソニック株式会社 発光モジュール
KR102035511B1 (ko) * 2013-10-24 2019-10-23 도레이 카부시키가이샤 형광체 조성물, 형광체 시트, 형광체 시트 적층체와 그들을 사용한 led 칩, led 패키지 및 그 제조 방법
WO2015068652A1 (ja) * 2013-11-07 2015-05-14 東レ株式会社 積層体およびそれを用いた発光装置の製造方法
CN106575693B (zh) * 2014-06-19 2020-07-31 亮锐控股有限公司 具有小源尺寸的波长转换发光设备
CN108351444B (zh) * 2015-12-04 2021-10-26 东丽株式会社 荧光体片、使用其的发光体、光源单元、显示器及发光体的制造方法
JP6902838B2 (ja) * 2016-09-08 2021-07-14 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光半導体素子被覆用シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971672B2 (ja) * 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
JP5630966B2 (ja) * 2009-04-27 2014-11-26 日亜化学工業株式会社 発光素子チップ組立体およびその製造方法

Similar Documents

Publication Publication Date Title
WO2015184152A3 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
JP2011233552A5 (enExample)
JP2013168599A5 (enExample)
EP2866257A3 (en) Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same
WO2015039043A3 (en) Microelectronic element with bond elements and compliant material layer
JP2012109566A5 (enExample)
JP2013033786A5 (ja) 半導体装置、半導体装置の製造方法、および電子機器
EP3018711A8 (en) Semiconductor device and manufacturing method for the semiconductor device
WO2010144213A3 (en) Integrated circuit light emission device, module and fabrication process
RU2012147484A (ru) Светоизлучающий прибор и способ его изготовления
EP3211661A3 (en) Method for manufacturing a flip-chip type semiconductor apparatus using a photosensitive adhesive layer and corresponding flip-chip type semiconductor apparatus
WO2008153043A1 (ja) 半導体発光装置
EP2466657A3 (en) LED package
EP2657992A3 (en) Light emitting device and light emitting device package
JP2011060807A5 (ja) 半導体チップの製造方法
WO2015044621A3 (fr) Dispositif optoelectronique a diodes electroluminescentes
EP2752873A3 (en) Semiconductor module
JP2016096292A5 (enExample)
EP2348547A3 (en) Light emitting device, method of manufacturing the same, light emitting device package and lighting system
EP2466658A3 (en) LED including a phosphor layer, LED package and methods of manufacturing the same
TW201613142A (en) Light-emitting unit and semiconductor light-emitting device
WO2009002129A3 (en) Semiconductor light emitting device and method of manufacturing the same
WO2016068533A3 (ko) 고효율 발광 장치
JP2015220392A5 (enExample)
EP2562830A3 (en) Light emitting device package