USD641719S1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
USD641719S1
USD641719S1 US29/338,186 US33818609F USD641719S US D641719 S1 USD641719 S1 US D641719S1 US 33818609 F US33818609 F US 33818609F US D641719 S USD641719 S US D641719S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
view
design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/338,186
Inventor
Christopher P. Hussell
Ban P. Loh
Shuying Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/338,186 priority Critical patent/USD641719S1/en
Application filed by Cree Inc filed Critical Cree Inc
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUSSELL, CHRISTOPHER P., HUANG, SHUYING, LOH, BAN P.
Priority to US12/825,075 priority patent/US8598602B2/en
Priority to US29/380,549 priority patent/USD648687S1/en
Application granted granted Critical
Publication of USD641719S1 publication Critical patent/USD641719S1/en
Priority to US29/403,433 priority patent/USD661264S1/en
Priority to US14/094,341 priority patent/US9123874B2/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Description

FIG. 1 is a top perspective view of an LED showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a top end view thereof;
FIG. 4 is an opposing bottom end view thereof;
FIG. 5 is a bottom view thereof opposite the view of FIG. 2;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a back perspective view thereof.
The broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode, as shown and described.
US29/338,186 2009-01-12 2009-06-05 Light emitting diode Active USD641719S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/338,186 USD641719S1 (en) 2009-06-05 2009-06-05 Light emitting diode
US12/825,075 US8598602B2 (en) 2009-01-12 2010-06-28 Light emitting device packages with improved heat transfer
US29/380,549 USD648687S1 (en) 2009-06-05 2010-12-07 Light emitting device package
US29/403,433 USD661264S1 (en) 2009-06-05 2011-10-06 Light emiting device package
US14/094,341 US9123874B2 (en) 2009-01-12 2013-12-02 Light emitting device packages with improved heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/338,186 USD641719S1 (en) 2009-06-05 2009-06-05 Light emitting diode

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/360,791 Continuation-In-Part USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/353,652 Continuation-In-Part USD635527S1 (en) 2009-01-12 2010-01-12 Light emitting diode
US29/380,549 Continuation-In-Part USD648687S1 (en) 2009-06-05 2010-12-07 Light emitting device package

Publications (1)

Publication Number Publication Date
USD641719S1 true USD641719S1 (en) 2011-07-19

Family

ID=44262258

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/338,186 Active USD641719S1 (en) 2009-01-12 2009-06-05 Light emitting diode

Country Status (1)

Country Link
US (1) USD641719S1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Non-Patent Citations (24)

* Cited by examiner, † Cited by third party
Title
Chinese Certificate of Design Patent for CN 200930286397.5 dated Oct. 6, 2010.
Chinese Notice of Patent Grant for CN 200930286397.5 dated May 19, 2010.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Non-Final Office Action for U.S. Appl. No. 12/479,318 dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318 dated Nov. 10, 2010.
Notice of Allowance for U.S. Appl. No. 12/479,318 dated Feb. 17, 2011.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Aug. 24, 2010.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Nov. 26, 2010 and Supplemental Notice of Allowance for U.S. Appl. No. 29/353,652 dated Dec. 8, 2010.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Dec. 22, 2010.
Notice of Allowance for U.S. Appl. No. 29/365,939 dated Dec. 27, 2010.
Notice of Allowance from U.S. Appl. No. 29/330,657 dated Sep. 28, 2009.
Related CIP U.S. Appl. No. 12/969,267 filed Dec. 15, 2010 entitled "Solid State Lighting Devices and Methods" (Filed With Non-publication Request).
Related U.S. Des. Appl. No. 29/365,939 filed Jul. 16, 2010.
Supplemental Notice of Allowance for U.S. Appl. No. 29/360,791 dated Jan. 24, 2011.
U.S. Appl. No. 12/498,856.
U.S. Appl. No. 12/825,075 filed Jun. 28, 2010.
U.S. Appl. No. 12/853,812 filed Aug. 10, 2010.
U.S. Appl. No. 61/404,985 filed Oct. 13, 2010.
U.S. Des. Appl. No. 12/479,318 filed Jun. 5, 2009.
U.S. Des. Appl. No. 29/330,657 filed Jan. 12, 2009.
U.S. Des. Appl. No. 29/353,652 filed Mar. 2, 2010.
U.S. Des. Appl. No. 29/360,791 filed Apr. 30, 2010.

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components

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