JP2006303400A5 - - Google Patents

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Publication number
JP2006303400A5
JP2006303400A5 JP2005155866A JP2005155866A JP2006303400A5 JP 2006303400 A5 JP2006303400 A5 JP 2006303400A5 JP 2005155866 A JP2005155866 A JP 2005155866A JP 2005155866 A JP2005155866 A JP 2005155866A JP 2006303400 A5 JP2006303400 A5 JP 2006303400A5
Authority
JP
Japan
Prior art keywords
electronic component
frame
metal
metal base
storage package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005155866A
Other languages
English (en)
Japanese (ja)
Other versions
JP4610414B2 (ja
JP2006303400A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005155866A priority Critical patent/JP4610414B2/ja
Priority claimed from JP2005155866A external-priority patent/JP4610414B2/ja
Priority to US11/378,859 priority patent/US7745914B2/en
Publication of JP2006303400A publication Critical patent/JP2006303400A/ja
Publication of JP2006303400A5 publication Critical patent/JP2006303400A5/ja
Application granted granted Critical
Publication of JP4610414B2 publication Critical patent/JP4610414B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005155866A 2005-03-22 2005-05-27 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造 Expired - Fee Related JP4610414B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005155866A JP4610414B2 (ja) 2005-03-22 2005-05-27 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造
US11/378,859 US7745914B2 (en) 2005-03-22 2006-03-17 Package for receiving electronic parts, and electronic device and mounting structure thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005081464 2005-03-22
JP2005155866A JP4610414B2 (ja) 2005-03-22 2005-05-27 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造

Publications (3)

Publication Number Publication Date
JP2006303400A JP2006303400A (ja) 2006-11-02
JP2006303400A5 true JP2006303400A5 (enExample) 2008-05-15
JP4610414B2 JP4610414B2 (ja) 2011-01-12

Family

ID=37393340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005155866A Expired - Fee Related JP4610414B2 (ja) 2005-03-22 2005-05-27 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造

Country Status (2)

Country Link
US (1) US7745914B2 (enExample)
JP (1) JP4610414B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5112101B2 (ja) * 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
JP4558012B2 (ja) * 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
US7838985B2 (en) * 2007-07-12 2010-11-23 Vishay General Semiconductor Llc Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
US7915728B2 (en) * 2007-07-12 2011-03-29 Vishay General Semiconductor Llc Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
JP2011114219A (ja) * 2009-11-27 2011-06-09 Kyocera Corp 素子搭載用部品、実装基体および電子装置
JP5500056B2 (ja) * 2010-12-06 2014-05-21 日本電気株式会社 赤外線センサパッケージおよび該赤外線センサパッケージを搭載した電子機器
KR101277202B1 (ko) * 2011-04-25 2013-06-20 주식회사 코스텍시스 메탈 베이스 및 그 제조 방법과 이를 이용한 소자 패키지
EP2560203A1 (en) * 2011-08-17 2013-02-20 ABB Technology AG Power semiconductor arrangement
CN102403419B (zh) * 2011-11-09 2013-08-21 东莞勤上光电股份有限公司 一种大功率led散热结构的制作工艺
KR101973395B1 (ko) * 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
JP6193784B2 (ja) * 2014-02-26 2017-09-06 京セラ株式会社 撮像素子実装用基板及び撮像装置
US9596751B2 (en) 2014-04-23 2017-03-14 Kyocera Corporation Substrate for mounting electronic element and electronic device
CN106233456B (zh) 2014-04-23 2019-01-01 京瓷株式会社 电子元件安装用基板以及电子装置
EP3196940B1 (en) 2014-09-19 2019-07-10 KYOCERA Corporation Substrate for mounting electronic element, and electronic device
US9559026B2 (en) * 2015-02-26 2017-01-31 Infineon Technologies Americas Corp. Semiconductor package having a multi-layered base
US10910326B2 (en) 2016-11-17 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
WO2019006101A1 (en) * 2017-06-30 2019-01-03 Kyocera International, Inc. MICROELECTRONIC BUILDING CONSTRUCTION ACTIVATED BY REINFORCING AND DESIGNING CERAMIC INSULATION
JP7019021B2 (ja) * 2018-02-27 2022-02-14 京セラ株式会社 半導体パッケージ、半導体装置および半導体パッケージの製造方法
US12119281B2 (en) * 2020-08-04 2024-10-15 Qorvo Us, Inc. Hermetic package for high CTE mismatch
US11929310B2 (en) 2021-12-09 2024-03-12 Nxp Usa, Inc. Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662991B2 (ja) * 1988-07-29 1997-10-15 イビデン株式会社 混成集積回路パッケージ
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
JPH04348062A (ja) 1991-01-09 1992-12-03 Sumitomo Electric Ind Ltd 半導体搭載用放熱基板の製造法と該基板を用いた半導体用パッケージ
JPH04284655A (ja) * 1991-03-13 1992-10-09 Hitachi Ltd 半導体集積回路装置
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
JPH06334074A (ja) 1993-05-20 1994-12-02 Hitachi Metals Ltd 半導体装置用基板
JPH07302866A (ja) * 1994-04-28 1995-11-14 Nippon Steel Corp 半導体装置および該装置用ヒートスプレッダー
JP3250187B2 (ja) * 1994-07-15 2002-01-28 三菱マテリアル株式会社 高放熱性セラミックパッケージ
JP2765621B2 (ja) * 1995-07-31 1998-06-18 日本電気株式会社 半導体装置用パッケージ
KR0163871B1 (ko) * 1995-11-25 1998-12-01 김광호 하부에 히트 싱크가 부착된 솔더 볼 어레이 패키지
US6921971B2 (en) * 2003-01-15 2005-07-26 Kyocera Corporation Heat releasing member, package for accommodating semiconductor element and semiconductor device
JP2004247514A (ja) * 2003-02-13 2004-09-02 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
US7235422B2 (en) * 2005-02-02 2007-06-26 Agere Systems Inc. Device packages

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