JP2014179569A5 - - Google Patents
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- Publication number
- JP2014179569A5 JP2014179569A5 JP2013054267A JP2013054267A JP2014179569A5 JP 2014179569 A5 JP2014179569 A5 JP 2014179569A5 JP 2013054267 A JP2013054267 A JP 2013054267A JP 2013054267 A JP2013054267 A JP 2013054267A JP 2014179569 A5 JP2014179569 A5 JP 2014179569A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- light emitting
- emitting device
- side electrode
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 25
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013054267A JP2014179569A (ja) | 2013-03-15 | 2013-03-15 | 発光装置およびその製造方法 |
| US14/011,628 US9337405B2 (en) | 2012-08-31 | 2013-08-27 | Light emitting device and method for manufacturing the same |
| CN201310381486.3A CN103682038B (zh) | 2012-08-31 | 2013-08-28 | 发光装置及其制造方法 |
| EP13182215.7A EP2704223B1 (en) | 2012-08-31 | 2013-08-29 | Light emitting device and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013054267A JP2014179569A (ja) | 2013-03-15 | 2013-03-15 | 発光装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014179569A JP2014179569A (ja) | 2014-09-25 |
| JP2014179569A5 true JP2014179569A5 (enExample) | 2016-02-12 |
Family
ID=51699197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013054267A Pending JP2014179569A (ja) | 2012-08-31 | 2013-03-15 | 発光装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014179569A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104317470B (zh) * | 2014-11-14 | 2017-06-13 | 深圳市华星光电技术有限公司 | 互电容式ogs触摸面板及其制造方法 |
| JP6912738B2 (ja) * | 2014-12-26 | 2021-08-04 | 日亜化学工業株式会社 | 発光装置 |
| JP6557970B2 (ja) * | 2014-12-26 | 2019-08-14 | 日亜化学工業株式会社 | 発光装置 |
| JP6519407B2 (ja) * | 2015-08-26 | 2019-05-29 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| JP6974702B2 (ja) * | 2017-07-31 | 2021-12-01 | 日亜化学工業株式会社 | 半導体発光装置の製造方法 |
| TWI671921B (zh) * | 2018-09-14 | 2019-09-11 | 頎邦科技股份有限公司 | 晶片封裝構造及其晶片 |
| JP7140999B2 (ja) * | 2020-04-13 | 2022-09-22 | 日亜化学工業株式会社 | 面状光源及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3896704B2 (ja) * | 1998-10-07 | 2007-03-22 | 松下電器産業株式会社 | ＧａＮ系化合物半導体発光素子 |
| JP2003017757A (ja) * | 2001-06-29 | 2003-01-17 | Sanken Electric Co Ltd | フリップチップ形半導体発光素子 |
| US7754507B2 (en) * | 2005-06-09 | 2010-07-13 | Philips Lumileds Lighting Company, Llc | Method of removing the growth substrate of a semiconductor light emitting device |
| US7867793B2 (en) * | 2007-07-09 | 2011-01-11 | Koninklijke Philips Electronics N.V. | Substrate removal during LED formation |
| US20090230409A1 (en) * | 2008-03-17 | 2009-09-17 | Philips Lumileds Lighting Company, Llc | Underfill process for flip-chip leds |
| CN102959708B (zh) * | 2010-06-29 | 2016-05-04 | 柯立芝照明有限公司 | 具有易弯曲基板的电子装置 |
| CN102354721A (zh) * | 2011-11-04 | 2012-02-15 | 祝进田 | 一种倒装结构的led芯片制作方法 |
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2013
- 2013-03-15 JP JP2013054267A patent/JP2014179569A/ja active Pending