USD632659S1 - Light emitting diode lamp - Google Patents

Light emitting diode lamp Download PDF

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Publication number
USD632659S1
USD632659S1 US29/361,334 US36133410F USD632659S US D632659 S1 USD632659 S1 US D632659S1 US 36133410 F US36133410 F US 36133410F US D632659 S USD632659 S US D632659S
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US
United States
Prior art keywords
light emitting
emitting diode
diode lamp
lamp
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/361,334
Inventor
Chung-Chuan Hsieh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics Co Ltd
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Assigned to EVERLIGHT ELECTRONICS CO., LTD. reassignment EVERLIGHT ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSIEH, CHUNG-CHUAN
Application granted granted Critical
Publication of USD632659S1 publication Critical patent/USD632659S1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

FIG. 1 is a perspective view showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross-sectional view thereof, taken on line A—A of FIG. 5.
The rear elevational view thereof is a mirror image of the front elevational view in FIG. 2 and therefore is omitted.

Claims (1)

  1. The ornamental design for a light emitting diode lamp, as shown and described.
US29/361,334 2009-11-11 2010-05-10 Light emitting diode lamp Active USD632659S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW98305365 2009-11-11
TW98305365 2009-11-11

Publications (1)

Publication Number Publication Date
USD632659S1 true USD632659S1 (en) 2011-02-15

Family

ID=43570807

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/361,334 Active USD632659S1 (en) 2009-11-11 2010-05-10 Light emitting diode lamp

Country Status (1)

Country Link
US (1) USD632659S1 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US20140070259A1 (en) * 2012-09-13 2014-03-13 Yeo Chan Yoon Light emitting device and lighting system having the same
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
USD762183S1 (en) * 2015-04-24 2016-07-26 Lg Electronics Inc. LED package body
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
TWD193476S (en) 2017-12-05 2018-10-11 大陸商博羅承創精密工業有限公司 LED bracket
USD845918S1 (en) * 2016-04-18 2019-04-16 Citizen Electronics Co., Ltd. Light emitting diode
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US20160197254A1 (en) * 2012-09-13 2016-07-07 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
CN103682068A (en) * 2012-09-13 2014-03-26 Lg伊诺特有限公司 Light emitting device
US9620693B2 (en) * 2012-09-13 2017-04-11 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
US9318675B2 (en) * 2012-09-13 2016-04-19 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
CN103682068B (en) * 2012-09-13 2018-01-30 Lg伊诺特有限公司 Light-emitting device
US20140070259A1 (en) * 2012-09-13 2014-03-13 Yeo Chan Yoon Light emitting device and lighting system having the same
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
USD762183S1 (en) * 2015-04-24 2016-07-26 Lg Electronics Inc. LED package body
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
USD845918S1 (en) * 2016-04-18 2019-04-16 Citizen Electronics Co., Ltd. Light emitting diode
TWD193476S (en) 2017-12-05 2018-10-11 大陸商博羅承創精密工業有限公司 LED bracket
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods

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