JP2013046072A5 - - Google Patents
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- Publication number
- JP2013046072A5 JP2013046072A5 JP2012183660A JP2012183660A JP2013046072A5 JP 2013046072 A5 JP2013046072 A5 JP 2013046072A5 JP 2012183660 A JP2012183660 A JP 2012183660A JP 2012183660 A JP2012183660 A JP 2012183660A JP 2013046072 A5 JP2013046072 A5 JP 2013046072A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- device package
- package according
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910010293 ceramic material Inorganic materials 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0083721 | 2011-08-22 | ||
| KR1020110083721A KR20130021298A (ko) | 2011-08-22 | 2011-08-22 | 발광소자 패키지, 라이트 유닛 및 표시장치 |
| KR1020110084718A KR20130022053A (ko) | 2011-08-24 | 2011-08-24 | 발광소자 패키지, 발광소자 패키지 제조방법, 라이트 유닛, 표시장치 |
| KR10-2011-0084718 | 2011-08-24 | ||
| KR10-2011-0131466 | 2011-12-09 | ||
| KR1020110131466A KR101902393B1 (ko) | 2011-12-09 | 2011-12-09 | 발광소자 패키지 |
| KR1020110139806A KR101976531B1 (ko) | 2011-12-22 | 2011-12-22 | 발광 모듈 |
| KR10-2011-0139806 | 2011-12-22 | ||
| KR1020110140236A KR101891717B1 (ko) | 2011-12-22 | 2011-12-22 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
| KR10-2011-0140236 | 2011-12-22 | ||
| KR1020110143152A KR20130074991A (ko) | 2011-12-27 | 2011-12-27 | 발광 모듈 |
| KR10-2011-0143152 | 2011-12-27 | ||
| KR1020110147361A KR101894353B1 (ko) | 2011-12-30 | 2011-12-30 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
| KR10-2011-0147361 | 2011-12-30 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017085863A Division JP6312899B2 (ja) | 2011-08-22 | 2017-04-25 | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013046072A JP2013046072A (ja) | 2013-03-04 |
| JP2013046072A5 true JP2013046072A5 (enExample) | 2015-10-01 |
Family
ID=46690439
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012183660A Pending JP2013046072A (ja) | 2011-08-22 | 2012-08-22 | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
| JP2017085863A Active JP6312899B2 (ja) | 2011-08-22 | 2017-04-25 | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017085863A Active JP6312899B2 (ja) | 2011-08-22 | 2017-04-25 | 発光素子パッケージ、光源モジュール及びこれを含む照明システム |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8773006B2 (enExample) |
| EP (1) | EP2562832B1 (enExample) |
| JP (2) | JP2013046072A (enExample) |
| CN (1) | CN103078033B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140039740A (ko) | 2012-09-25 | 2014-04-02 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| KR101373710B1 (ko) * | 2012-12-12 | 2014-03-13 | (주)포인트엔지니어링 | 엘이디 금속기판 패키지 및 그 제조방법 |
| KR102053408B1 (ko) * | 2013-07-11 | 2019-12-06 | 엘지이노텍 주식회사 | 발광 소자 |
| JP6490932B2 (ja) * | 2013-09-16 | 2019-03-27 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
| KR20150039518A (ko) * | 2013-10-02 | 2015-04-10 | 엘지이노텍 주식회사 | 발광소자 |
| DE102013114691A1 (de) * | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
| JP6171921B2 (ja) | 2013-12-24 | 2017-08-02 | 日亜化学工業株式会社 | 配線基板及び発光装置 |
| KR20160036862A (ko) | 2014-09-26 | 2016-04-05 | 서울바이오시스 주식회사 | 발광 소자 제조 방법 및 그것에 의해 제조된 발광 소자 |
| KR101738980B1 (ko) | 2015-02-05 | 2017-05-24 | 주식회사 루멘스 | 발광 모듈 및 조명 장치 |
| CN106338043B (zh) * | 2015-07-06 | 2020-11-03 | 松下知识产权经营株式会社 | 光源单元、照明装置和车辆 |
| DE102016107495B4 (de) * | 2016-04-22 | 2022-04-14 | Tdk Electronics Ag | Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems |
| KR102588807B1 (ko) | 2016-12-15 | 2023-10-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 및 그 제조방법, 자동 초점 장치 |
| CN118117025A (zh) | 2017-03-21 | 2024-05-31 | Lg 伊诺特有限公司 | 半导体元件封装和自动聚焦装置 |
| US11145587B2 (en) * | 2017-05-26 | 2021-10-12 | Kyocera Corporation | Electronic component mounting substrate, electronic device, and electronic module |
| WO2019003535A1 (ja) | 2017-06-27 | 2019-01-03 | 日本碍子株式会社 | 透明封止部材及びその製造方法 |
| EP3528296B1 (en) * | 2018-02-16 | 2020-06-03 | Nichia Corporation | Light emitting element and light emitting device |
| CN109031779B (zh) * | 2018-07-25 | 2024-06-11 | 京东方科技集团股份有限公司 | 发光二极管基板、背光模组和显示装置 |
| KR20200064399A (ko) * | 2018-11-29 | 2020-06-08 | 주식회사 글로우원 | 투명 led 패널 |
| CN111384220A (zh) * | 2018-12-27 | 2020-07-07 | 南昌欧菲生物识别技术有限公司 | 光发射器、深度相机及电子设备 |
| US11626448B2 (en) | 2019-03-29 | 2023-04-11 | Lumileds Llc | Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture |
| CN110752281A (zh) * | 2019-10-31 | 2020-02-04 | 开发晶照明(厦门)有限公司 | 发光二极管封装结构及其承载座 |
| US11621173B2 (en) | 2019-11-19 | 2023-04-04 | Lumileds Llc | Fan out structure for light-emitting diode (LED) device and lighting system |
| CN111029896B (zh) * | 2019-12-23 | 2021-02-05 | 常州纵慧芯光半导体科技有限公司 | 一种eel激光器tof模组封装结构及其制作方法 |
| US11777066B2 (en) | 2019-12-27 | 2023-10-03 | Lumileds Llc | Flipchip interconnected light-emitting diode package assembly |
| US11664347B2 (en) | 2020-01-07 | 2023-05-30 | Lumileds Llc | Ceramic carrier and build up carrier for light-emitting diode (LED) array |
| TWI777125B (zh) * | 2020-01-22 | 2022-09-11 | 晶智達光電股份有限公司 | 雷射元件封裝結構 |
| US11476217B2 (en) | 2020-03-10 | 2022-10-18 | Lumileds Llc | Method of manufacturing an augmented LED array assembly |
| JP7244771B2 (ja) * | 2020-04-02 | 2023-03-23 | 日亜化学工業株式会社 | 面状光源の製造方法 |
| WO2021246776A1 (ko) * | 2020-06-03 | 2021-12-09 | 서울바이오시스주식회사 | 발광 소자 모듈 및 이를 포함하는 디스플레이 장치 |
| TWI887269B (zh) * | 2020-09-17 | 2025-06-21 | 晶智達光電股份有限公司 | 雷射封裝結構 |
| KR102885548B1 (ko) * | 2020-12-15 | 2025-11-12 | 엘지디스플레이 주식회사 | 광원유닛 및 이를 포함하는 표시장치 |
| KR20230020619A (ko) * | 2021-08-03 | 2023-02-13 | 삼성전자주식회사 | 반도체 자외선 발광소자 패키지 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3531573B2 (ja) * | 2000-03-17 | 2004-05-31 | 株式会社村田製作所 | 積層型セラミック電子部品およびその製造方法ならびに電子装置 |
| JP3924481B2 (ja) * | 2002-03-08 | 2007-06-06 | ローム株式会社 | 半導体チップを使用した半導体装置 |
| AU2003211644A1 (en) * | 2002-03-08 | 2003-09-22 | Rohm Co., Ltd. | Semiconductor device using semiconductor chip |
| JP4773755B2 (ja) * | 2005-07-01 | 2011-09-14 | ローム株式会社 | チップ型半導体発光素子 |
| US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
| US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
| JP2007149810A (ja) * | 2005-11-25 | 2007-06-14 | Kyocera Corp | 発光素子用配線基板および発光装置 |
| JP4417906B2 (ja) * | 2005-12-16 | 2010-02-17 | 株式会社東芝 | 発光装置及びその製造方法 |
| JP2007242856A (ja) * | 2006-03-08 | 2007-09-20 | Rohm Co Ltd | チップ型半導体発光素子 |
| US7655957B2 (en) * | 2006-04-27 | 2010-02-02 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| JP2008071955A (ja) * | 2006-09-14 | 2008-03-27 | Nichia Chem Ind Ltd | 発光装置 |
| US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
| US20080179618A1 (en) * | 2007-01-26 | 2008-07-31 | Ching-Tai Cheng | Ceramic led package |
| JP5167977B2 (ja) * | 2007-09-06 | 2013-03-21 | 日亜化学工業株式会社 | 半導体装置 |
| JP2009071013A (ja) * | 2007-09-13 | 2009-04-02 | Ngk Spark Plug Co Ltd | 発光素子実装用基板 |
| JP5224802B2 (ja) * | 2007-09-29 | 2013-07-03 | 京セラ株式会社 | 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法 |
| JP5340583B2 (ja) * | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
| US8129742B2 (en) * | 2008-03-25 | 2012-03-06 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and plated through-hole |
| JP5063555B2 (ja) * | 2008-10-17 | 2012-10-31 | 電気化学工業株式会社 | 発光素子搭載用基板 |
| JP5263515B2 (ja) * | 2008-10-20 | 2013-08-14 | 東芝ライテック株式会社 | 照明装置 |
| JP2010274256A (ja) * | 2009-01-29 | 2010-12-09 | Kyocera Corp | 光照射ヘッド、露光デバイス、画像形成装置、液滴硬化装置、および液滴硬化方法 |
| JP5305950B2 (ja) * | 2009-01-29 | 2013-10-02 | 京セラ株式会社 | 発光装置及びこれを用いた照明装置 |
| JP5539658B2 (ja) * | 2009-02-26 | 2014-07-02 | 日鉄住金エレクトロデバイス株式会社 | 反射材およびそれを用いた反射体および発光素子搭載用基板 |
| TWM362362U (en) * | 2009-03-06 | 2009-08-01 | Acpa Energy Conversion Devices Co Ltd | Heat conduction structure for heating element |
| JP2010238972A (ja) * | 2009-03-31 | 2010-10-21 | Toshiba Lighting & Technology Corp | 発光体および照明器具 |
| US8796706B2 (en) * | 2009-07-03 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| JP2011023620A (ja) * | 2009-07-17 | 2011-02-03 | Panasonic Corp | 配線基板 |
| US9039216B2 (en) * | 2010-04-01 | 2015-05-26 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
-
2012
- 2012-08-21 US US13/590,832 patent/US8773006B2/en active Active
- 2012-08-22 EP EP12181340.6A patent/EP2562832B1/en active Active
- 2012-08-22 JP JP2012183660A patent/JP2013046072A/ja active Pending
- 2012-08-22 CN CN201210302014.XA patent/CN103078033B/zh not_active Expired - Fee Related
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2017
- 2017-04-25 JP JP2017085863A patent/JP6312899B2/ja active Active