JP2012094842A5 - - Google Patents
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- Publication number
- JP2012094842A5 JP2012094842A5 JP2011208827A JP2011208827A JP2012094842A5 JP 2012094842 A5 JP2012094842 A5 JP 2012094842A5 JP 2011208827 A JP2011208827 A JP 2011208827A JP 2011208827 A JP2011208827 A JP 2011208827A JP 2012094842 A5 JP2012094842 A5 JP 2012094842A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting module
- module according
- cavity
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 11
- 150000004767 nitrides Chemical class 0.000 claims 7
- 239000000956 alloy Substances 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 3
- 239000010931 gold Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100105528A KR101172203B1 (ko) | 2010-10-27 | 2010-10-27 | 발광모듈 |
| KR10-2010-0105528 | 2010-10-27 | ||
| KR10-2010-0105529 | 2010-10-27 | ||
| KR10-2010-0105527 | 2010-10-27 | ||
| KR1020100105529A KR101154646B1 (ko) | 2010-10-27 | 2010-10-27 | 발광모듈 |
| KR1020100105527A KR101114774B1 (ko) | 2010-10-27 | 2010-10-27 | 발광모듈 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012094842A JP2012094842A (ja) | 2012-05-17 |
| JP2012094842A5 true JP2012094842A5 (enExample) | 2014-11-06 |
Family
ID=44719436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011208827A Pending JP2012094842A (ja) | 2010-10-27 | 2011-09-26 | 発光モジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9035326B2 (enExample) |
| EP (1) | EP2447595B1 (enExample) |
| JP (1) | JP2012094842A (enExample) |
| CN (1) | CN102456681B (enExample) |
Families Citing this family (47)
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| TW201123412A (en) * | 2009-12-30 | 2011-07-01 | Harvatek Corp | A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof |
| TW201123411A (en) * | 2009-12-30 | 2011-07-01 | Harvatek Corp | A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof |
| CN102563557B (zh) * | 2010-12-30 | 2016-08-17 | 欧司朗股份有限公司 | 用于灯条的封装方法 |
| US8878221B2 (en) * | 2011-08-19 | 2014-11-04 | Lg Innotex Co., Ltd. | Light emitting module |
| JP5914920B2 (ja) * | 2012-02-28 | 2016-05-11 | 東芝ライテック株式会社 | 発光モジュール、ランプ装置及び照明装置 |
| US9112119B2 (en) * | 2012-04-04 | 2015-08-18 | Axlen, Inc. | Optically efficient solid-state lighting device packaging |
| CN103378259A (zh) * | 2012-04-23 | 2013-10-30 | 欧司朗股份有限公司 | 电子模块和包括该电子模块的照明装置 |
| JP2015144147A (ja) * | 2012-05-11 | 2015-08-06 | シチズンホールディングス株式会社 | Ledモジュール |
| CN103517542A (zh) * | 2012-06-14 | 2014-01-15 | 欧司朗股份有限公司 | 电路板、具有该电路板的电子模块、照明装置和制造该电路板的方法 |
| US9308858B2 (en) * | 2012-07-13 | 2016-04-12 | Lg Innotek Co., Ltd. | Lamp unit and lighting system for vehicle |
| US10591124B2 (en) | 2012-08-30 | 2020-03-17 | Sabic Global Technologies B.V. | Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat |
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| KR20140076717A (ko) * | 2012-12-13 | 2014-06-23 | 서울반도체 주식회사 | 발광 다이오드 및 그것을 제조하는 방법 |
| KR20140096722A (ko) * | 2013-01-29 | 2014-08-06 | 엘지이노텍 주식회사 | 램프 유닛 |
| DE102013101262A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer |
| DE102013202904A1 (de) * | 2013-02-22 | 2014-08-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zu seiner Herstellung |
| JP6519123B2 (ja) | 2013-08-30 | 2019-05-29 | 日亜化学工業株式会社 | 発光素子搭載用基板及び該基板の固定方法 |
| US20150116958A1 (en) * | 2013-10-28 | 2015-04-30 | Apple Inc. | Circuit board modules having mechanical features |
| JP2015103666A (ja) * | 2013-11-25 | 2015-06-04 | セイコーエプソン株式会社 | 発光装置および画像表示装置 |
| JP6303949B2 (ja) * | 2013-11-29 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置及び照明器具 |
| US10051724B1 (en) | 2014-01-31 | 2018-08-14 | Apple Inc. | Structural ground reference for an electronic component of a computing device |
| TWI546987B (zh) * | 2014-02-25 | 2016-08-21 | 璨圓光電股份有限公司 | 發光裝置 |
| US9525222B2 (en) | 2014-04-11 | 2016-12-20 | Apple Inc. | Reducing or eliminating board-to-board connectors |
| CN103928590A (zh) * | 2014-04-25 | 2014-07-16 | 江苏洪昌科技股份有限公司 | 用于汽车前照灯led4×1芯片cob封装结构 |
| DE102014107909B4 (de) | 2014-06-05 | 2024-12-12 | Infineon Technologies Ag | Leiterplatten und Verfahren zu deren Herstellung |
| US9666967B2 (en) | 2014-07-28 | 2017-05-30 | Apple Inc. | Printed circuit board connector for non-planar configurations |
| JP6195119B2 (ja) * | 2014-09-03 | 2017-09-13 | 東芝ライテック株式会社 | 移動体用照明装置、および車両用灯具 |
| US9589940B2 (en) * | 2014-11-07 | 2017-03-07 | Nichia Corporation | Light emitting device |
| JP2016096322A (ja) * | 2014-11-07 | 2016-05-26 | 日亜化学工業株式会社 | 発光装置 |
| DE102015104956A1 (de) * | 2015-03-31 | 2016-10-06 | Infineon Technologies Ag | Gedruckte Leiterplatte mit einem Leiterrahmen mit eingefügten gehäusten Halbleiterchips |
| US10945664B1 (en) | 2015-09-30 | 2021-03-16 | Apple, Inc. | Protective case with coupling gasket for a wearable electronic device |
| US10054485B2 (en) | 2016-03-17 | 2018-08-21 | Raytheon Company | UV LED-phosphor based hyperspectral calibrator |
| JP6176352B2 (ja) * | 2016-03-25 | 2017-08-09 | 東芝ライテック株式会社 | ランプ装置及び照明装置 |
| DE102016210048A1 (de) * | 2016-06-08 | 2017-12-14 | Osram Gmbh | Lichtquellenanordnung für ein fahrzeug und beleuchtungseinrichtung für ein fahrzeug mit der lichtquellenanordnung |
| JP6519549B2 (ja) | 2016-08-02 | 2019-05-29 | 日亜化学工業株式会社 | 発光装置 |
| JP2018032501A (ja) * | 2016-08-23 | 2018-03-01 | パナソニックIpマネジメント株式会社 | 発光装置、及び、照明装置 |
| JP2018037171A (ja) * | 2016-08-29 | 2018-03-08 | パナソニックIpマネジメント株式会社 | 発光装置、及び、照明装置 |
| TWD186014S (zh) | 2016-09-29 | 2017-10-11 | 新世紀光電股份有限公司 | 發光二極體模組之部分 |
| TWD188042S (zh) | 2016-09-29 | 2018-01-21 | 新世紀光電股份有限公司 | 發光二極體封裝體之部分 |
| TWD188043S (zh) * | 2016-09-29 | 2018-01-21 | 新世紀光電股份有限公司 | 發光二極體封裝 |
| DE102016118990A1 (de) * | 2016-10-06 | 2018-04-12 | Osram Opto Semiconductors Gmbh | Sensor |
| CN108074498B (zh) * | 2017-12-27 | 2020-08-11 | 威创集团股份有限公司 | 显示模块、显示装置及制造方法 |
| EP3608959B1 (en) * | 2018-08-06 | 2023-11-15 | Nichia Corporation | Light emitting device and method for manufacturing same |
| JP7291383B2 (ja) * | 2019-05-27 | 2023-06-15 | アイリスオーヤマ株式会社 | Led照明装置 |
| DE102020102938A1 (de) * | 2020-02-05 | 2021-08-05 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Schaltungsträgerplatte und Verfahren zum Herstellen einer Schaltungsträgerplatte |
| US20240280485A1 (en) * | 2021-07-02 | 2024-08-22 | Hitachi High-Tech Corporation | Light source and automatic analyzer |
| JP7616570B2 (ja) * | 2021-09-17 | 2025-01-17 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
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| JP3459487B2 (ja) * | 1995-03-27 | 2003-10-20 | 三洋電機株式会社 | Led表示用基板及びled表示器 |
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| TWI245402B (en) * | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
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| JP2010199547A (ja) * | 2009-01-30 | 2010-09-09 | Nichia Corp | 発光装置及びその製造方法 |
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-
2011
- 2011-09-22 EP EP11182413.2A patent/EP2447595B1/en active Active
- 2011-09-23 US US13/242,915 patent/US9035326B2/en active Active
- 2011-09-26 JP JP2011208827A patent/JP2012094842A/ja active Pending
- 2011-09-29 CN CN201110305674.9A patent/CN102456681B/zh active Active
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