JP2007311749A5 - - Google Patents

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Publication number
JP2007311749A5
JP2007311749A5 JP2006342341A JP2006342341A JP2007311749A5 JP 2007311749 A5 JP2007311749 A5 JP 2007311749A5 JP 2006342341 A JP2006342341 A JP 2006342341A JP 2006342341 A JP2006342341 A JP 2006342341A JP 2007311749 A5 JP2007311749 A5 JP 2007311749A5
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JP
Japan
Prior art keywords
lead electrode
housing
wall portion
semiconductor device
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006342341A
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English (en)
Japanese (ja)
Other versions
JP4952233B2 (ja
JP2007311749A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006342341A external-priority patent/JP4952233B2/ja
Priority to JP2006342341A priority Critical patent/JP4952233B2/ja
Priority to CN2007100898344A priority patent/CN101060103B/zh
Priority to US11/785,380 priority patent/US7432589B2/en
Priority to KR1020070037869A priority patent/KR101048977B1/ko
Priority to EP07106416.6A priority patent/EP1848045B1/en
Publication of JP2007311749A publication Critical patent/JP2007311749A/ja
Publication of JP2007311749A5 publication Critical patent/JP2007311749A5/ja
Publication of JP4952233B2 publication Critical patent/JP4952233B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006342341A 2006-04-19 2006-12-20 半導体装置 Active JP4952233B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006342341A JP4952233B2 (ja) 2006-04-19 2006-12-20 半導体装置
CN2007100898344A CN101060103B (zh) 2006-04-19 2007-04-05 半导体装置
US11/785,380 US7432589B2 (en) 2006-04-19 2007-04-17 Semiconductor device
EP07106416.6A EP1848045B1 (en) 2006-04-19 2007-04-18 Housing for semiconductor light emitting or receiving device
KR1020070037869A KR101048977B1 (ko) 2006-04-19 2007-04-18 반도체 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006115771 2006-04-19
JP2006115771 2006-04-19
JP2006342341A JP4952233B2 (ja) 2006-04-19 2006-12-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2007311749A JP2007311749A (ja) 2007-11-29
JP2007311749A5 true JP2007311749A5 (enExample) 2010-01-14
JP4952233B2 JP4952233B2 (ja) 2012-06-13

Family

ID=38261537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006342341A Active JP4952233B2 (ja) 2006-04-19 2006-12-20 半導体装置

Country Status (5)

Country Link
US (1) US7432589B2 (enExample)
EP (1) EP1848045B1 (enExample)
JP (1) JP4952233B2 (enExample)
KR (1) KR101048977B1 (enExample)
CN (1) CN101060103B (enExample)

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US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
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KR102042150B1 (ko) * 2012-09-13 2019-11-07 엘지이노텍 주식회사 발광 소자 및 조명 시스템
US9748164B2 (en) * 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
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US10177292B2 (en) 2014-05-23 2019-01-08 Everlight Electronics Co., Ltd. Carrier, carrier leadframe, and light emitting device
JP6481349B2 (ja) 2014-12-02 2019-03-13 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法
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CN106571383B (zh) * 2015-10-08 2020-04-28 联华电子股份有限公司 半导体元件及其制作方法
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