KR101160694B1 - 반도체장치의 제조 방법 - Google Patents

반도체장치의 제조 방법 Download PDF

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Publication number
KR101160694B1
KR101160694B1 KR1020050086272A KR20050086272A KR101160694B1 KR 101160694 B1 KR101160694 B1 KR 101160694B1 KR 1020050086272 A KR1020050086272 A KR 1020050086272A KR 20050086272 A KR20050086272 A KR 20050086272A KR 101160694 B1 KR101160694 B1 KR 101160694B1
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South Korea
Prior art keywords
lead
main surface
semiconductor chip
wire
bonding
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KR1020050086272A
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Korean (ko)
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KR20060051340A (ko
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노리유키 다카하시
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르네사스 일렉트로닉스 가부시키가이샤
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020050086272A 2004-09-30 2005-09-15 반도체장치의 제조 방법 Expired - Lifetime KR101160694B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004285839A JP4525277B2 (ja) 2004-09-30 2004-09-30 半導体装置
JPJP-P-2004-00285839 2004-09-30

Publications (2)

Publication Number Publication Date
KR20060051340A KR20060051340A (ko) 2006-05-19
KR101160694B1 true KR101160694B1 (ko) 2012-06-28

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