USD643819S1 - Package for light emitting diode (LED) lighting - Google Patents

Package for light emitting diode (LED) lighting Download PDF

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Publication number
USD643819S1
USD643819S1 US29365939 US36593910F USD643819S US D643819 S1 USD643819 S1 US D643819S1 US 29365939 US29365939 US 29365939 US 36593910 F US36593910 F US 36593910F US D643819 S USD643819 S US D643819S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
package
led
lighting
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29365939
Inventor
Sung Chul Joo
Christopher P. Hussell
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Cree Inc
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Cree Inc
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Filing date
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a top perspective view of a package for light emitting diode (LED) lighting showing our design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a first side view thereof, the opposing side being a mirror image of that shown;

FIG. 4 is a second side view thereof, the opposing side being a mirror image of that shown;

FIG. 5 is a bottom plan view thereof opposite the view of FIG. 2;

FIG. 6 is a first side view thereof, the opposing side being a mirror image of that shown;

FIG. 7 is a second side view thereof, the opposing side being a mirror image of that shown; and,

FIG. 8 is a bottom perspective view thereof.

The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
US29365939 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting Active USD643819S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29365939 USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29365939 USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29397017 USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29432988 USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29397017 Division USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting

Publications (1)

Publication Number Publication Date
USD643819S1 true USD643819S1 (en) 2011-08-23

Family

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Family Applications (3)

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US29365939 Active USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29397017 Active USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29432988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Family Applications After (2)

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US29397017 Active USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29432988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

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US (3) USD643819S1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) * 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
USD731214S1 (en) * 2014-01-15 2015-06-09 Winston Products Llc Merchandising containers for vehicle lights
USD731826S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD731825S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
WO2012116470A1 (en) 2011-03-02 2012-09-07 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
USD738027S1 (en) * 2013-11-18 2015-09-01 Koninklijke Philips N.V. Illuminated OLED panel
USD796076S1 (en) 2014-12-22 2017-08-29 Lunera Lighting Inc. Horizontal LED lamp
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679118A (en) 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
WO1995028740A1 (en) 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
JP3255646B2 (en) 1997-02-10 2002-02-12 松下電器産業株式会社 Method for manufacturing a resin-sealed semiconductor device
DE19755734A1 (en) 1997-12-15 1999-06-24 Siemens Ag A method for producing a surface-mountable optoelectronic component
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6877780B2 (en) 2000-06-23 2005-04-12 Breeze-Torca Products, Llc Clamp for joining tubular bodies
JP3718131B2 (en) * 2001-03-16 2005-11-16 松下電器産業株式会社 RF module and manufacturing method thereof
DE10117889A1 (en) 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6936855B1 (en) 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
JP4211359B2 (en) 2002-03-06 2009-01-21 日亜化学工業株式会社 A method of manufacturing a semiconductor device
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US7335925B2 (en) 2003-03-14 2008-02-26 Sumitomo Electric Industries, Ltd. Semiconductor device
JP4645071B2 (en) 2003-06-20 2011-03-09 日亜化学工業株式会社 Molded package and a semiconductor device using the same
USD511330S1 (en) * 2003-07-09 2005-11-08 Nichia Corporation Light emitting diode
WO2005020338A1 (en) * 2003-08-26 2005-03-03 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
EP1825524A4 (en) 2004-12-16 2010-06-16 Seoul Semiconductor Co Ltd Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
US7224047B2 (en) 2004-12-18 2007-05-29 Lsi Corporation Semiconductor device package with reduced leakage
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US7777247B2 (en) 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
EP2280430A3 (en) 2005-03-11 2012-08-29 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US7550319B2 (en) 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
JP2007073836A (en) 2005-09-08 2007-03-22 Sharp Corp Optical coupling device, manufacturing method thereof, and electronic apparatus having the same
KR100616695B1 (en) 2005-10-04 2006-08-21 삼성전기주식회사 High power light emitting diode package
KR101241650B1 (en) 2005-10-19 2013-03-08 엘지이노텍 주식회사 Package of light emitting diode
US7943946B2 (en) 2005-11-21 2011-05-17 Sharp Kabushiki Kaisha Light emitting device
KR100780176B1 (en) 2005-11-25 2007-11-27 삼성전기주식회사 Side-view light emitting diode package
USD573113S1 (en) 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
US7400049B2 (en) 2006-02-16 2008-07-15 Stats Chippac Ltd. Integrated circuit package system with heat sink
JP4952233B2 (en) 2006-04-19 2012-06-13 日亜化学工業株式会社 Semiconductor device
JP4830768B2 (en) 2006-05-10 2011-12-07 日亜化学工業株式会社 The method of manufacturing a semiconductor light emitting device and a semiconductor light emitting device
KR100904152B1 (en) 2006-06-30 2009-06-25 서울반도체 주식회사 Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
KR100854328B1 (en) 2006-07-07 2008-08-28 엘지이노텍 주식회사 LED package and method for making the same
USD566055S1 (en) 2006-09-21 2008-04-08 Lg Innotek Co., Ltd. Light-emitting diode (LED)
US7852015B1 (en) 2006-10-11 2010-12-14 SemiLEDs Optoelectronics Co., Ltd. Solid state lighting system and maintenance method therein
USD580375S1 (en) 2006-10-12 2008-11-11 Semi-Photonics Co., Ltd. Lead frame for a two-pin light emitting diode device
USD594827S1 (en) 2006-12-07 2009-06-23 Cree, Inc. Lamp package
JP2008172125A (en) * 2007-01-15 2008-07-24 Citizen Electronics Co Ltd Chip type led light-emitting device and its manufacturing method
KR100901618B1 (en) 2007-04-19 2009-06-08 엘지이노텍 주식회사 Light emitting diode package and manufacturing method thereof
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
USD573114S1 (en) 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
RU2490540C2 (en) 2007-05-07 2013-08-20 Конинклейке Филипс Электроникс Нв Led-based lighting fixture purposed for surface illumination with improved heat dissipation and fabricability
JP4341693B2 (en) 2007-05-16 2009-10-07 ウシオ電機株式会社 Led device and manufacturing method thereof
US8436371B2 (en) 2007-05-24 2013-05-07 Cree, Inc. Microscale optoelectronic device packages
US7566159B2 (en) 2007-05-31 2009-07-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Side-emitting LED package with improved heat dissipation
US20090008662A1 (en) 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
US8354992B2 (en) 2007-07-13 2013-01-15 Tte Indianapolis Appearance improvement for zone backlit LCD displays
USD580891S1 (en) 2007-07-20 2008-11-18 Alti-Electronics Co. Ltd. Light emitting diode
US9090750B2 (en) 2007-07-23 2015-07-28 Dsm Ip Assets B.V. Plastic component for a lighting systems
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
EP2207993A4 (en) 2007-11-08 2013-09-04 Innovations In Optics Inc Led illumination system
USD597971S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD597968S1 (en) 2008-03-13 2009-08-11 Rohm Co., Ltd. Light emitting diode module
USD608307S1 (en) 2008-08-28 2010-01-19 Cree, Inc. Light emitting diode
USD621798S1 (en) * 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
US20100059783A1 (en) 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
USD595675S1 (en) 2008-09-24 2009-07-07 Harvatek Corporation Light emitting diode
KR101533817B1 (en) 2008-12-31 2015-07-09 서울바이오시스 주식회사 A light emitting device having a plurality of non-polar light-emitting cell and a method for producing it,
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8598602B2 (en) * 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
USD621799S1 (en) 2009-01-12 2010-08-17 Cree, Inc. Light emitting diode
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100181582A1 (en) 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
CN101510581B (en) 2009-03-19 2011-06-29 光宝科技股份有限公司 LED and relevant backlight module
CN103945589B (en) 2009-05-28 2016-12-07 Lynk实验室公司 Multi-voltage and luminance led lighting device and a multi-methods of use thereof
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
USD641719S1 (en) 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US8476812B2 (en) 2009-07-07 2013-07-02 Cree, Inc. Solid state lighting device with improved heatsink
US7932532B2 (en) 2009-08-04 2011-04-26 Cree, Inc. Solid state lighting device with improved heatsink
USD634716S1 (en) 2009-08-06 2011-03-22 Toshiba Lighting & Technology Corporation Light emitting diode illumination device
KR101114150B1 (en) 2009-10-19 2012-03-09 엘지이노텍 주식회사 Lighting Device
USD632659S1 (en) 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD622680S1 (en) 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
USD634284S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634286S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634285S1 (en) 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD632267S1 (en) 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
USD658599S1 (en) 2010-03-26 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD648686S1 (en) 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD628541S1 (en) 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
USD643819S1 (en) * 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
CN103348496A (en) 2011-02-07 2013-10-09 克利公司 Components and methods for light emitting diode (LED) lighting

Non-Patent Citations (24)

* Cited by examiner, † Cited by third party
Title
Co-pending U.S. Appl. No. 12/498,856, filed Jul. 7, 2009.
Description Model No. NS6G083 issued by Nichia Corporation—at least as early as Aug. 31, 2007.
Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007.
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379.
Non-Final Office Action for U.S. Appl. No. 12/479,318 dated Jun. 2, 2010.
Non-final Office Action for U.S. Appl. No. 12/479,318 dated Nov. 10, 2010.
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011.
Notice of Allowance for U.S. Appl. No. 12/479,318 dated Feb. 17, 2011.
Notice of Allowance for U.S. Appl. No. 29/338,186 dated Mar. 10, 2011.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Aug. 24, 2010.
Notice of Allowance for U.S. Appl. No. 29/353,652 dated Nov. 26, 2010.
Notice of Allowance for U.S. Appl. No. 29/360,791 dated Dec. 22, 2010.
Notice of Allowance from U.S. Appl. No. 29/330,657 dated Sep. 25, 2009.
Notice of Allowance from U.S. Appl. No. 29/338,186 dated Apr. 16, 2010.
Related CIP U.S. Appl. No. 12/969,267, filed Dec. 15, 2010 (Filed With Non-Publication Request).
Related U.S. Appl. No. 29/382,394, filed Jan. 3, 2011.
Supplemental Notice of Allowance for U.S. Appl. No. 29/353,652 dated Dec. 8, 2010.
Supplemental Notice of Allowance for U.S. Appl. No. 29/360,791 dated Jan. 24, 2011.
U.S. Appl. No. 12/853,812, filed Aug. 10, 2010.
U.S. Appl. No. 13/011,609, filed Jan. 21, 2011.
U.S. Appl. No. 29/338,186, filed Jun. 5, 2009.
U.S. Appl. No. 29/353,652, filed Jan. 12, 2010.
U.S. Appl. No. 29/360,791, filed Apr. 30, 2010.
U.S. Appl. No. 61/404,985, filed Oct. 13, 2010.

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* Cited by examiner, † Cited by third party
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US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) * 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
USD731214S1 (en) * 2014-01-15 2015-06-09 Winston Products Llc Merchandising containers for vehicle lights
USD731825S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD731826S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component

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