JP2005117041A5 - - Google Patents
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- Publication number
- JP2005117041A5 JP2005117041A5 JP2004291171A JP2004291171A JP2005117041A5 JP 2005117041 A5 JP2005117041 A5 JP 2005117041A5 JP 2004291171 A JP2004291171 A JP 2004291171A JP 2004291171 A JP2004291171 A JP 2004291171A JP 2005117041 A5 JP2005117041 A5 JP 2005117041A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- element according
- trace
- top surface
- thermal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002470 thermal conductor Substances 0.000 claims 11
- 239000004020 conductor Substances 0.000 claims 8
- 238000005538 encapsulation Methods 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/683,489 US20050077616A1 (en) | 2003-10-09 | 2003-10-09 | High power light emitting diode device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005117041A JP2005117041A (ja) | 2005-04-28 |
| JP2005117041A5 true JP2005117041A5 (enExample) | 2007-07-12 |
Family
ID=33160036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004291171A Pending JP2005117041A (ja) | 2003-10-09 | 2004-10-04 | 高出力発光ダイオードデバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20050077616A1 (enExample) |
| JP (1) | JP2005117041A (enExample) |
| DE (1) | DE102004044149B4 (enExample) |
| GB (1) | GB2406969B (enExample) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7397067B2 (en) * | 2003-12-31 | 2008-07-08 | Intel Corporation | Microdisplay packaging system |
| JP4632427B2 (ja) * | 2004-03-31 | 2011-02-16 | シーアイ化成株式会社 | 発光ダイオード組立体の組立方法および発光ダイオード組立体 |
| JP4632426B2 (ja) * | 2004-03-31 | 2011-02-16 | シーアイ化成株式会社 | 発光ダイオード組立体の組立方法および発光ダイオード組立体 |
| TWM271255U (en) * | 2004-10-08 | 2005-07-21 | Bright Led Electronics Corp | High-power surface-mounted light-emitting diode with high heat dissipation property |
| US7262438B2 (en) | 2005-03-08 | 2007-08-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED mounting having increased heat dissipation |
| KR100593937B1 (ko) * | 2005-03-30 | 2006-06-30 | 삼성전기주식회사 | Si기판을 이용한 LED 패키지 및 그 제조방법 |
| CA2616007C (en) * | 2005-05-20 | 2018-02-27 | Tir Technology Lp | Light-emitting module |
| KR101017917B1 (ko) * | 2005-06-07 | 2011-03-04 | 가부시키가이샤후지쿠라 | 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기 |
| KR100592508B1 (ko) * | 2005-07-15 | 2006-06-26 | 한국광기술원 | 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지 |
| JP5155539B2 (ja) * | 2005-09-20 | 2013-03-06 | パナソニック株式会社 | 発光装置 |
| JP5155540B2 (ja) * | 2005-09-20 | 2013-03-06 | パナソニック株式会社 | 発光装置 |
| US20080099777A1 (en) * | 2005-10-19 | 2008-05-01 | Luminus Devices, Inc. | Light-emitting devices and related systems |
| CN101346584B (zh) * | 2005-12-22 | 2012-03-28 | 松下电工株式会社 | 具有led的照明器具 |
| KR101210090B1 (ko) * | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
| US20070247852A1 (en) * | 2006-04-21 | 2007-10-25 | Xiaoping Wang | Multi chip LED lamp |
| TWI306674B (en) * | 2006-04-28 | 2009-02-21 | Delta Electronics Inc | Light emitting apparatus |
| CN101449391B (zh) | 2006-05-30 | 2011-02-23 | 株式会社藤仓 | 发光元件安装用基板、光源、照明装置、显示装置、交通信号机及发光元件安装用基板的制造方法 |
| US20080068807A1 (en) * | 2006-09-20 | 2008-03-20 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat-dissipating device for back light source for flat panel display |
| US7686469B2 (en) * | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
| US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
| US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
| US7952262B2 (en) * | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
| US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
| JP4238907B2 (ja) | 2006-10-18 | 2009-03-18 | セイコーエプソン株式会社 | インクジェット記録装置 |
| EP1914470B1 (en) * | 2006-10-20 | 2016-05-18 | OSRAM GmbH | Semiconductor lamp |
| TW200904316A (en) * | 2007-07-13 | 2009-01-16 | Kai-Yu Lin | Heat-dissipation structure of luminous device |
| JP5149601B2 (ja) * | 2007-11-27 | 2013-02-20 | パナソニック株式会社 | 発光装置 |
| CN101465395A (zh) * | 2007-12-21 | 2009-06-24 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管 |
| JP5416975B2 (ja) | 2008-03-11 | 2014-02-12 | ローム株式会社 | 半導体発光装置 |
| US7923746B2 (en) * | 2008-03-12 | 2011-04-12 | Industrial Technology Research Institute | Light emitting diode package structure and method for fabricating the same |
| CN101539282B (zh) * | 2008-03-19 | 2011-06-29 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
| JP2009239036A (ja) * | 2008-03-27 | 2009-10-15 | Hitachi Aic Inc | Led基板 |
| BRPI0917311A2 (pt) * | 2008-08-18 | 2015-11-17 | Gillette Co | dispositivo combinado para barbeamento e aparamento |
| DE102008039364A1 (de) * | 2008-08-22 | 2010-03-04 | Osram Gesellschaft mit beschränkter Haftung | Halbleiter-Leuchtvorrichtung |
| CA2683703A1 (en) * | 2008-10-28 | 2010-04-28 | Abl Ip Holding, Llc | Light emitting diode luminaires and applications thereof |
| JP2010130001A (ja) * | 2008-12-01 | 2010-06-10 | Kuei-Fang Chen | 放熱台 |
| WO2010110572A2 (ko) * | 2009-03-24 | 2010-09-30 | Kim Kang | 발광다이오드 패키지 |
| US20100305448A1 (en) * | 2009-05-26 | 2010-12-02 | Anne Cecile Dagonneau | Apparatus and method for indicating ultrasound probe orientation and activation status |
| CN102032475A (zh) * | 2009-08-23 | 2011-04-27 | 彭云滔 | 一种组合式大功率led灯 |
| US8602593B2 (en) * | 2009-10-15 | 2013-12-10 | Cree, Inc. | Lamp assemblies and methods of making the same |
| US8089086B2 (en) * | 2009-10-19 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source |
| JP5645392B2 (ja) * | 2009-11-30 | 2014-12-24 | 京セラ株式会社 | 光電変換装置用部品および光電変換装置 |
| US8399267B2 (en) * | 2009-12-26 | 2013-03-19 | Achrolux Inc | Methods for packaging light emitting devices and related microelectronic devices |
| KR101677105B1 (ko) * | 2010-08-30 | 2016-11-17 | 삼성디스플레이 주식회사 | 전자 부품 및 그 제조 방법 |
| US8354684B2 (en) | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
| US8652860B2 (en) | 2011-01-09 | 2014-02-18 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
| CN102683507A (zh) * | 2011-03-09 | 2012-09-19 | 神基科技股份有限公司 | 光源模块构造及其制造方法 |
| CN102691921A (zh) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | 发光二极管灯条及其制造方法 |
| EP2810308B1 (en) * | 2012-02-02 | 2021-06-23 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
| US9538582B2 (en) | 2012-07-26 | 2017-01-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage control in the packaging of integrated circuits |
| TWI571598B (zh) * | 2015-01-15 | 2017-02-21 | 旭德科技股份有限公司 | 照明裝置 |
| US9865528B2 (en) * | 2015-12-11 | 2018-01-09 | Ubotic Company Limited | High power and high frequency plastic pre-molded cavity package |
| JP6709802B2 (ja) * | 2015-12-15 | 2020-06-17 | 株式会社小糸製作所 | 車両用灯具 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155752A (en) | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Resin sealed semiconductor device |
| US5616958A (en) * | 1995-01-25 | 1997-04-01 | International Business Machines Corporation | Electronic package |
| US6011299A (en) * | 1996-07-24 | 2000-01-04 | Digital Equipment Corporation | Apparatus to minimize integrated circuit heatsink E.M.I. radiation |
| EP0926729A3 (en) * | 1997-12-10 | 1999-12-08 | Mitsubishi Gas Chemical Company, Inc. | Semiconductor plastic package and process for the production thereof |
| JPH11298048A (ja) * | 1998-04-15 | 1999-10-29 | Matsushita Electric Works Ltd | Led実装基板 |
| US5910686A (en) * | 1998-07-23 | 1999-06-08 | Vlsi Technology, Inc. | Cavity down HBGA package structure |
| JP4432275B2 (ja) * | 2000-07-13 | 2010-03-17 | パナソニック電工株式会社 | 光源装置 |
| JP3930710B2 (ja) * | 2000-09-13 | 2007-06-13 | シチズン電子株式会社 | チップ型発光ダイオード及びその製造方法 |
| CN1212676C (zh) * | 2001-04-12 | 2005-07-27 | 松下电工株式会社 | 使用led的光源装置及其制造方法 |
| US6537857B2 (en) * | 2001-05-07 | 2003-03-25 | St Assembly Test Service Ltd. | Enhanced BGA grounded heatsink |
| JP2003008154A (ja) * | 2001-06-21 | 2003-01-10 | Nec Corp | 印刷配線板、同軸ケーブル及び電子装置 |
| JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
| US20050073846A1 (en) * | 2001-09-27 | 2005-04-07 | Kenji Takine | Lightemitting device and method of manufacturing the same |
| US6501103B1 (en) * | 2001-10-23 | 2002-12-31 | Lite-On Electronics, Inc. | Light emitting diode assembly with low thermal resistance |
| US7078803B2 (en) * | 2002-09-27 | 2006-07-18 | Isothermal Systems Research, Inc. | Integrated circuit heat dissipation system |
| US20040136163A1 (en) * | 2003-01-14 | 2004-07-15 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink device having light-emitting components |
| US6864513B2 (en) * | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
-
2003
- 2003-10-09 US US10/683,489 patent/US20050077616A1/en not_active Abandoned
-
2004
- 2004-09-03 GB GB0419641A patent/GB2406969B/en not_active Expired - Fee Related
- 2004-09-13 DE DE102004044149A patent/DE102004044149B4/de not_active Expired - Fee Related
- 2004-10-04 JP JP2004291171A patent/JP2005117041A/ja active Pending
-
2006
- 2006-02-20 US US11/358,477 patent/US7612386B2/en not_active Expired - Fee Related
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