TWI431738B - 半導體裝置之製造方法 - Google Patents

半導體裝置之製造方法 Download PDF

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Publication number
TWI431738B
TWI431738B TW094128043A TW94128043A TWI431738B TW I431738 B TWI431738 B TW I431738B TW 094128043 A TW094128043 A TW 094128043A TW 94128043 A TW94128043 A TW 94128043A TW I431738 B TWI431738 B TW I431738B
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TW
Taiwan
Prior art keywords
lead
main surface
semiconductor device
wire
wafer
Prior art date
Application number
TW094128043A
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English (en)
Chinese (zh)
Other versions
TW200614474A (en
Inventor
高橋典之
Original Assignee
瑞薩電子股份有限公司
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Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW200614474A publication Critical patent/TW200614474A/zh
Application granted granted Critical
Publication of TWI431738B publication Critical patent/TWI431738B/zh

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW094128043A 2004-09-30 2005-08-17 半導體裝置之製造方法 TWI431738B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004285839A JP4525277B2 (ja) 2004-09-30 2004-09-30 半導体装置

Publications (2)

Publication Number Publication Date
TW200614474A TW200614474A (en) 2006-05-01
TWI431738B true TWI431738B (zh) 2014-03-21

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US (2) US7323366B2 (enExample)
JP (1) JP4525277B2 (enExample)
KR (1) KR101160694B1 (enExample)
CN (1) CN100446201C (enExample)
TW (1) TWI431738B (enExample)

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