JP2006100636A5 - - Google Patents
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- Publication number
- JP2006100636A5 JP2006100636A5 JP2004285839A JP2004285839A JP2006100636A5 JP 2006100636 A5 JP2006100636 A5 JP 2006100636A5 JP 2004285839 A JP2004285839 A JP 2004285839A JP 2004285839 A JP2004285839 A JP 2004285839A JP 2006100636 A5 JP2006100636 A5 JP 2006100636A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- main surface
- semiconductor
- lead
- oite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 238000007789 sealing Methods 0.000 claims 4
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004285839A JP4525277B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体装置 |
| TW094128043A TWI431738B (zh) | 2004-09-30 | 2005-08-17 | 半導體裝置之製造方法 |
| CNB2005100986435A CN100446201C (zh) | 2004-09-30 | 2005-09-05 | 半导体器件 |
| US11/222,959 US7323366B2 (en) | 2004-09-30 | 2005-09-12 | Manufacturing method of a semiconductor device |
| KR1020050086272A KR101160694B1 (ko) | 2004-09-30 | 2005-09-15 | 반도체장치의 제조 방법 |
| US12/014,313 US7728412B2 (en) | 2004-09-30 | 2008-01-15 | Semiconductor device having plurality of leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004285839A JP4525277B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009274068A Division JP2010050491A (ja) | 2009-12-02 | 2009-12-02 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006100636A JP2006100636A (ja) | 2006-04-13 |
| JP2006100636A5 true JP2006100636A5 (enExample) | 2007-10-25 |
| JP4525277B2 JP4525277B2 (ja) | 2010-08-18 |
Family
ID=36145875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004285839A Expired - Lifetime JP4525277B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7323366B2 (enExample) |
| JP (1) | JP4525277B2 (enExample) |
| KR (1) | KR101160694B1 (enExample) |
| CN (1) | CN100446201C (enExample) |
| TW (1) | TWI431738B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7001798B2 (en) * | 2001-11-14 | 2006-02-21 | Oki Electric Industry Co., Ltd. | Method of manufacturing semiconductor device |
| US8344524B2 (en) * | 2006-03-07 | 2013-01-01 | Megica Corporation | Wire bonding method for preventing polymer cracking |
| MY144694A (en) * | 2006-06-22 | 2011-10-31 | Dainippon Printing Co Ltd | Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device |
| JP5499437B2 (ja) * | 2008-01-10 | 2014-05-21 | 株式会社デンソー | モールドパッケージ |
| US20090315159A1 (en) * | 2008-06-20 | 2009-12-24 | Donald Charles Abbott | Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same |
| CN101740528B (zh) * | 2008-11-12 | 2011-12-28 | 力成科技股份有限公司 | 增进散热的无外引脚式半导体封装构造及其组合 |
| US8080885B2 (en) * | 2008-11-19 | 2011-12-20 | Stats Chippac Ltd. | Integrated circuit packaging system with multi level contact and method of manufacture thereof |
| JP5157964B2 (ja) * | 2009-02-27 | 2013-03-06 | オムロン株式会社 | 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法 |
| JP5663214B2 (ja) * | 2009-07-03 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2011077277A (ja) * | 2009-09-30 | 2011-04-14 | Sanyo Electric Co Ltd | 半導体装置 |
| JP2012049421A (ja) * | 2010-08-30 | 2012-03-08 | Keihin Corp | 電子部品の実装構造 |
| CN102263079B (zh) * | 2011-07-18 | 2017-06-09 | 日月光半导体制造股份有限公司 | 半导体封装结构 |
| JP5966275B2 (ja) * | 2011-08-10 | 2016-08-10 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| KR101464605B1 (ko) * | 2012-12-07 | 2014-11-24 | 시그네틱스 주식회사 | 솔더 접합 능력을 향상하는 큐. 에프. 엔 반도체 패키지 및 그의 제조방법 |
| EP2854162B1 (en) * | 2013-09-26 | 2019-11-27 | Ampleon Netherlands B.V. | Semiconductor device leadframe |
| EP2854161B1 (en) | 2013-09-26 | 2019-12-04 | Ampleon Netherlands B.V. | Semiconductor device leadframe |
| JP6395045B2 (ja) * | 2014-11-18 | 2018-09-26 | 日亜化学工業株式会社 | 複合基板並びに発光装置及びその製造方法 |
| JP6608672B2 (ja) * | 2015-10-30 | 2019-11-20 | 新光電気工業株式会社 | 半導体装置及びその製造方法、リードフレーム及びその製造方法 |
| US11742265B2 (en) * | 2019-10-22 | 2023-08-29 | Texas Instruments Incorporated | Exposed heat-generating devices |
| CN114226185B (zh) * | 2022-02-17 | 2022-04-29 | 常州江苏大学工程技术研究院 | 一种基于物联网线路板的输送系统及其制造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6008068A (en) * | 1994-06-14 | 1999-12-28 | Dai Nippon Printing Co., Ltd. | Process for etching a semiconductor lead frame |
| CN1072393C (zh) * | 1997-02-05 | 2001-10-03 | 华通电脑股份有限公司 | 球阵式集成电路封装方法 |
| JP3405202B2 (ja) * | 1998-06-26 | 2003-05-12 | 松下電器産業株式会社 | リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法 |
| US6198171B1 (en) * | 1999-12-30 | 2001-03-06 | Siliconware Precision Industries Co., Ltd. | Thermally enhanced quad flat non-lead package of semiconductor |
| JP4349541B2 (ja) * | 2000-05-09 | 2009-10-21 | 大日本印刷株式会社 | 樹脂封止型半導体装置用フレーム |
| JP2002026198A (ja) * | 2000-07-04 | 2002-01-25 | Nec Corp | 半導体装置及びその製造方法 |
| JP4523138B2 (ja) * | 2000-10-06 | 2010-08-11 | ローム株式会社 | 半導体装置およびそれに用いるリードフレーム |
| CN1354526A (zh) * | 2000-11-21 | 2002-06-19 | 财团法人工业技术研究院 | 发光元件覆晶组装的方法及其结构 |
| KR100369393B1 (ko) * | 2001-03-27 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법 |
| US6882048B2 (en) * | 2001-03-30 | 2005-04-19 | Dainippon Printing Co., Ltd. | Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
| JP2002368176A (ja) * | 2001-06-11 | 2002-12-20 | Rohm Co Ltd | 半導体電子部品のリードフレーム |
| KR100445072B1 (ko) * | 2001-07-19 | 2004-08-21 | 삼성전자주식회사 | 리드 프레임을 이용한 범프 칩 캐리어 패키지 및 그의제조 방법 |
| JP3879452B2 (ja) * | 2001-07-23 | 2007-02-14 | 松下電器産業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
| EP1318544A1 (en) * | 2001-12-06 | 2003-06-11 | STMicroelectronics S.r.l. | Method for manufacturing semiconductor device packages |
-
2004
- 2004-09-30 JP JP2004285839A patent/JP4525277B2/ja not_active Expired - Lifetime
-
2005
- 2005-08-17 TW TW094128043A patent/TWI431738B/zh not_active IP Right Cessation
- 2005-09-05 CN CNB2005100986435A patent/CN100446201C/zh not_active Expired - Lifetime
- 2005-09-12 US US11/222,959 patent/US7323366B2/en not_active Expired - Lifetime
- 2005-09-15 KR KR1020050086272A patent/KR101160694B1/ko not_active Expired - Lifetime
-
2008
- 2008-01-15 US US12/014,313 patent/US7728412B2/en not_active Expired - Fee Related