JP2014220542A5 - - Google Patents

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Publication number
JP2014220542A5
JP2014220542A5 JP2014175011A JP2014175011A JP2014220542A5 JP 2014220542 A5 JP2014220542 A5 JP 2014220542A5 JP 2014175011 A JP2014175011 A JP 2014175011A JP 2014175011 A JP2014175011 A JP 2014175011A JP 2014220542 A5 JP2014220542 A5 JP 2014220542A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
light
semiconductor layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014175011A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014220542A (ja
JP5898277B2 (ja
Filing date
Publication date
Priority claimed from GBGB9724507.0A external-priority patent/GB9724507D0/en
Priority claimed from GBGB9820311.0A external-priority patent/GB9820311D0/en
Application filed filed Critical
Publication of JP2014220542A publication Critical patent/JP2014220542A/ja
Publication of JP2014220542A5 publication Critical patent/JP2014220542A5/ja
Application granted granted Critical
Publication of JP5898277B2 publication Critical patent/JP5898277B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2014175011A 1997-11-19 2014-08-29 Ｌｅｄランプ並びにｌｅｄチップ Expired - Lifetime JP5898277B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9724507.0 1997-11-19
GBGB9724507.0A GB9724507D0 (en) 1997-09-12 1997-11-19 Light source arrangements
GB9820311.0 1998-09-17
GBGB9820311.0A GB9820311D0 (en) 1997-11-19 1998-09-17 Led lamp

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012133727A Division JP2012195605A (ja) 1997-11-19 2012-06-13 Ｌｅｄランプ並びにｌｅｄチップ

Publications (3)

Publication Number Publication Date
JP2014220542A JP2014220542A (ja) 2014-11-20
JP2014220542A5 true JP2014220542A5 (enExample) 2015-01-15
JP5898277B2 JP5898277B2 (ja) 2016-04-06

Family

ID=26312629

Family Applications (4)

Application Number Title Priority Date Filing Date
JP32874498A Withdrawn JPH11224960A (ja) 1997-11-19 1998-11-19 Ｌｅｄランプ並びにｌｅｄチップ
JP2010113662A Pending JP2010177711A (ja) 1997-11-19 2010-05-17 Ｌｅｄランプ並びにｌｅｄチップ
JP2012133727A Pending JP2012195605A (ja) 1997-11-19 2012-06-13 Ｌｅｄランプ並びにｌｅｄチップ
JP2014175011A Expired - Lifetime JP5898277B2 (ja) 1997-11-19 2014-08-29 Ｌｅｄランプ並びにｌｅｄチップ

Family Applications Before (3)

Application Number Title Priority Date Filing Date
JP32874498A Withdrawn JPH11224960A (ja) 1997-11-19 1998-11-19 Ｌｅｄランプ並びにｌｅｄチップ
JP2010113662A Pending JP2010177711A (ja) 1997-11-19 2010-05-17 Ｌｅｄランプ並びにｌｅｄチップ
JP2012133727A Pending JP2012195605A (ja) 1997-11-19 2012-06-13 Ｌｅｄランプ並びにｌｅｄチップ

Country Status (3)

Country Link
US (2) US6346771B1 (enExample)
JP (4) JPH11224960A (enExample)
GB (1) GB2331625B (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633120B2 (en) * 1998-11-19 2003-10-14 Unisplay S.A. LED lamps
US6614056B1 (en) * 1999-12-01 2003-09-02 Cree Lighting Company Scalable led with improved current spreading structures
US6410942B1 (en) * 1999-12-03 2002-06-25 Cree Lighting Company Enhanced light extraction through the use of micro-LED arrays
JP4810746B2 (ja) * 2000-03-31 2011-11-09 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子
DE10016817A1 (de) * 2000-04-05 2001-10-18 Mannesmann Vdo Ag Farb-Head-up Display, insbesondere für ein Fahrzeug
DE10033496A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Halbleiterchip für die Optoelektronik
US6525464B1 (en) * 2000-09-08 2003-02-25 Unity Opto Technology Co., Ltd. Stacked light-mixing LED
US6791119B2 (en) 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US7211833B2 (en) * 2001-07-23 2007-05-01 Cree, Inc. Light emitting diodes including barrier layers/sublayers
US6740906B2 (en) * 2001-07-23 2004-05-25 Cree, Inc. Light emitting diodes including modifications for submount bonding
JP4055503B2 (ja) 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
KR100401005B1 (ko) * 2001-08-27 2003-10-10 동부전자 주식회사 마스크롬 제조방법
US20030090103A1 (en) * 2001-11-09 2003-05-15 Thomas Becker Direct mailing device
WO2006072071A2 (en) * 2004-12-30 2006-07-06 Phoseon Technology Inc. Methods and systems relating to light sources for use in industrial processes
CN1653297B (zh) 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
DE10234977A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Dünnschicht-Halbleiterbauelement auf GaN-Basis
KR100891403B1 (ko) 2002-08-01 2009-04-02 니치아 카가쿠 고교 가부시키가이샤 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치
CA2517009A1 (en) 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
US20040201990A1 (en) * 2003-04-10 2004-10-14 Meyer William E. LED lamp
CN100502062C (zh) * 2003-04-30 2009-06-17 美商克立股份有限公司 具有小型光学元件的高功率发光器封装
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US6945683B2 (en) * 2003-05-30 2005-09-20 Guide Corporation Thin lamp assembly method
US7073618B1 (en) 2003-07-01 2006-07-11 Polaris Industries Inc. Flush mounted taillight
KR101183776B1 (ko) 2003-08-19 2012-09-17 니치아 카가쿠 고교 가부시키가이샤 반도체 소자
WO2005041313A1 (de) * 2003-09-26 2005-05-06 Osram Opto Semiconductors Gmbh Strahlungsemittierender dünnschicht-halbleiterchip
EP1678442B8 (en) * 2003-10-31 2013-06-26 Phoseon Technology, Inc. Led light module and manufacturing method
JP2005158369A (ja) * 2003-11-21 2005-06-16 Toyota Industries Corp 光学部材及び照明装置
EP1735844B1 (en) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications
US20080121917A1 (en) * 2006-11-15 2008-05-29 The Regents Of The University Of California High efficiency white, single or multi-color light emitting diodes (leds) by index matching structures
US20060204865A1 (en) * 2005-03-08 2006-09-14 Luminus Devices, Inc. Patterned light-emitting devices
US7952110B2 (en) * 2006-06-12 2011-05-31 3M Innovative Properties Company LED device with re-emitting semiconductor construction and converging optical element
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
EP2036135A4 (en) 2006-06-12 2013-11-13 3M Innovative Properties Co LED ARRANGEMENT WITH REASSEMBLING SEMICONDUCTOR CONSTRUCTION AND CONVERGING OPTICAL ELEMENT
US7902542B2 (en) * 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
KR20160150648A (ko) * 2006-09-29 2016-12-30 오스람 실바니아 인코포레이티드 유기 발광 소자 및 조명 장치
US8110838B2 (en) * 2006-12-08 2012-02-07 Luminus Devices, Inc. Spatial localization of light-generating portions in LEDs
JP4901453B2 (ja) * 2006-12-20 2012-03-21 東芝ディスクリートテクノロジー株式会社 半導体発光素子
KR100833311B1 (ko) * 2007-01-03 2008-05-28 삼성전기주식회사 질화물계 반도체 발광소자
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
US20080258130A1 (en) * 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
AU2012201421B2 (en) * 2007-10-25 2012-08-16 Lsi Industries, Inc. Reflector
JP2011501387A (ja) 2007-10-25 2011-01-06 エルエスアイ・インダストリーズ・インコーポレーテッド リフレクタ
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
CN101499510B (zh) * 2008-01-30 2011-06-22 富士迈半导体精密工业（上海）有限公司 半导体发光元件
TWI394296B (zh) * 2008-09-09 2013-04-21 Bridgelux Inc 具改良式電極結構之發光元件
USD631018S1 (en) * 2009-09-28 2011-01-18 Toyoda Gosei Co., Ltd. Light emitting diode chip
USD631017S1 (en) * 2009-09-28 2011-01-18 Toyoda Gosei Co., Ltd. Light emitting diode chip
USD620897S1 (en) * 2009-10-29 2010-08-03 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD633876S1 (en) * 2009-10-30 2011-03-08 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD620460S1 (en) * 2009-10-30 2010-07-27 SemiLEDs, Optoelectronics Co., Ltd. Light emitting diode device
US8981397B2 (en) 2010-02-12 2015-03-17 Tsmc Solid State Lighting Ltd. Light-emitting devices on textured substrates
EP2458412A1 (en) 2010-11-24 2012-05-30 Université de Liège Method for manufacturing an improved optical layer of a light emitting device, and light emitting device with surface nano-micro texturation based on radiation speckle lithography.
KR102013363B1 (ko) * 2012-11-09 2019-08-22 서울바이오시스 주식회사 발광 소자 및 그것을 제조하는 방법
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
US11329195B2 (en) 2013-08-27 2022-05-10 Epistar Corporation Semiconductor light-emitting device
US9461209B2 (en) 2013-11-27 2016-10-04 Epistar Corporation Semiconductor light-emitting device
JP6331906B2 (ja) * 2013-09-13 2018-05-30 日亜化学工業株式会社 発光素子
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
KR102659254B1 (ko) * 2018-12-26 2024-04-22 엘지전자 주식회사 반도체 발광소자를 이용한 램프
JP6803595B1 (ja) * 2020-09-16 2020-12-23 アルディーテック株式会社 半導体発光素子チップ集積装置およびその製造方法
CN114005926B (zh) * 2021-10-29 2024-02-27 淮安澳洋顺昌光电技术有限公司 导热层、发光二极管、半导体器件及其制备方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443140A (en) * 1965-04-06 1969-05-06 Gen Electric Light emitting semiconductor devices of improved transmission characteristics
US3900863A (en) 1974-05-13 1975-08-19 Westinghouse Electric Corp Light-emitting diode which generates light in three dimensions
JPS5136085A (enExample) * 1974-09-24 1976-03-26 Mitsubishi Electric Corp
US4163953A (en) 1977-07-07 1979-08-07 Northern Telecom Limited Double heterostructure laser for direct coupling to an optical fiber
DE2755433C2 (de) * 1977-12-13 1986-09-25 Telefunken electronic GmbH, 7100 Heilbronn Strahlungsemittierende Halbleiterdiode
US4225380A (en) 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5896781A (ja) * 1981-12-03 1983-06-08 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法
JPS6276686A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 発光素子
KR880014692A (ko) * 1987-05-30 1988-12-24 강진구 반사경이 부착된 반도체 발광장치
US4881237A (en) * 1988-08-26 1989-11-14 Massachusetts Institute Of Technology Hybrid two-dimensional surface-emitting laser arrays
US5087949A (en) 1989-06-27 1992-02-11 Hewlett-Packard Company Light-emitting diode with diagonal faces
EP0442002B1 (de) 1990-02-13 1994-01-12 Siemens Aktiengesellschaft Strahlungserzeugendes Halbleiterbauelement
JPH0658953B2 (ja) * 1990-03-16 1994-08-03 グローリー工業株式会社 半導体装置
JPH0487381A (ja) * 1990-07-31 1992-03-19 Eastman Kodak Japan Kk 発光ダイオードアレイチップ
JP2786375B2 (ja) * 1992-06-18 1998-08-13 シャープ株式会社 発光ダイオード
US5309001A (en) 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
JP3423328B2 (ja) * 1991-12-09 2003-07-07 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
JP3236650B2 (ja) * 1992-02-27 2001-12-10 京セラ株式会社 半導体発光素子
JP2798545B2 (ja) 1992-03-03 1998-09-17 シャープ株式会社 半導体発光素子及びその製造方法
JPH065922A (ja) * 1992-06-24 1994-01-14 Rohm Co Ltd 多色発光ダイオード
JPH06318731A (ja) * 1993-03-12 1994-11-15 Sharp Corp 半導体発光装置
JP3312049B2 (ja) * 1993-03-12 2002-08-05 シャープ株式会社 半導体発光装置
JPH0786640A (ja) * 1993-06-17 1995-03-31 Nichia Chem Ind Ltd 発光デバイス
JPH07254732A (ja) * 1994-03-15 1995-10-03 Toshiba Corp 半導体発光装置
JPH07307489A (ja) * 1994-05-13 1995-11-21 Toshiba Corp 半導体発光素子及びその製造方法
JPH08139361A (ja) * 1994-11-08 1996-05-31 Toshiba Corp 化合物半導体発光素子
GB2309334B (en) * 1994-12-20 1997-11-19 Ultra Silicon Techn Uk Ltd Guiding light within electroluminescent devices
DE19517697A1 (de) 1995-05-13 1996-11-14 Telefunken Microelectron Strahlungsemittierende Diode
JPH0936431A (ja) 1995-07-13 1997-02-07 Toshiba Corp 半導体発光素子
DE19629920B4 (de) 1995-08-10 2006-02-02 LumiLeds Lighting, U.S., LLC, San Jose Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor
JP3960636B2 (ja) * 1995-09-29 2007-08-15 三洋電機株式会社 発光素子
DE19549818B4 (de) 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
JP3241976B2 (ja) * 1995-10-16 2001-12-25 株式会社東芝 半導体発光素子
US5779924A (en) 1996-03-22 1998-07-14 Hewlett-Packard Company Ordered interface texturing for a light emitting device
JP3407536B2 (ja) * 1996-05-09 2003-05-19 日亜化学工業株式会社 窒化物半導体素子
US5905275A (en) * 1996-06-17 1999-05-18 Kabushiki Kaisha Toshiba Gallium nitride compound semiconductor light-emitting device
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US5734225A (en) * 1996-07-10 1998-03-31 International Business Machines Corporation Encapsulation of organic light emitting devices using siloxane or siloxane derivatives
US6229160B1 (en) * 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
EP0905797B1 (de) 1997-09-29 2010-02-10 OSRAM Opto Semiconductors GmbH Halbleiterlichtquelle und Verfahren zu ihrer Herstellung
US6015719A (en) * 1997-10-24 2000-01-18 Hewlett-Packard Company Transparent substrate light emitting diodes with directed light output
JP3505374B2 (ja) * 1997-11-14 2004-03-08 三洋電機株式会社 発光部品
FR2780656B1 (fr) * 1998-07-03 2001-08-03 Dalloz Fall Prot Appareil anti-chute sur cable vertical

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