JP5149601B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5149601B2 JP5149601B2 JP2007306621A JP2007306621A JP5149601B2 JP 5149601 B2 JP5149601 B2 JP 5149601B2 JP 2007306621 A JP2007306621 A JP 2007306621A JP 2007306621 A JP2007306621 A JP 2007306621A JP 5149601 B2 JP5149601 B2 JP 5149601B2
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- JP
- Japan
- Prior art keywords
- light
- led chip
- color conversion
- emitting device
- conversion member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Description
以下、本実施形態の発光装置について図1〜図6を参照しながら説明する。
本実施形態の発光装置1の基本構成は実施形態1と略同じであり、図8に示すように、実装基板20が、セラミック基板(例えば、アルミナ基板、窒化アルミニウム基板などの電気絶縁性を有し且つ熱伝導率の高いセラミック基板)からなる絶縁性基板20aを用いて形成されている(要するに、実装基板20が熱伝導性材料により形成されている)点などが相違する。なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。
10 LEDチップ
14 ボンディングワイヤ
20 実装基板
21 伝熱板
22 配線基板
23 導体パターン
23b 外部接続用電極部
30 サブマウント部材
50 封止部
60 光学部材
70 色変換部材
70a 光入射面
70b 光出射面
72 蛍光体粒子
73 光拡散材
80 空気層
Claims (4)
- LEDチップと、当該LEDチップが実装された実装基板と、LEDチップから放射される光によって励起されてLEDチップよりも長波長の可視光を放射する蛍光体粒子が透光性材料からなる母材に分散されてなり実装基板との間にLEDチップを囲む形で配設されたドーム状の色変換部材とを備え、色変換部材は、前記母材とは屈折率の異なる光拡散材を当該色変換部材における光入射面側に偏倚させ光入射面の全域に亘って設けてあり、光拡散材は、金属ナノ粒子からなることを特徴とする発光装置。
- 前記母材は、ガラスであることを特徴とする請求項1記載の発光装置。
- 前記実装基板は、熱伝導性材料により形成されてなることを特徴とする請求項1または請求項2記載の発光装置。
- 前記色変換部材よりも内側で前記実装基板との間に前記LEDチップを囲む形で配設されたドーム状の光学部材と、光学部材の内側で前記LEDチップを封止した封止部とを備え、前記色変換部材と光学部材との間に空気層が形成されてなることを特徴とする請求項1ないし請求項3のいずれか1項に記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007306621A JP5149601B2 (ja) | 2007-11-27 | 2007-11-27 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007306621A JP5149601B2 (ja) | 2007-11-27 | 2007-11-27 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009130299A JP2009130299A (ja) | 2009-06-11 |
JP5149601B2 true JP5149601B2 (ja) | 2013-02-20 |
Family
ID=40820875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007306621A Active JP5149601B2 (ja) | 2007-11-27 | 2007-11-27 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5149601B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102679508B (zh) * | 2011-03-17 | 2015-02-25 | 阿自倍尔株式会社 | 建筑物设备运作状态评价方法以及装置 |
US9966506B2 (en) | 2014-10-09 | 2018-05-08 | Sharp Kabushiki Kaisha | Light-emission device |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101650001B (zh) * | 2008-08-11 | 2011-04-06 | 韩建华 | 一种球面封装的led |
EP2402414B1 (en) * | 2009-06-26 | 2013-11-27 | Ocean's King Lighting Science&Technology Co., Ltd. | Luminescent glass element, manufacturing method and luminescence method thereof |
WO2010148569A1 (zh) * | 2009-06-26 | 2010-12-29 | 海洋王照明科技股份有限公司 | 发光玻璃元件、其制造方法及其发光方法 |
WO2010148567A1 (zh) * | 2009-06-26 | 2010-12-29 | 海洋王照明科技股份有限公司 | 发光玻璃元件、其制造方法及其发光方法 |
JP5619034B2 (ja) * | 2009-06-26 | 2014-11-05 | ▲海▼洋王照明科技股▲ふん▼有限公司 | 発光ガラス素子、その製造方法及びその発光方法 |
JP5619036B2 (ja) * | 2009-06-26 | 2014-11-05 | ▲海▼洋王照明科技股▲ふん▼有限公司 | 発光ガラス素子、その製造方法及びその発光方法 |
JP5599885B2 (ja) * | 2009-08-26 | 2014-10-01 | 海洋王照明科技股▲ふん▼有限公司 | 発光素子、それらの製造方法および発光方法 |
EP2471757B1 (en) * | 2009-08-26 | 2014-03-19 | Ocean's King Lighting Science&Technology Co., Ltd. | Luminescent element, producing method thereof and luminescence method using the same |
JP5548279B2 (ja) * | 2010-03-19 | 2014-07-16 | ▲海▼洋王照明科技股▲ふん▼有限公司 | ガラス基材発光素子、その製造方法、並びにその発光方法 |
JP2011249737A (ja) * | 2010-04-26 | 2011-12-08 | Panasonic Electric Works Co Ltd | リードフレーム、配線板およびそれを用いたledユニット |
US8967827B2 (en) | 2010-04-26 | 2015-03-03 | Panasonic Intellectual Property Management Co., Ltd. | Lead frame, wiring board, light emitting unit, and illuminating apparatus |
CN102315371A (zh) | 2010-07-05 | 2012-01-11 | 松下电工株式会社 | 发光装置 |
JP2012015466A (ja) * | 2010-07-05 | 2012-01-19 | Panasonic Electric Works Co Ltd | 発光装置 |
JP5733743B2 (ja) | 2010-12-15 | 2015-06-10 | 日東電工株式会社 | 光半導体装置 |
JP5049382B2 (ja) * | 2010-12-21 | 2012-10-17 | パナソニック株式会社 | 発光装置及びそれを用いた照明装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4680334B2 (ja) * | 1999-01-13 | 2011-05-11 | 株式会社朝日ラバー | 発光装置 |
JP2001060724A (ja) * | 1999-08-20 | 2001-03-06 | Stanley Electric Co Ltd | 拡散発光素子およびその製造方法 |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
JP4254276B2 (ja) * | 2003-03-03 | 2009-04-15 | 豊田合成株式会社 | 発光装置およびその製造方法 |
US20050077616A1 (en) * | 2003-10-09 | 2005-04-14 | Ng Kee Yean | High power light emitting diode device |
JP2006310568A (ja) * | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | 発光装置 |
TWI256737B (en) * | 2005-05-19 | 2006-06-11 | Pi-Fu Yang | One-block light-emitting device and manufacturing method thereof |
JP5357379B2 (ja) * | 2006-02-23 | 2013-12-04 | パナソニック株式会社 | 発光装置 |
JP2007243054A (ja) * | 2006-03-10 | 2007-09-20 | Matsushita Electric Works Ltd | 発光装置 |
JP2007250817A (ja) * | 2006-03-16 | 2007-09-27 | Stanley Electric Co Ltd | Led |
-
2007
- 2007-11-27 JP JP2007306621A patent/JP5149601B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102679508B (zh) * | 2011-03-17 | 2015-02-25 | 阿自倍尔株式会社 | 建筑物设备运作状态评价方法以及装置 |
US9966506B2 (en) | 2014-10-09 | 2018-05-08 | Sharp Kabushiki Kaisha | Light-emission device |
Also Published As
Publication number | Publication date |
---|---|
JP2009130299A (ja) | 2009-06-11 |
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