JP2014179569A - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

Info

Publication number
JP2014179569A
JP2014179569A JP2013054267A JP2013054267A JP2014179569A JP 2014179569 A JP2014179569 A JP 2014179569A JP 2013054267 A JP2013054267 A JP 2013054267A JP 2013054267 A JP2013054267 A JP 2013054267A JP 2014179569 A JP2014179569 A JP 2014179569A
Authority
JP
Japan
Prior art keywords
semiconductor layer
light emitting
emitting device
side electrode
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013054267A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014179569A5 (enExample
Inventor
Ikuko Baike
郁子 梅宅
Akira Suzuki
亮 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2013054267A priority Critical patent/JP2014179569A/ja
Priority to US14/011,628 priority patent/US9337405B2/en
Priority to CN201310381486.3A priority patent/CN103682038B/zh
Priority to EP13182215.7A priority patent/EP2704223B1/en
Publication of JP2014179569A publication Critical patent/JP2014179569A/ja
Publication of JP2014179569A5 publication Critical patent/JP2014179569A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Led Devices (AREA)
JP2013054267A 2012-08-31 2013-03-15 発光装置およびその製造方法 Pending JP2014179569A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013054267A JP2014179569A (ja) 2013-03-15 2013-03-15 発光装置およびその製造方法
US14/011,628 US9337405B2 (en) 2012-08-31 2013-08-27 Light emitting device and method for manufacturing the same
CN201310381486.3A CN103682038B (zh) 2012-08-31 2013-08-28 发光装置及其制造方法
EP13182215.7A EP2704223B1 (en) 2012-08-31 2013-08-29 Light emitting device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013054267A JP2014179569A (ja) 2013-03-15 2013-03-15 発光装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2014179569A true JP2014179569A (ja) 2014-09-25
JP2014179569A5 JP2014179569A5 (enExample) 2016-02-12

Family

ID=51699197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013054267A Pending JP2014179569A (ja) 2012-08-31 2013-03-15 発光装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2014179569A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016127056A (ja) * 2014-12-26 2016-07-11 日亜化学工業株式会社 発光装置
JP2017045832A (ja) * 2015-08-26 2017-03-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP2017534122A (ja) * 2014-11-14 2017-11-16 深▲セン▼市華星光電技術有限公司 相互キャパシタンス方式のｏｇｓタッチパネル及びその製造方法
JP2019029546A (ja) * 2017-07-31 2019-02-21 日亜化学工業株式会社 半導体発光装置の製造方法
JP2019176192A (ja) * 2014-12-26 2019-10-10 日亜化学工業株式会社 発光装置
KR20200031978A (ko) * 2018-09-14 2020-03-25 칩본드 테크놀러지 코포레이션 칩 패키지 구조 및 그 칩
JP2021170526A (ja) * 2020-04-13 2021-10-28 日亜化学工業株式会社 面状光源及びその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114595A (ja) * 1998-10-07 2000-04-21 Matsushita Electronics Industry Corp ＧａＮ系化合物半導体発光素子
JP2003017757A (ja) * 2001-06-29 2003-01-17 Sanken Electric Co Ltd フリップチップ形半導体発光素子
JP2006344971A (ja) * 2005-06-09 2006-12-21 Philips Lumileds Lightng Co Llc 半導体発光素子の成長基板を除去する方法
JP2010533374A (ja) * 2007-07-09 2010-10-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄの形成における基板の取り除き
JP2011514688A (ja) * 2008-03-17 2011-05-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ フリップチップｌｅｄに関するアンダーフィル処理
US20110315956A1 (en) * 2010-06-29 2011-12-29 Michael Tischler Electronic Devices with Yielding Substrates
CN102354721A (zh) * 2011-11-04 2012-02-15 祝进田 一种倒装结构的led芯片制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114595A (ja) * 1998-10-07 2000-04-21 Matsushita Electronics Industry Corp ＧａＮ系化合物半導体発光素子
JP2003017757A (ja) * 2001-06-29 2003-01-17 Sanken Electric Co Ltd フリップチップ形半導体発光素子
JP2006344971A (ja) * 2005-06-09 2006-12-21 Philips Lumileds Lightng Co Llc 半導体発光素子の成長基板を除去する方法
JP2010533374A (ja) * 2007-07-09 2010-10-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄの形成における基板の取り除き
JP2011514688A (ja) * 2008-03-17 2011-05-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ フリップチップｌｅｄに関するアンダーフィル処理
US20110315956A1 (en) * 2010-06-29 2011-12-29 Michael Tischler Electronic Devices with Yielding Substrates
JP2013531378A (ja) * 2010-06-29 2013-08-01 クーレッジ ライティング インコーポレイテッド 柔軟な基板を有する電子素子
CN102354721A (zh) * 2011-11-04 2012-02-15 祝进田 一种倒装结构的led芯片制作方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017534122A (ja) * 2014-11-14 2017-11-16 深▲セン▼市華星光電技術有限公司 相互キャパシタンス方式のｏｇｓタッチパネル及びその製造方法
JP2016127056A (ja) * 2014-12-26 2016-07-11 日亜化学工業株式会社 発光装置
JP2019176192A (ja) * 2014-12-26 2019-10-10 日亜化学工業株式会社 発光装置
JP2017045832A (ja) * 2015-08-26 2017-03-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP2019029546A (ja) * 2017-07-31 2019-02-21 日亜化学工業株式会社 半導体発光装置の製造方法
KR20200031978A (ko) * 2018-09-14 2020-03-25 칩본드 테크놀러지 코포레이션 칩 패키지 구조 및 그 칩
US10797213B2 (en) 2018-09-14 2020-10-06 Chipbond Technology Corporation Chip package and chip thereof
KR102223668B1 (ko) * 2018-09-14 2021-03-05 칩본드 테크놀러지 코포레이션 칩 패키지 구조 및 그 칩
JP2021170526A (ja) * 2020-04-13 2021-10-28 日亜化学工業株式会社 面状光源及びその製造方法
JP7140999B2 (ja) 2020-04-13 2022-09-22 日亜化学工業株式会社 面状光源及びその製造方法

Similar Documents

Publication Publication Date Title
CN103682038B (zh) 发光装置及其制造方法
JP6323176B2 (ja) 発光装置の製造方法
US10600942B2 (en) Light emitting device and method for producing the same
TWI613737B (zh) 發光裝置之製造方法
CN103003966B (zh) 具有波长变换层的发光二级管芯片及其制造方法，以及包括其的封装件及其制造方法
JP6205897B2 (ja) 発光装置及びその製造方法
JP6398626B2 (ja) 発光装置の製造方法
JP6699634B2 (ja) 発光装置の製造方法
JP2014179569A (ja) 発光装置およびその製造方法
JP6256026B2 (ja) 発光装置及び発光装置の製造方法
CN104022216A (zh) 发光装置
CN110085722A (zh) 发光装置
WO2013137356A1 (ja) 半導体発光装置及びその製造方法
CN109148674B (zh) 发光装置
TW202021162A (zh) 發光裝置
CN104752598A (zh) 发光装置
JP6155827B2 (ja) 発光装置の製造方法
JP6511809B2 (ja) 発光装置及びその実装方法、並びに光源装置の製造方法
JP6447018B2 (ja) 発光装置及び発光装置の製造方法
JP6460189B2 (ja) 発光装置及びその製造方法
JP6089507B2 (ja) 発光装置およびその製造方法
JP2019054277A (ja) 発光装置及び発光装置の製造方法
JP2019067880A (ja) 発光装置の製造方法及び発光装置
JP2020123746A (ja) 発光装置の製造方法

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20150908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151221

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20160215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160802

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20160926

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170411

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20171010