JP2007514320A5 - - Google Patents

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Publication number
JP2007514320A5
JP2007514320A5 JP2006544014A JP2006544014A JP2007514320A5 JP 2007514320 A5 JP2007514320 A5 JP 2007514320A5 JP 2006544014 A JP2006544014 A JP 2006544014A JP 2006544014 A JP2006544014 A JP 2006544014A JP 2007514320 A5 JP2007514320 A5 JP 2007514320A5
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JP
Japan
Prior art keywords
chip carrier
light emitting
chip
lead frame
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006544014A
Other languages
English (en)
Japanese (ja)
Other versions
JP5349755B2 (ja
JP2007514320A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/041392 external-priority patent/WO2005057672A2/en
Publication of JP2007514320A publication Critical patent/JP2007514320A/ja
Publication of JP2007514320A5 publication Critical patent/JP2007514320A5/ja
Application granted granted Critical
Publication of JP5349755B2 publication Critical patent/JP5349755B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006544014A 2003-12-09 2004-12-09 表面実装の発光チップパッケージ Expired - Fee Related JP5349755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52796903P 2003-12-09 2003-12-09
US60/527,969 2003-12-09
PCT/US2004/041392 WO2005057672A2 (en) 2003-12-09 2004-12-09 Surface mount light emitting chip package

Publications (3)

Publication Number Publication Date
JP2007514320A JP2007514320A (ja) 2007-05-31
JP2007514320A5 true JP2007514320A5 (enExample) 2008-02-07
JP5349755B2 JP5349755B2 (ja) 2013-11-20

Family

ID=34676803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006544014A Expired - Fee Related JP5349755B2 (ja) 2003-12-09 2004-12-09 表面実装の発光チップパッケージ

Country Status (6)

Country Link
US (1) US20080035947A1 (enExample)
EP (1) EP1700350A2 (enExample)
JP (1) JP5349755B2 (enExample)
KR (1) KR101311635B1 (enExample)
CN (1) CN1961431A (enExample)
WO (1) WO2005057672A2 (enExample)

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US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
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US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
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US10663142B2 (en) 2014-03-31 2020-05-26 Bridgelux Inc. Light-emitting device with reflective ceramic substrate
KR102189129B1 (ko) * 2014-06-02 2020-12-09 엘지이노텍 주식회사 발광 소자 모듈
JP2014225022A (ja) * 2014-06-18 2014-12-04 株式会社東芝 照明装置、撮像装置及び携帯端末
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JP3877642B2 (ja) * 2002-05-21 2007-02-07 ローム株式会社 半導体チップを使用した半導体装置

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