JP5953797B2 - 半導体発光装置の製造方法 - Google Patents

半導体発光装置の製造方法 Download PDF

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Publication number
JP5953797B2
JP5953797B2 JP2012032367A JP2012032367A JP5953797B2 JP 5953797 B2 JP5953797 B2 JP 5953797B2 JP 2012032367 A JP2012032367 A JP 2012032367A JP 2012032367 A JP2012032367 A JP 2012032367A JP 5953797 B2 JP5953797 B2 JP 5953797B2
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JP2013168599A5 (enExample
JP2013168599A (ja
Inventor
広宣 定国
広宣 定国
松村　宣夫
宣夫 松村
吉岡　正裕
正裕 吉岡
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Toray Industries Inc
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Toray Industries Inc
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JP2012032367A 2012-02-17 2012-02-17 半導体発光装置の製造方法 Expired - Fee Related JP5953797B2 (ja)

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JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

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JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

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JP2013168599A JP2013168599A (ja) 2013-08-29
JP2013168599A5 JP2013168599A5 (enExample) 2015-03-26
JP5953797B2 true JP5953797B2 (ja) 2016-07-20

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061024A (ja) * 2013-09-20 2015-03-30 パナソニック株式会社 発光モジュール
KR102035511B1 (ko) * 2013-10-24 2019-10-23 도레이 카부시키가이샤 형광체 조성물, 형광체 시트, 형광체 시트 적층체와 그들을 사용한 led 칩, led 패키지 및 그 제조 방법
WO2015068652A1 (ja) * 2013-11-07 2015-05-14 東レ株式会社 積層体およびそれを用いた発光装置の製造方法
CN106575693B (zh) * 2014-06-19 2020-07-31 亮锐控股有限公司 具有小源尺寸的波长转换发光设备
CN108351444B (zh) * 2015-12-04 2021-10-26 东丽株式会社 荧光体片、使用其的发光体、光源单元、显示器及发光体的制造方法
JP6902838B2 (ja) * 2016-09-08 2021-07-14 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光半導体素子被覆用シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971672B2 (ja) * 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
JP5630966B2 (ja) * 2009-04-27 2014-11-26 日亜化学工業株式会社 発光素子チップ組立体およびその製造方法

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