JP2009117819A5 - - Google Patents
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- Publication number
- JP2009117819A5 JP2009117819A5 JP2008267102A JP2008267102A JP2009117819A5 JP 2009117819 A5 JP2009117819 A5 JP 2009117819A5 JP 2008267102 A JP2008267102 A JP 2008267102A JP 2008267102 A JP2008267102 A JP 2008267102A JP 2009117819 A5 JP2009117819 A5 JP 2009117819A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting region
- lead
- circuit substrate
- element mounting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 23
- 239000000758 substrate Substances 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008267102A JP4970401B2 (ja) | 2007-10-16 | 2008-10-16 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007268775 | 2007-10-16 | ||
| JP2007268775 | 2007-10-16 | ||
| JP2008267102A JP4970401B2 (ja) | 2007-10-16 | 2008-10-16 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011136497A Division JP4970610B2 (ja) | 2007-10-16 | 2011-06-20 | 半導体装置の製造方法とリードフレーム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009117819A JP2009117819A (ja) | 2009-05-28 |
| JP2009117819A5 true JP2009117819A5 (enExample) | 2011-02-03 |
| JP4970401B2 JP4970401B2 (ja) | 2012-07-04 |
Family
ID=40533376
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008267102A Active JP4970401B2 (ja) | 2007-10-16 | 2008-10-16 | 半導体装置 |
| JP2011136497A Active JP4970610B2 (ja) | 2007-10-16 | 2011-06-20 | 半導体装置の製造方法とリードフレーム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011136497A Active JP4970610B2 (ja) | 2007-10-16 | 2011-06-20 | 半導体装置の製造方法とリードフレーム |
Country Status (2)
| Country | Link |
|---|---|
| US (7) | US20090096073A1 (enExample) |
| JP (2) | JP4970401B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090096073A1 (en) | 2007-10-16 | 2009-04-16 | Kabushiki Kaisha Toshiba | Semiconductor device and lead frame used for the same |
| US8004071B2 (en) | 2007-12-27 | 2011-08-23 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| JP5275019B2 (ja) * | 2008-12-26 | 2013-08-28 | 株式会社東芝 | 半導体装置 |
| JP5361426B2 (ja) | 2009-02-05 | 2013-12-04 | 株式会社東芝 | 半導体デバイス |
| KR101685057B1 (ko) * | 2010-01-22 | 2016-12-09 | 삼성전자주식회사 | 반도체 소자의 적층 패키지 |
| JP5032623B2 (ja) * | 2010-03-26 | 2012-09-26 | 株式会社東芝 | 半導体記憶装置 |
| JP5924313B2 (ja) | 2012-08-06 | 2016-05-25 | 株式会社デンソー | ダイオード |
| JP6680274B2 (ja) * | 2017-06-27 | 2020-04-15 | 日亜化学工業株式会社 | 発光装置及び樹脂付リードフレーム |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| US4102209A (en) * | 1977-06-17 | 1978-07-25 | United Technologies Corporation | Temperature compensated vibrating cylinder pressure transducer |
| JP2862557B2 (ja) * | 1989-03-20 | 1999-03-03 | 宮崎沖電気株式会社 | 半導体装置 |
| JPH082537B2 (ja) | 1989-08-25 | 1996-01-17 | トリニティ工業株式会社 | 熱処理装置 |
| JPH03136267A (ja) * | 1989-10-20 | 1991-06-11 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
| JPH083929Y2 (ja) * | 1989-12-14 | 1996-01-31 | 株式会社小糸製作所 | 車輌用灯具 |
| JPH0395661U (enExample) * | 1990-01-12 | 1991-09-30 | ||
| JPH04174548A (ja) * | 1990-11-07 | 1992-06-22 | Nec Corp | リードフレーム |
| US5455454A (en) * | 1992-03-28 | 1995-10-03 | Samsung Electronics Co., Ltd. | Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture |
| EP0595021A1 (en) * | 1992-10-28 | 1994-05-04 | International Business Machines Corporation | Improved lead frame package for electronic devices |
| JPH06204390A (ja) * | 1993-01-07 | 1994-07-22 | Fujitsu Ltd | 半導体装置 |
| JPH06244352A (ja) * | 1993-02-19 | 1994-09-02 | Shinko Electric Ind Co Ltd | リードフレーム及び半導体装置の製造方法 |
| JP3082507B2 (ja) | 1993-04-07 | 2000-08-28 | 日産自動車株式会社 | 移動体の画像処理装置 |
| JP3013135B2 (ja) * | 1993-11-16 | 2000-02-28 | 株式会社三井ハイテック | 半導体装置用リードフレームの製造方法 |
| JP2972096B2 (ja) * | 1994-11-25 | 1999-11-08 | シャープ株式会社 | 樹脂封止型半導体装置 |
| JP2756436B2 (ja) * | 1995-12-28 | 1998-05-25 | 日立超エル・エス・アイ・エンジニアリング 株式会社 | 半導体装置およびその製造方法 |
| KR100203934B1 (ko) * | 1996-02-17 | 1999-06-15 | 윤종용 | 패턴닝된 리드프레임을 이용한 멀티 칩 패키지 |
| JP3078526B2 (ja) * | 1998-08-12 | 2000-08-21 | 宮崎沖電気株式会社 | 樹脂封止型半導体装置 |
| US6313527B1 (en) * | 1998-12-10 | 2001-11-06 | United Microelectronics Corp. | Dual-dies packaging structure and packaging method |
| JP3813788B2 (ja) * | 2000-04-14 | 2006-08-23 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
| US6552416B1 (en) * | 2000-09-08 | 2003-04-22 | Amkor Technology, Inc. | Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring |
| JP3082507U (ja) | 2001-06-07 | 2001-12-14 | 華東先進電子股▲分▼有限公司 | ダブルサイドチップパッケージ |
| JP3793752B2 (ja) * | 2002-12-16 | 2006-07-05 | 沖電気工業株式会社 | 半導体装置 |
| US7102209B1 (en) | 2003-08-27 | 2006-09-05 | National Semiconductor Corporation | Substrate for use in semiconductor manufacturing and method of making same |
| JP2005268533A (ja) * | 2004-03-18 | 2005-09-29 | Shinko Electric Ind Co Ltd | 積層型半導体装置 |
| JP4372022B2 (ja) * | 2004-04-27 | 2009-11-25 | 株式会社東芝 | 半導体装置 |
| US7348660B2 (en) * | 2005-07-29 | 2008-03-25 | Infineon Technologies Flash Gmbh & Co. Kg | Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package |
| JP4916745B2 (ja) * | 2006-03-28 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US8357566B2 (en) * | 2006-08-25 | 2013-01-22 | Micron Technology, Inc. | Pre-encapsulated lead frames for microelectronic device packages, and associated methods |
| US20090096073A1 (en) * | 2007-10-16 | 2009-04-16 | Kabushiki Kaisha Toshiba | Semiconductor device and lead frame used for the same |
| JP6164895B2 (ja) * | 2013-04-02 | 2017-07-19 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US9978675B2 (en) * | 2015-11-20 | 2018-05-22 | Canon Kabushiki Kaisha | Package, electronic component, and electronic apparatus |
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2008
- 2008-10-16 US US12/252,584 patent/US20090096073A1/en not_active Abandoned
- 2008-10-16 JP JP2008267102A patent/JP4970401B2/ja active Active
-
2011
- 2011-06-20 JP JP2011136497A patent/JP4970610B2/ja active Active
- 2011-07-06 US US13/177,257 patent/US8618643B2/en active Active
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2013
- 2013-11-21 US US14/086,253 patent/US9177900B2/en active Active
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2015
- 2015-10-05 US US14/875,287 patent/US9589870B2/en active Active
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2017
- 2017-02-09 US US15/428,801 patent/US10199300B2/en active Active
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2018
- 2018-12-31 US US16/236,824 patent/US10777479B2/en active Active
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2020
- 2020-08-25 US US17/002,238 patent/US11688659B2/en active Active