CN1961431A - 表面安装型发光芯片封装件 - Google Patents

表面安装型发光芯片封装件 Download PDF

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Publication number
CN1961431A
CN1961431A CNA2004800409569A CN200480040956A CN1961431A CN 1961431 A CN1961431 A CN 1961431A CN A2004800409569 A CNA2004800409569 A CN A2004800409569A CN 200480040956 A CN200480040956 A CN 200480040956A CN 1961431 A CN1961431 A CN 1961431A
Authority
CN
China
Prior art keywords
light emitting
chip
chip carrier
package
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800409569A
Other languages
English (en)
Chinese (zh)
Inventor
小斯坦特恩·厄尔·韦弗
邢陈震崙
鲍里斯·科洛丁
托马斯·埃利奥特·斯特克
詹姆斯·雷吉内利
德博拉·安·海特科
高翔
伊万·埃利亚舍维奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Gelcore LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gelcore LLC filed Critical Gelcore LLC
Publication of CN1961431A publication Critical patent/CN1961431A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Led Device Packages (AREA)
CNA2004800409569A 2003-12-09 2004-12-09 表面安装型发光芯片封装件 Pending CN1961431A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52796903P 2003-12-09 2003-12-09
US60/527,969 2003-12-09

Publications (1)

Publication Number Publication Date
CN1961431A true CN1961431A (zh) 2007-05-09

Family

ID=34676803

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800409569A Pending CN1961431A (zh) 2003-12-09 2004-12-09 表面安装型发光芯片封装件

Country Status (6)

Country Link
US (1) US20080035947A1 (enExample)
EP (1) EP1700350A2 (enExample)
JP (1) JP5349755B2 (enExample)
KR (1) KR101311635B1 (enExample)
CN (1) CN1961431A (enExample)
WO (1) WO2005057672A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103189980A (zh) * 2010-09-20 2013-07-03 克里公司 多芯片led器件
CN103307483A (zh) * 2013-06-03 2013-09-18 杭州杭科光电股份有限公司 基于印刷电路板的led光源模组
CN114108161A (zh) * 2020-04-27 2022-03-01 苹果公司 织物安装部件

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103189980A (zh) * 2010-09-20 2013-07-03 克里公司 多芯片led器件
CN103307483A (zh) * 2013-06-03 2013-09-18 杭州杭科光电股份有限公司 基于印刷电路板的led光源模组
CN114108161A (zh) * 2020-04-27 2022-03-01 苹果公司 织物安装部件
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Also Published As

Publication number Publication date
KR101311635B1 (ko) 2013-09-26
JP2007514320A (ja) 2007-05-31
EP1700350A2 (en) 2006-09-13
US20080035947A1 (en) 2008-02-14
KR20060134969A (ko) 2006-12-28
WO2005057672A2 (en) 2005-06-23
JP5349755B2 (ja) 2013-11-20
WO2005057672A3 (en) 2006-04-06

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication