CN100446201C - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN100446201C
CN100446201C CNB2005100986435A CN200510098643A CN100446201C CN 100446201 C CN100446201 C CN 100446201C CN B2005100986435 A CNB2005100986435 A CN B2005100986435A CN 200510098643 A CN200510098643 A CN 200510098643A CN 100446201 C CN100446201 C CN 100446201C
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CN
China
Prior art keywords
lead
bonding
semiconductor chip
wire
molded body
Prior art date
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Expired - Lifetime
Application number
CNB2005100986435A
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English (en)
Chinese (zh)
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CN1755907A (zh
Inventor
高桥典之
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Renesas Electronics Corp
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Renesas Technology Corp
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Publication of CN1755907A publication Critical patent/CN1755907A/zh
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Publication of CN100446201C publication Critical patent/CN100446201C/zh
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CNB2005100986435A 2004-09-30 2005-09-05 半导体器件 Expired - Lifetime CN100446201C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP285839/2004 2004-09-30
JP2004285839A JP4525277B2 (ja) 2004-09-30 2004-09-30 半導体装置

Publications (2)

Publication Number Publication Date
CN1755907A CN1755907A (zh) 2006-04-05
CN100446201C true CN100446201C (zh) 2008-12-24

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CNB2005100986435A Expired - Lifetime CN100446201C (zh) 2004-09-30 2005-09-05 半导体器件

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US (2) US7323366B2 (enExample)
JP (1) JP4525277B2 (enExample)
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JP4525277B2 (ja) 2010-08-18
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JP2006100636A (ja) 2006-04-13

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