KR101311635B1 - 표면 장착 발광 칩 패키지 - Google Patents

표면 장착 발광 칩 패키지 Download PDF

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Publication number
KR101311635B1
KR101311635B1 KR1020067013794A KR20067013794A KR101311635B1 KR 101311635 B1 KR101311635 B1 KR 101311635B1 KR 1020067013794 A KR1020067013794 A KR 1020067013794A KR 20067013794 A KR20067013794 A KR 20067013794A KR 101311635 B1 KR101311635 B1 KR 101311635B1
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South Korea
Prior art keywords
light emitting
major surface
chip
chip carrier
lead frame
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Expired - Fee Related
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KR1020067013794A
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English (en)
Korean (ko)
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KR20060134969A (ko
Inventor
스탠톤 얼 제이알. 위버
첸룬 흐싱 첸
보리스 코로딘
토마스 엘리어트 스테쳐
제임스 레지넬리
데보라 안 하이트코
씨앙 가오
이반 엘리아쉬비치
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젤코어 엘엘씨
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Publication of KR101311635B1 publication Critical patent/KR101311635B1/ko
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Led Device Packages (AREA)
KR1020067013794A 2003-12-09 2004-12-09 표면 장착 발광 칩 패키지 Expired - Fee Related KR101311635B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52796903P 2003-12-09 2003-12-09
US60/527,969 2003-12-09
PCT/US2004/041392 WO2005057672A2 (en) 2003-12-09 2004-12-09 Surface mount light emitting chip package

Publications (2)

Publication Number Publication Date
KR20060134969A KR20060134969A (ko) 2006-12-28
KR101311635B1 true KR101311635B1 (ko) 2013-09-26

Family

ID=34676803

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067013794A Expired - Fee Related KR101311635B1 (ko) 2003-12-09 2004-12-09 표면 장착 발광 칩 패키지

Country Status (6)

Country Link
US (1) US20080035947A1 (enExample)
EP (1) EP1700350A2 (enExample)
JP (1) JP5349755B2 (enExample)
KR (1) KR101311635B1 (enExample)
CN (1) CN1961431A (enExample)
WO (1) WO2005057672A2 (enExample)

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DE102006000476A1 (de) * 2005-09-22 2007-05-24 Lexedis Lighting Gesmbh Lichtemissionsvorrichtung
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US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
TWI390703B (zh) * 2010-01-28 2013-03-21 榮創能源科技股份有限公司 正向發光之發光二極體封裝結構及製程
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9053958B2 (en) * 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
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US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
CN103307483A (zh) * 2013-06-03 2013-09-18 杭州杭科光电股份有限公司 基于印刷电路板的led光源模组
US10663142B2 (en) * 2014-03-31 2020-05-26 Bridgelux Inc. Light-emitting device with reflective ceramic substrate
KR102189129B1 (ko) * 2014-06-02 2020-12-09 엘지이노텍 주식회사 발광 소자 모듈
JP2014225022A (ja) * 2014-06-18 2014-12-04 株式会社東芝 照明装置、撮像装置及び携帯端末
DE102016100320A1 (de) 2016-01-11 2017-07-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP6704175B2 (ja) * 2016-01-27 2020-06-03 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール及びそれを用いた照明器具
KR102608419B1 (ko) 2016-07-12 2023-12-01 삼성디스플레이 주식회사 표시장치 및 표시장치의 제조방법
US11576262B2 (en) 2020-04-27 2023-02-07 Apple Inc. Fabric-mounted components
KR20250056631A (ko) * 2023-10-19 2025-04-28 엘지이노텍 주식회사 조명 장치
KR20250087359A (ko) * 2023-12-07 2025-06-16 엘지이노텍 주식회사 조명 장치

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JP2003332634A (ja) * 2002-03-06 2003-11-21 Nichia Chem Ind Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP2007514320A (ja) 2007-05-31
EP1700350A2 (en) 2006-09-13
US20080035947A1 (en) 2008-02-14
KR20060134969A (ko) 2006-12-28
WO2005057672A2 (en) 2005-06-23
JP5349755B2 (ja) 2013-11-20
CN1961431A (zh) 2007-05-09
WO2005057672A3 (en) 2006-04-06

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