JP5349755B2 - 表面実装の発光チップパッケージ - Google Patents

表面実装の発光チップパッケージ Download PDF

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Publication number
JP5349755B2
JP5349755B2 JP2006544014A JP2006544014A JP5349755B2 JP 5349755 B2 JP5349755 B2 JP 5349755B2 JP 2006544014 A JP2006544014 A JP 2006544014A JP 2006544014 A JP2006544014 A JP 2006544014A JP 5349755 B2 JP5349755 B2 JP 5349755B2
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JP
Japan
Prior art keywords
light emitting
chip
lead frame
chip carrier
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006544014A
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English (en)
Japanese (ja)
Other versions
JP2007514320A (ja
JP2007514320A5 (enExample
Inventor
スタントン アール ジュニア ウィーヴァー
チェン リュン シン チェン
ボリス コロディン
トーマス エリオット ステッチャー
ジェイムズ レジネリ
デボラ アン ハイトコ
シアン ガオ
イヴァン イリアシェヴィッチ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Lumination LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumination LLC filed Critical Lumination LLC
Publication of JP2007514320A publication Critical patent/JP2007514320A/ja
Publication of JP2007514320A5 publication Critical patent/JP2007514320A5/ja
Application granted granted Critical
Publication of JP5349755B2 publication Critical patent/JP5349755B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
JP2006544014A 2003-12-09 2004-12-09 表面実装の発光チップパッケージ Expired - Fee Related JP5349755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52796903P 2003-12-09 2003-12-09
US60/527,969 2003-12-09
PCT/US2004/041392 WO2005057672A2 (en) 2003-12-09 2004-12-09 Surface mount light emitting chip package

Publications (3)

Publication Number Publication Date
JP2007514320A JP2007514320A (ja) 2007-05-31
JP2007514320A5 JP2007514320A5 (enExample) 2008-02-07
JP5349755B2 true JP5349755B2 (ja) 2013-11-20

Family

ID=34676803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006544014A Expired - Fee Related JP5349755B2 (ja) 2003-12-09 2004-12-09 表面実装の発光チップパッケージ

Country Status (6)

Country Link
US (1) US20080035947A1 (enExample)
EP (1) EP1700350A2 (enExample)
JP (1) JP5349755B2 (enExample)
KR (1) KR101311635B1 (enExample)
CN (1) CN1961431A (enExample)
WO (1) WO2005057672A2 (enExample)

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CN103307483A (zh) * 2013-06-03 2013-09-18 杭州杭科光电股份有限公司 基于印刷电路板的led光源模组
US10663142B2 (en) * 2014-03-31 2020-05-26 Bridgelux Inc. Light-emitting device with reflective ceramic substrate
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Also Published As

Publication number Publication date
KR101311635B1 (ko) 2013-09-26
JP2007514320A (ja) 2007-05-31
EP1700350A2 (en) 2006-09-13
US20080035947A1 (en) 2008-02-14
KR20060134969A (ko) 2006-12-28
WO2005057672A2 (en) 2005-06-23
CN1961431A (zh) 2007-05-09
WO2005057672A3 (en) 2006-04-06

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