USD643819S1 - Package for light emitting diode (LED) lighting - Google Patents
Package for light emitting diode (LED) lighting Download PDFInfo
- Publication number
- USD643819S1 USD643819S1 US29/365,939 US36593910F USD643819S US D643819 S1 USD643819 S1 US D643819S1 US 36593910 F US36593910 F US 36593910F US D643819 S USD643819 S US D643819S
- Authority
- US
- United States
- Prior art keywords
- package
- led
- lighting
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Description
The broken lines are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/365,939 USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/365,939 USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/397,017 Division USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
Publications (1)
Publication Number | Publication Date |
---|---|
USD643819S1 true USD643819S1 (en) | 2011-08-23 |
Family
ID=44455808
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Active USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 Active USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 Active USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/397,017 Active USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 Active USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Country Status (1)
Country | Link |
---|---|
US (3) | USD643819S1 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110031865A1 (en) * | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
US20110180827A1 (en) * | 2009-06-05 | 2011-07-28 | Hussell Christopher P | Solid state lighting device |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD667801S1 (en) * | 2010-07-16 | 2012-09-25 | Cree, Inc. | Package for light emitting diode (LED) lighting |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
USD731214S1 (en) * | 2014-01-15 | 2015-06-09 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731826S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731825S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
US9691949B2 (en) | 2014-05-30 | 2017-06-27 | Cree, Inc. | Submount based light emitter components and methods |
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US10957736B2 (en) | 2018-03-12 | 2021-03-23 | Cree, Inc. | Light emitting diode (LED) components and methods |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Families Citing this family (7)
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US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
CN102934228B (en) | 2011-03-02 | 2017-09-01 | 惠州科锐半导体照明有限公司 | Light emission diode package member and light emitting diode |
USD738027S1 (en) * | 2013-11-18 | 2015-09-01 | Koninklijke Philips N.V. | Illuminated OLED panel |
USD796076S1 (en) | 2014-12-22 | 2017-08-29 | Lunera Lighting Inc. | Horizontal LED lamp |
USD782989S1 (en) * | 2015-05-15 | 2017-04-04 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD777694S1 (en) * | 2015-05-15 | 2017-01-31 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US10576557B2 (en) | 2017-11-17 | 2020-03-03 | Greenlee Tools, Inc. | Workpiece shearing apparatus |
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